Abstract: A polishing apparatus has a conventional carrier with a plurality of floating subcarriers. The benefits of single wafer polishing are achieved with the economies of multiple wafer polishing by adding the plurality of floating subcarriers to the conventional carrier. Each subcarrier has a single wafer adhered to its underside. Axial freedom is provided to duplicate the dynamics of single wafer polishing. The required axial freedom is obtained by axially loading each subcarrier via a mechanical spring or via pneumatic/hydraulic devices. In two variations, each subcarrier is also allowed auto-rotational freedom. In another two variations, the subcarriers are rotationally driven. In all variations, the wafers adhered to the floating subcarriers are substantially uniformly polished and the total indicated reading of the maximum deviation on the wafer surface is improved.

Abstract: Several embodiments of a replenishment arrangement for furnishing molten semiconductor material to furnaces for growing monocrystalline boules are described. A replenishment crucible within which a melt of the material from which the boules are to be grown is communicated either intermittently or continuously with a plurality of growth furnaces.

Abstract: A crystal growing furnace is provided wherein the molten material in the crucible is replaced constantly as it is withdrawn by a monitoring system which automatically maintains the level in the crucible at a desired point. A replaceable cannister system is also provided so that the level can be maintained indefinitely by replacing the cannisters.