Abstract: Cooled electronic systems and cooling methods are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the electronic system. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into, for instance, one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink is configured and disposed to physically couple to the enclosure and facilitates rejection of heat from the fluid disposed within the compartment when the field-replaceable bank of electronic components is operatively inserted into the electronic system.

Abstract: A cooled electronic system and cooling method are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the enclosure. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink facilitates rejection of heat from the fluid disposed within the compartment. In one embodiment, multiple thermal conductors project from an inner surface of the enclosure into the compartment to facilitate transfer of heat from the fluid to the heat sink.

Abstract: A cooling method is provided which includes providing a cooling apparatus that includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections. One coolant conduit couples in fluid communication a respective rotatable manifold section and the coolant-carrying channel(s) of a respective coolant-cooled structure. The respective rotatable manifold section is rotatable relative to another portion of the coolant manifold to facilitate detaching of the coolant-cooled structure from its associated electronic component while maintaining the coolant-cooled structure in fluid communication with the respective rotatable manifold section through the one coolant conduit, which in one embodiment, is a substantially rigid coolant conduit.

Abstract: A method is provided for facilitating cooling of electronic components of an electronic system. The method includes: providing a housing at least partially surrounding and forming a compartment about the components, and providing an immersion-cooling fluid is disposed within the compartment, at least one component of the electronic system being at least partially non-immersed within the fluid in the compartment; providing a wicking film element physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment; and securing, via a coupling element, the wicking film element in physical coupling to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component.

Abstract: A method of fabricating a cooling unit is provided to facilitate cooling coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure.

Abstract: Monitoring of cooling of an electronic component is provided, which includes: determining a current thermal resistance associated with one or more of the electronic component, a heat sink coupled to the electronic component, or a thermal interface coupling the electronic component and the heat sink; and determining, by a processor, whether the current thermal resistance exceeds a set thermal resistance threshold, and responsive to the current thermal resistance exceeding the set thermal resistance threshold, indicating a thermal resistance fault. As an enhancement, rate of change over time of the thermal resistance is determined, and compared against a rate of change threshold, and if exceeding the threshold, a rate of change thermal resistance warning is provided.

Abstract: Apparatuses are provided for cooling an electronic component(s), which include a heat sink coupled to the electronic component(s), and having a coolant-carrying channel for a first coolant. The first coolant provides two-phase cooling to the electronic component(s), and is discharged from the heat sink as coolant exhaust, which includes coolant vapor. The apparatus further includes a node-level condensation module coupled to the heat sink to receive the coolant exhaust. The condensation module is cooled via a second coolant, and facilitates condensing the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module. A control valve adjusts a flow rate of the second coolant of the node-level condensation module, with the valve being automatically controlled by the controller based on a characterization of the coolant vapor in the coolant exhaust.

Abstract: A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

Abstract: A cooling apparatus and method are provided for cooling an electronics rack. The cooling apparatus includes an air-cooled cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronics rack, and includes a liquid-cooled condenser facilitating immersion-cooling of electronic components of the electronics rack, a liquid-cooled structure providing conductive cooling to electronic components of the electronics rack, or an air-to-liquid heat exchanger associated with the rack and cooling airflow passing through the electronics rack. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger. In operation, heat is transferred via circulating coolant from the electronics rack, and rejected in the liquid-to-air heat exchanger of the cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

Abstract: Cooling apparatuses and methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling apparatus includes a housing forming a compartment about one or more components, a supply manifold, a return manifold, and a coolant loop coupling in fluid communication the supply and return manifolds and the housing. Coolant flowing through the coolant loop flows through the compartment of the housing and at least partially immersion-cools the component(s) by flow boiling. A pump facilitates circulation of coolant within the loop, and a coolant bypass line is coupled between the supply and return manifolds. The return manifold includes a mixed-phase manifold section, and the bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section. Coolant flows from the coolant bypass line into the mixed-phase manifold section in a direction counter to the direction of any coolant vapor flow within that manifold section.

Abstract: Cooling methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling method includes: providing a housing forming a compartment about one or more components, and providing a supply manifold, a return manifold, and coupling a coolant loop coupling in fluid communication the supply and return manifolds and the housing. Coolant flowing through the coolant loop flows through the compartment of the housing and, at least partially, immersion-cools the component(s) by flow boiling. A pump facilitates circulation of coolant within the loop, and a coolant bypass line is coupled between the supply and return manifolds. The return manifold includes a mixed-phase manifold section, and the bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section. Coolant flows from the coolant bypass line into the mixed-phase manifold section in a direction counter to the direction of any coolant vapor flow within that manifold section.

Abstract: Apparatus and method are provided for cooling an electronic component. The apparatus includes a coolant-cooled structure in thermal communication with the component(s) to be cooled, and a coolant-to-refrigerant heat exchanger coupled in fluid communication with the coolant-cooled structure via a coolant loop to receive coolant from and supply coolant to the coolant-cooled structure. The apparatus further includes a refrigerant loop coupled in fluid communication with the coolant-to-refrigerant heat exchanger, and the heat exchanger cools coolant passing therethrough by dissipating heat from the coolant in the coolant loop to refrigerant in the refrigerant loop. A controllable coolant heater is associated with the coolant loop for providing an adjustable heat load on the coolant in the coolant loop to ensure at least a minimum heat load is dissipated from the coolant to the refrigerant passing through the heat exchanger.

Abstract: A cooling apparatus and method are provided for cooling an electronic subsystem of an electronics rack. The cooling apparatus includes a local cooling station, which has a liquid-to-air heat exchanger and ducting for directing a cooling airflow across the heat exchanger. A cooling subsystem is associated with the electronic subsystem of the rack, and includes either a housing facilitating immersion cooling of electronic components of the electronic subsystem, or one or more liquid-cooled structures providing conductive cooling to the electronic components of the electronic subsystem. A coolant loop couples the cooling subsystem to the liquid-to-air heat exchanger of the local cooling station. In operation, heat is transferred via circulating coolant from the electronic subsystem and rejected in the liquid-to-air heat exchanger of the local cooling station to the cooling airflow passing across the liquid-to-air heat exchanger. In one embodiment, the cooling airflow is outdoor air.

Abstract: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment.

Abstract: Cooling apparatus and methods are provided for partial immersion-cooling of multiple electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and a fluid disposed within the compartment. First and second electronic components are at least partially non-immersed within the fluid, with the first component being a different type of electronic component with different configuration than the second component. A vapor condenser is provided with a vapor-condensing surface disposed within the compartment for condensing fluid vapor, and a condensate redirect structure is disposed within the compartment between the vapor condenser and the first and second components. The redirect structure is differently configured over the first electronic component compared with over the second electronic component, and provides a different pattern of condensate drip over the first component compared with over the second component.

Abstract: Methods of facilitating cooling an electronic system are provided, which include: providing a heat sink(s) configured to cool an electronic component(s), the heat sink(s) including a coolant-carrying channel for a first coolant, the first coolant providing two-phase cooling to the electronic component(s) and being discharged from the heat sink(s) as coolant exhaust with coolant vapor; providing a node-level condensation module coupled in fluid communication with the heat sink(s), the condensation module receiving first coolant exhaust from the heat sink(s) and being liquid-cooled via a second coolant to condense coolant vapor before return to a rack-level return manifold; automatically controlling at least one of liquid-cooling of the heat sink(s), or liquid-cooling of the condensation module(s); and providing a control valve for adjusting flow rate of the second coolant to the condensation module(s), the control valve being automatically controlled based on a characterization of the coolant vapor in the cool

Abstract: A cooled electronic system and cooling method are provided, where an electronics board having a plurality of electronic components mounted to the board is cooled by an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component.

Abstract: A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.

Abstract: Cooling apparatuses and methods are provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The cooling apparatus includes a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.

Abstract: A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.