Patents by Inventor Robert Edward Silhavy

Robert Edward Silhavy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fluxless solder attachment of a microelectronic chip to a substrate
    Patent number: 6375060
    Abstract: A chip bonding location of a microelectronic chip is joined to a substrate bonding location of a substrate using a metallic solder in the absence of a flux. Surface contamination and oxide are first removed from the chip bonding location and from the substrate bonding location. The joining is accomplished by positioning the microelectronic chip and the substrate in a facing contact with the chip bonding location and the substrate bonding location in registry in a contact region. A heating element is disposed adjacent to and below the chip bonding location and the substrate bonding location to form an assembly. There is no flux present in the assembly in the contact region. The assembly is placed into an oven having a non-oxidizing environment.
    Type: Grant
    Filed: July 19, 2000
    Date of Patent: April 23, 2002
    Assignee: The Boeing Company
    Inventor: Robert Edward Silhavy