Abstract: A speaker can have a main body with a generally spheroidal shape, which can be supported standing on its end. The speaker can include a subwoofer that faces forward. A plurality of mid-range drivers can be distributed around the sub-woofer, facing generally forward and radially outward. A plurality of tweeters can be distributed around the sub-woofer, facing generally forward and generally outward. The outer housing portion of the speaker can be covered with a fabric material. A user interface ring 162 can be touch sensitive to receive input, and can have a plurality of lights that can be illuminated separately to convey information to the user.

Abstract: Disclosed herein are display systems comprising light-emitting, diodes (LEDs), suitably blue light LEDs, which demonstrate increased optical power output. In embodiments, the display systems include compositions comprising phosphors, including luminescent nanocrystals.

Abstract: Disclosed herein are display systems comprising light-emitting, diodes (LEDs), suitably blue light LEDs, which demonstrate increased optical power output. In embodiments, the display systems include compositions comprising phosphors, including luminescent nanocrystals.

Abstract: Disclosed teem are display systems comprising light-emitting, diodes (LEDs), suitably blue light LEDs, which demonstrate increased optical power output. In embodiments, the display systems include compositions comprising phosphors, including luminescent nanocrystals.

Abstract: An optoelectronic assembly includes an optical lens element (OLE) coupled to a substrate. The substrate includes a transducer, a standing structure on the transducer, a transducer lens supported by the standing structure over the transducer, and alignment features. The OLE includes an OLE lens and co-alignment features that couple with the alignment features on the optoelectronic assembly. When the substrate is coupled to the OLE, the transducer lens is aligned with the OLE lens.

Abstract: A method for forming device packages includes forming a perimeter with a reactive foil and a bonding material interposed between a first wafer and a second wafer, pressing the first and the second wafers against the reactive foil and the bonding material, initiating the reactive foil, wherein the reactive foil heats the bonding material to create a bond between the first and the second wafers, and singulating the first and the second wafers into the device packages.

Abstract: A method for forming device packages includes forming a perimeter comprising a reactive foil and a bonding material interposed between a first wafer and a second wafer, pressing the first and the second wafers against the reactive foil and the bonding material, initiating the reactive foil, wherein the reactive foil heating the bonding material to create a bond between the first and the second wafers, and singulating the first and the second wafers into the device packages.

Abstract: An optical apparatus and method for coupling output light from a light source to an optical waveguide utilizes an optical turning element with integrated lenses to reduce the difficulty of precisely aligning multiple components of the optical apparatus.

Abstract: A sandal sock including a first covering shaped to fit on a second covering, with the first covering attachable to the second covering in such a manner that the first covering is removable, and with the second covering attachable to the sandal in a manner more secure than the first covering is attachable to the second covering. When a person wears the sandal with the first covering and the second covering attached, at least a portion of the first covering is disposed between the sandal and the person's foot.

Abstract: A method for forming device packages includes forming a perimeter comprising a reactive foil and a bonding material interposed between a first wafer and a second wafer, pressing the first and the second wafers against the reactive foil and the bonding material, initiating the reactive foil, wherein the reactive foil heating the bonding material to create a bond between the first and the second wafers, and singulating the first and the second wafers into the device packages.

Abstract: A method for forming device packages includes forming a perimeter comprising a reactive foil and a bonding material interposed between a first wafer and a second wafer, pressing the first and the second wafers against the reactive foil and the bonding material, initiating the reactive foil, wherein the reactive foil heating the bonding material to create a bond between the first and the second wafers, and singulating the first and the second wafers into the device packages.

Abstract: An optical apparatus and method for coupling output light from a light source to an optical waveguide utilizes an optical turning element with integrated lenses to reduce the difficulty of precisely aligning multiple components of the optical apparatus.