Patents by Inventor Robert F. Florence, Jr.

Robert F. Florence, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8960451
    Abstract: An apparatus includes a large server storage frame including a base, a ceiling and supports that are supportive of the ceiling above the base and separable from one another by a variable distance, first and second brackets disposable at variable vertical positions along first and second ones of the supports, respectively, and a turnbuckle assembly including an extendible member and first and second connectors connected to first and second ends of the extendible member, respectively. The first and second connectors are rotatably connectable to the first and second brackets, respectively, and the extendible member is extendible such that the first and second connectors reach the first and second brackets with the first and second brackets respectively disposed at the variable vertical positions.
    Type: Grant
    Filed: July 13, 2012
    Date of Patent: February 24, 2015
    Assignee: International Business Machines Corporation
    Inventors: Robert F. Florence, Jr., Steven C. McIntosh, Budy D. Notohardjono
  • Patent number: 8672688
    Abstract: An electrical interconnect is provided for use within, for example, a land grid array (LGA) interposer such as a module-to-board connector. The electrical interconnect includes an electrically-conductive, compressible conductor which has a first conductor end portion and a second conductor end portion. The first and second conductor end portions physically contact in slidable relation each other with compression of the compressible conductor to facilitate inhibiting rotation of the compressible conductor. In one embodiment, the first end portion includes at least one first leg and the second end portion includes at least two second legs, and the at least one first leg and at least two second legs are interdigitated. Further, in one embodiment, the first end portion and the second end portion are each in slidable contact with an inner-facing surface of the compressible conductor.
    Type: Grant
    Filed: January 17, 2012
    Date of Patent: March 18, 2014
    Assignee: International Business Machines Corporation
    Inventors: Robert F. Florence, Jr., Emanuele F. Lopergolo, Prabjit Singh
  • Publication number: 20140014599
    Abstract: An apparatus includes a large server storage frame including a base, a ceiling and supports that are supportive of the ceiling above the base and separable from one another by a variable distance, first and second brackets disposable at variable vertical positions along first and second ones of the supports, respectively, and a turnbuckle assembly including an extendible member and first and second connectors connected to first and second ends of the extendible member, respectively. The first and second connectors are rotatably connectable to the first and second brackets, respectively, and the extendible member is extendible such that the first and second connectors reach the first and second brackets with the first and second brackets respectively disposed at the variable vertical positions.
    Type: Application
    Filed: July 13, 2012
    Publication date: January 16, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Robert F. Florence, JR., Steven C. McIntosh, Budy D. Notohardjono
  • Publication number: 20130183872
    Abstract: An electrical interconnect is provided for use within, for example, a land grid array (LGA) interposer such as a module-to-board connector. The electrical interconnect includes an electrically-conductive, compressible conductor which has a first conductor end portion and a second conductor end portion. The first and second conductor end portions physically contact in slidable relation each other with compression of the compressible conductor to facilitate inhibiting rotation of the compressible conductor. In one embodiment, the first end portion includes at least one first leg and the second end portion includes at least two second legs, and the at least one first leg and at least two second legs are interdigitated. Further, in one embodiment, the first end portion and the second end portion are each in slidable contact with an inner-facing surface of the compressible conductor.
    Type: Application
    Filed: January 17, 2012
    Publication date: July 18, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Robert F. FLORENCE, JR., Emanuele F. LOPERGOLO, Prabjit SINGH
  • Patent number: 7520753
    Abstract: A method of using a coil contact as an electrical interconnect includes inserting at least one coil contact into a dielectric plate or housing. The at least one coil contact includes a beryllium copper coil plated with gold and having a tapered shape such that each end has a diameter smaller than the diameter of a middle section. The housing comprises an upper half comprising a surface that slopes outwardly from a center of the housing towards a top opening, and a lower half comprising a surface that slopes outwardly from the center of the housing to a bottom opening. The sloping surfaces of the upper half and the lower half form a concave shape that captivates the middle section of the coil contact. Each end of the at least one coil contact extends to account for variations in surfaces of the processor and the circuit board.
    Type: Grant
    Filed: March 31, 2008
    Date of Patent: April 21, 2009
    Assignee: International Business Machines Corporation
    Inventors: Vincent P. Mulligan, Robert F. Florence, Jr., Michael J. Domitrovits, Tak O. Leung
  • Patent number: 7218129
    Abstract: A system, apparatus and method for controlling temperature of an integrated circuit in a chip tester is disclosed. Embodiments include supplying a chilled fluid to a cold plate at a first flowrate, where the first flowrate is associated with a first valve setting based on at least a desired temperature setpoint and an applied power. Embodiments may determine a change in applied power and modify the chilled fluid flowrate in response to a change in testing conditions to a second flowrate associated with a second valve setting associated with at least the desired temperature setpoint and the changed testing conditions. This feed forward loop may be supplemented by a feedback loop that includes modifying the energy supplied to a cold plate heater in response to a comparison of a current temperature and the temperature setpoint. The valve may be a proportional control valve or the like.
    Type: Grant
    Filed: January 12, 2005
    Date of Patent: May 15, 2007
    Assignee: International Business Machines Corporation
    Inventors: Daniel Paul Beaman, Robert F. Florence, Jr., Howard Victor Mahaney, Jr., Frederic William Wright, IV
  • Patent number: 6674297
    Abstract: A micro compliant, test probe interconnect apparatus for an integrated circuit device is disclosed. In an exemplary embodiment, the apparatus includes an elongated housing and a probe pin extending from a first end of the housing. A biasing mechanism holds the probe pin in a normally extended position, wherein the biasing mechanism is formed from a portion of the elongated housing. In a preferred embodiment, the biasing mechanism is a flexible tab, formed from a generally rectangular section of the elongated housing and bent inwardly therein to form a cantilever.
    Type: Grant
    Filed: July 9, 2002
    Date of Patent: January 6, 2004
    Assignee: International Business Machines Corporation
    Inventors: Robert F. Florence, Jr., Emanuele F. Lopergolo, Vincent P. Mulligan, Charles R. Tompkins, Jr.
  • Patent number: 6011627
    Abstract: A universal mapping tool and method for mapping workpieces, such as semiconductor devices, is disclosed and described. The tool comprises a fixed and a movable gripping means adapted to mount a wide range of workpieces, means for optically locating the physical center of the workpiece fiducials mounted on the gripping means, and means for interpreting and storing the data obtained in the mapping operation.
    Type: Grant
    Filed: April 7, 1998
    Date of Patent: January 4, 2000
    Assignee: International Business Machines Corporation
    Inventors: Vincent P. Mulligan, Robert F. Florence, Jr., Charles R. Tompkins, Jr., Wing-Fung Yuen
  • Patent number: 5271516
    Abstract: A reusable isolation structure features an easily cleanable shell having viewing windows formed therein, each protected by a framing ridge or a recess integrally formed in the shell provides protection of contents from contamination, impact, vibration and tampering. Framing ridges or recesses also facilitate stacking of shells. The closure member opening of the shell includes a groove formed around the periphery thereof and is preferably not more than slightly smaller than an interior cross-section of the shell. A door of the isolation structure is dimensioned to fit within the closure member opening and has a resilient seal clamped to the periphery of a backbone by front and rear plates. The front and rear plates cooperate with grooves formed in the backbone to define a preferred form of manifold for coupling pressure or a vacuum to the interior of the resilient seal whereby the resilient seal may be collapsed to allow removal of the door or allowed to expand or pressurized to provide secure closure.
    Type: Grant
    Filed: September 24, 1992
    Date of Patent: December 21, 1993
    Assignee: International Business Machines Corporation
    Inventors: Lawrence G. Cook, Robert F. Florence, Jr., Gary M. Gallagher, Gordon E. Johnson, Robert W. Sargent