Abstract: An apparatus and method of fabricating and operating a micro-electromechanical systems (MEMS) integrated optical structure is disclosed. Micro-optics is integrated with MEMS actuators to provide a building block for a micro-optical communication device. Such micro-optical communication device may realize a variety of optical communication systems including optical interconnects, laser communications, or fiber optic switches. In accordance with one aspect of the present invention, a micro-optical element such as a micro-lens is advantageously integrated with an actuator such as MEMS comb drive actuator to form a MEMS lens assembly. The MEMS lens assembly is further coupled to an optical source which may provide a MEMS integrated micro-optical communication device. This integration substantially obviates the generally needed external or manual positioning of the micro-optical element to align a light beam or an optical signal being emitted from the optical source.

Abstract: An apparatus and method for a micro-electromechanical systems (MEMS) actuator such as a MEMS two-dimensional electrostatic comb drive having springs being advantageously configured to provide relatively large movements in first and second directions. In one embodiment, a comb drive apparatus includes a first set of comb pairs; a second set of comb pairs coupled to the first set of comb pairs; a stage coupled to the first and second sets of comb pairs; a first plurality of springs interposed between the second set of comb pairs and the stage and between the second set of comb pairs and the first set of comb pairs for movably coupling the second set of comb pairs to the stage and to the first set of comb pairs; and a second plurality of springs interposed between the first set of comb pairs and the stage and between the first set of comb pairs and the second set of comb pairs for movably coupling the first set of comb pairs to the stage and to the second set of comb pairs.

Abstract: An apparatus and method of fabricating and operating a micro-electromechanical systems (MEMS) integrated optical structure is disclosed. Micro-optics is integrated with MEMS actuators to provide a building block for a micro-optical communication device. Such micro-optical communication device may realize a variety of optical communication systems including optical interconnects, laser communications, or fiber optic switches. In accordance with one aspect of the present invention, a micro-optical element such as a micro-lens is advantageously integrated with an actuator such as MEMS comb drive actuator to form a MEMS lens assembly. The MEMS lens assembly is further coupled to an optical source which may provide a MEMS integrated micro-optical communication device. This integration substantially obviates the generally needed external or manual positioning of the micro-optical element to align a light beam or an optical signal being emitted from the optical source.

Abstract: Provided is an electrical interconnect cell intermittently spaced across a substrate to form an interconnect device or structure. The interconnect device is fully customizable or programmable upon the upper surface to accommodate various electrical components and connectivity to those components. The electrical interconnect device includes a plurality of intermittently spaced first pairs of upper and lower signal lines interwoven with a plurality of intermittently spaced second pairs of upper and lower signal lines. A bonding pad is arranged between adjacent upper and lower signal line pairs and can be connected thereto with conductive links placed upon the surface layer. Each bonding pad includes one or more pad vias which extend perpendicular to the upper surface to conductive structures arranged in lower layers. Approximately one-half of the array of bonding pads are connected to potential conductors.

Abstract: Solder reflow on an electrical interconnect substrate between a plurality of electrical contacts. The method includes coating the contacts with tin/lead solder, depositing a wetting metal between the contacts, and heating the substrate to at least the melting point of the solder so that the solder melts, reflows across the wetting metal and connects or links the contacts. The entire surface of a customizable copper/polyimide substrate can be personalized by solder links and TAB leads from surface-mounted integrated circuits can simultaneously be soldered to the substrate.

Abstract: A method for forming connections between copper conductors disposed on a substrate includes the steps of coating the copper conductors with a layer of nickel, exposing the coated copper conductors to a gas which includes a tungsten-bearing compound, and irradiating the substrate with a laser beam to deposit the tungsten between the copper conductors. A system for forming connections between copper conductors disposed on a substrate, includes means for coating the copper conductors with a layer of nickel, means for exposing the coated copper conductors to a gas which includes a tungsten-bearing compound, and means for irradiating the substrate with a laser beam to deposit the tungsten between the copper conductors.

Abstract: A process for laser-assisted liquid phase etching of copper conductors which includes the use of a solution of sulfuric acid and hydrogen peroxide in contact with an integrated circuit substrate and the provision of a laser beam to select substrate areas having copper conductors to be etched. Also disclosed is an apparatus for the laser-assisted etching.