Patents by Inventor Robert Franklin Nelson

Robert Franklin Nelson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080001416
    Abstract: Bumper assemblies for vehicles include multiple spaced apart layers formed of a polymeric material. In one embodiment, the polymeric layers are arranged such that a thickness gradation of the layers exists, wherein the thinnest layers are positioned to provide (and absorb a portion of the kinetic energy associated therewith) the initial impact surface. In another embodiment, the polymeric layers are arranged such that a modulus property gradation of the layers exists, wherein the layers having the lowest modulus property are positioned to provide the initial impact surface. Since the bumper assembly is formed of polymeric materials, the resulting mass is approximately one half that of a conventional bumper assembly. Moreover, the polymeric bumper assembly can be easily extruded and is recyclable.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 3, 2008
    Inventors: Tansen Dhananjay Chaudhari, Stephen Shuler, Robert Franklin Nelson, Ashwit Dias