Patents by Inventor Robert Fried

Robert Fried has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11944833
    Abstract: Systems and methods for improved user experience with rechargers for implantable medical devices. An external charging device for providing power to a rechargeable implantable device can determine a firmware state of the external charging device during recharging of the rechargeable implantable device, display a searching indication using a light indicator when the firmware state is determined to be in a searching state, display a charging indication using the light indicator when the firmware state is determined to be a charging state, and display an error indication using the light indicator when the firmware state is determined to be an error state. An optional user device application can provide complementary graphical user interfaces according to the firmware states.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: April 2, 2024
    Assignee: Medtronic, Inc.
    Inventors: Andrew Fried, Janet Creaser, Prathyusha Marri, Charles Nowell, Robert Schulzetenberg
  • Publication number: 20210086549
    Abstract: Processes for dividing the arc of an angle and its angle into ā€œnā€ number of equal parts. The same processes apply to dividing the arc of a wave of any amplitude into ā€œnā€ number of equal lengths. The number of equal divisions to be derived may be either an even number or an odd number. The number of degrees in the arc of a circle or the angle of the circle, or in the arc of a wave or its amplitude, need be known.
    Type: Application
    Filed: September 24, 2019
    Publication date: March 25, 2021
    Inventor: Michael Robert Fried
  • Patent number: 5631806
    Abstract: The portion of the lead which is soldered between electrical components in a circuit module includes one or more radially extending slits. Once heated, the fluid solder is drawn into the slits by capillary action. Trapped air escapes, eliminating air pockets or gaps. The result is a stronger joint and a reduction in solder overflow.
    Type: Grant
    Filed: July 31, 1995
    Date of Patent: May 20, 1997
    Inventors: Robert Fried, Kuo J. Tseng, Hsi Y. Hsiao