Abstract: Securing the manufacturing supply chain with digital certificates. A token is coupled to a manufacturing station and enabled via a personal identification number. The token includes a counter limiting the maximum number of certificates to be signed, and compares a serial number of a digital certificate to a tracked serial number. In some embodiments, the token is linked to a particular manufacturing station once the token is enabled.

Abstract: Securing the manufacturing supply chain with digital certificates. A token is coupled to a manufacturing station and enabled via a personal identification number. The token includes a counter limiting the maximum number of certificates to be signed, and compares a serial number of a digital certificate to a tracked serial number. In some embodiments, the token is linked to a particular manufacturing station once the token is enabled.

Abstract: According to the present disclosure, a printer apparatus may include a chuck configured to support a substrate thereon, a rail spaced apart from the chuck, a printhead carriage frame coupled to the rail and containing a printhead carriage housing at least one printhead therein, a first camera assembly configured to capture image data of the printhead and provide the image data to a computer, and a computer receiving the image data from the first camera assembly and configured to determine a deviation between a desired position of the printhead and an actual position of the printhead.

Abstract: A drop analysis/drop check system allows a plurality of printheads to remain stationary during analysis to emulate operation of an actual piezoelectric microdeposition system. The system provides accurate tuning of individual nozzle ejectors and allows for substrate loading and alignment in parallel with drop analysis/drop check. The drop analysis/drop check system includes a motion controller directing movement of a stage, a printhead controller controlling a printhead to selectively eject drops of fluid material to be deposited on a substrate, and a camera supported by the stage for movement relative to the printheads. The camera receives a signal from the motion controller to initiate exposure of the camera and captures an image of the drops of fluid material ejected by the printheads. A light-emitting device includes a strobe controller that receives a signal from the camera to supply light to an area including the liquid drops during camera exposure.

Abstract: According to the present disclosure, a printer apparatus may include a chuck configured to support a substrate thereon, a rail spaced apart from the chuck, a printhead carriage frame coupled to the rail and containing a printhead carriage housing at least one printhead therein, a first camera assembly configured to capture image data of the printhead and provide the image data to a computer, and a computer receiving the image data from the first camera assembly and configured to determine a deviation between a desired position of the printhead and an actual position of the printhead.

Abstract: A drop analysis/drop check system allows a plurality of printheads to remain stationary during analysis to emulate operation of an actual piezoelectric microdeposition system. The system provides accurate tuning of individual nozzle ejectors and allows for substrate loading and alignment in parallel with drop analysis/drop check. The drop analysis/drop check system includes a motion controller directing movement of a stage, a printhead controller controlling a printhead to selectively eject drops of fluid material to be deposited on a substrate, and a camera supported by the stage for movement relative to the printheads. The camera receives a signal from the motion controller to initiate exposure of the camera and captures an image of the drops of fluid material ejected by the printheads. A light-emitting device includes a strobe controller that receives a signal from the camera to supply light to an area including the liquid drops during camera exposure.

Abstract: A method and apparatus for conditioning a polishing pad is described, wherein the polishing pad has a polishing surface for polishing the semiconductor wafer. The method includes positioning a sonic energy generator above the polishing surface of the polishing pad, and applying sonic energy to the polishing surface of the polishing pad. The apparatus a sonic energy generator adapted to be positioned above the polishing surface, the sonic energy generator including a transducer, and a liquid carrier in flow communication with the transducer, wherein the transducer transmits sonic energy into the liquid carrier and the liquid carrier is applied to the polishing surface of the polishing belt.

Abstract: A polishing tool includes a polish pad, a bladder, a fluid, and a flux guide. A bladder containing fluid supports the polishing pad that is positioned adjacent to a surface to be polished. Flux guides positioned along a portion of the bladder direct a field or a magnetic flux to selected locations of the bladder. The method of polishing a surface adjusts the field or the magnetic flux emanating from the flux guides which changes the mechanical properties of the fluid. By adjusting the magnitude of the field or level of magnetic flux flowing from the flux guides independent pressure adjustments occur at selected locations of the bladder that control the polishing profile of the surface.

Abstract: A method and apparatus for conditioning a polishing pad is described, wherein the polishing pad has a polishing surface for polishing the semiconductor wafer. The method includes positioning a sonic energy generator above the polishing surface of the polishing pad, and applying sonic energy to the polishing surface of the polishing pad. The apparatus a sonic energy generator adapted to be positioned above the polishing surface, the sonic energy generator including a transducer, and a liquid carrier in flow communication with the transducer, wherein the transducer transmits sonic energy into the liquid carrier and the liquid carrier is applied to the polishing surface of the polishing belt.

Abstract: A polishing tool includes a polish pad, a bladder, a fluid, and a flux guide. A bladder containing fluid supports the polishing pad that is positioned adjacent to a surface to be polished. Flux guides positioned along a portion of the bladder direct a field or a magnetic flux to selected locations of the bladder. The method of polishing a surface adjusts the field or the magnetic flux emanating from the flux guides which changes the mechanical properties of the fluid. By adjusting the magnitude of the field or level of magnetic flux flowing from the flux guides independent pressure adjustments occur at selected locations of the bladder that control the polishing profile of the surface.

Abstract: A temperature compensating unit is coupled to a linearly moving belt of a polisher for adjusting the temperature of the belt, which temperature is measured by a sensor situated proximal to the belt.

Abstract: A technique for utilizing a sensor to monitor fluid pressure from a fluid bearing located under a polishing pad to detect a polishing end point. A sensor is located at the leading edge of a fluid bearing of a linear polisher, which is utilized to perform chemical-mechanical polishing on a semiconductor wafer. The sensor monitors the fluid pressure to detect a change in the fluid pressure during polishing, which change corresponds to a change in the shear force when the polishing transitions from one material layer to the next.