Abstract: A bond metal injection tool can include a fill head having a sealed chamber for containing a molten bond metal (e.g., solder) and a gas, and a nozzle for directing a flow of the molten bond metal into cavities in a major surface of a mold. A pressure control device can controllably apply pressure within the chamber to eject the bond metal from the nozzle into the cavities. The pressure control device may also controllably reduce a pressure within the chamber to inhibit the bond metal from being ejected from the nozzle, such as when the fill head is being moved onto the mold surface from a parking location or when the fill head is being moved off the mold surface onto a parking location.

Abstract: Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.

Abstract: Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.

Abstract: Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.

Abstract: Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.

Abstract: Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.

Abstract: A bond metal injection tool can include a fill head having a sealed chamber for containing a molten bond metal (e.g., solder) and a gas, and a nozzle for directing a flow of the molten bond metal into cavities in a major surface of a mold. A pressure control device can controllably apply pressure within the chamber to eject the bond metal from the nozzle into the cavities. The pressure control device may also controllably reduce a pressure within the chamber to inhibit the bond metal from being ejected from the nozzle, such as when the fill head is being moved onto the mold surface from a parking location or when the fill head is being moved off the mold surface onto a parking location.

Abstract: An exemplary method for marking molds, the method comprising, configuring a milling machine to operate with a diamond coated bit having an angle of approximately 60 degrees, and engraving a unique identifier on a bottom surface of a borosilicate glass injection molded soldering mold with the milling machine.

Abstract: Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; and removing material from the defective opening by applying a laser pulse to the defective opening.

Abstract: Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.

Abstract: An exemplary method for marking molds, the method comprising, configuring a milling machine to operate with a diamond coated bit having an angle of approximately 60 degrees, and engraving a unique identifier on a bottom surface of a borosilicate glass injection molded soldering mold with the milling machine.

Abstract: A facial relief and seal creates a closed damping chamber between the spindle end face and adjacent tool support plate. A plurality of tools are located on the face plate near the outer periphery. In one embodiment, a viscous medium, such as oil, is provided in the damping chamber. In an alternate embodiment, a visco-elastic material, such as PVC, is provided in the damping chamber. Relative movement between the spindle end face and the tool support plate will cause vibration damping.

Abstract: A carbon monoxide detector and deactivating mechanism to monitor the level of carbon monoxide concentration within the passenger compartment of a vehicle having an internal combustion engine, and to stop the operation of such internal combustion engine when the level of carbon monoxide concentration reaches a danger point for occupants of the passenger compartment. The detector includes plural detecting means to determine such dangerous concentration level, at least two of which detect carbon monoxide in the atmosphere by different methods and principles of operation. The detector is electrically connected to the vehicle's electrical system and when the critical pre-determined level of carbon monoxide is reached, it triggers a vacuum switch to interrupt the ignition circuit of the vehicle for a long enough time to insure that the internal combustion engine has been stopped.

Abstract: In a high density solenoid operated multiple punch apparatus, having a punch head provided with the plurality of closely-spaced large bores arranged in column and rows that extend partially through the punch head from the top side, solenoid elements mounted in the large bores, a plurality of holes with a diameter smaller than the large bores aligned with the large bores and extending the remaining distance through the punch head to the bottom side, push rod elements slidably disposed in the holes actuated by the solenoid elements, the improvement beingA cooling system for the punch head which includes a plurality of small bores arranged in rows in the bottom of the punch head terminating short of the top surface and positioned in the area between the plurality of large bores, a plurality of elongated grooves in the bottom surface of the head located between rows of the plurality of holes and forming a recessed chamber connecting a row of the small bores, a plate seated in each of the elongated grooves with ea