Abstract: Apparatus and methods relating to a metered pill dispensing system are disclosed herein. A preloaded cartridge having multiple compartments containing dispensable contents, such as pills, is inserted into a cassette. The cassette has an actuatable member, such as a film or a belt, wrapped around it. The actuatable member has apertures through which the contents of the preloaded cartridge may pass. The actuatable member may be controlled to meter the dispensing of the contents.

Abstract: A modular pillbox that includes a base unit and a plurality of modules that can be interchangeably coupled to the base unit. The base unit includes a plurality of interior compartments defined by a top, a bottom and at least one side wall, openable doors that close the tops of the plurality of interior compartments, one-way passages in one of the bottoms or the at least one side wall of each interior compartment through which pills can be pushed into the interior compartments, and an opening in a front portion of the base unit. The plurality of modules includes a cover plate that couples to the base unit and covers the opening, and various electronic packages that removable couple to the base unit and cover the opening.

Abstract: A modular pillbox that includes a base unit and a plurality of modules that can be interchangeably coupled to the base unit. The base unit includes a plurality of interior compartments defined by a top, a bottom and at least one side wall, openable doors that close the tops of the plurality of interior compartments, one-way passages in one of the bottoms or the at least one side wall of each interior compartment through which pills can be pushed into the interior compartments, and an opening in a front portion of the base unit. The plurality of modules includes a cover plate that couples to the base unit and covers the opening, and various electronic packages that removable couple to the base unit and cover the opening.

Abstract: An apparatus for measuring at least one electrical property of a semiconductor wafer includes a probe including a shaft having at a distal end thereof a conductive tip for electrically communicating with an object area of the semiconductor wafer. The apparatus further includes a device for applying an electrical stimulus between the conductive tip and the object area, and a device for measuring a response of the semiconductor wafer to the electrical stimulus and for determining from the response the at least one electrical property of the object area of the semiconductor wafer. A probe guard is included that surrounds the shaft of the probe adjacent the distal end of the probe. The probe guard avoids electrical communication between the probe and areas outside of the object area of the semiconductor wafer.

Abstract: A measuring apparatus for measuring a semiconductor wafer, or a film or coating thereon, includes an electrically conductive wafer chuck and a probe having a probe body defining an internal cavity in fluid communication with an electrically conductive and elastic or resilient membrane. The membrane and a topside of the semiconductor wafer are moved into spaced relation when the semiconductor wafer is supported by the wafer chuck. A pressure of fluid supplied to the internal cavity of the probe body is selectively controlled whereupon the membrane expands into contact with the topside of the semiconductor wafer. A suitable test stimulus is applied to the membrane and the semiconductor wafer and the response of the semiconductor wafer to the test stimulus is measured.

Abstract: A measuring apparatus for measuring a semiconductor wafer, or a film or coating thereon, includes an electrically conductive wafer chuck and a probe having a probe body defining an internal cavity in fluid communication with an electrically conductive and elastic or resilient membrane. The membrane and a topside of the semiconductor wafer are moved into spaced relation when the semiconductor wafer is supported by the wafer chuck. A pressure of fluid supplied to the internal cavity of the probe body is selectively controlled whereupon the membrane expands into contact with the topside of the semiconductor wafer. A suitable test stimulus is applied to the membrane and the semiconductor wafer and the response of the semiconductor wafer to the test stimulus is measured.

Abstract: An apparatus for measuring at least one electrical property of a semiconductor wafer includes a probe including a shaft having at a distal end thereof a conductive tip for electrically communicating with an object area of the semiconductor wafer. The apparatus further includes a device for applying an electrical stimulus between the conductive tip and the object area, and a device for measuring a response of the semiconductor wafer to the electrical stimulus and for determining from the response the at least one electrical property of the object area of the semiconductor wafer. A probe guard is included that surrounds the shaft of the probe adjacent the distal end of the probe. The probe guard avoids electrical communication between the probe and areas outside of the object area of the semiconductor wafer.

Abstract: A semiconductor wafer probe assembly (10) includes a chuck assembly (18, 20) configured to receive a back surface (30) of a semiconductor wafer (14) and an electrical contact (20) for contacting the semiconductor wafer (14). A probe (36) having an elastically deformable conductive tip (38) is movable into contact with a semiconducting material forming a front surface (13) of the semiconductor wafer (14) or with a front surface (34) of a dielectric (12) formed on the front surface of the semiconducting material. A tester (82) is connected for applying an electrical stimulus between the electrical contact (20) and the conductive tip (38) for measuring a response to the electrical stimulus and for determining from the response at least one electrical property of the semiconducting material and/or the dielectric (12).

Abstract: An apparatus for conducting noncontact capacitance versus voltage measurements over a flat surface of a test wafer comprises a capacitance measuring head mounted on a positioning arm. The positioning arm is kinematically mounted and positions the measuring head over the test wafer. The capacitance measuring head has a plurality of electrically separate capacitor plates, one for use in making the capacitance versus voltage measurements and the remaining plates for providing capacitive position signals. Actuators responsive to the position signals place the measuring head very close to and substantially parallel to the surface of the test wafer.

Abstract: A system for automatic spreading resistance profiling of wafer specimens. The system comprises a positioning stage for positioning the specimens for contact by probe tips and alternately a probe conditioning fixture or a sample calibration fixture. The system further comprises a programmed computer for controlling the positioning stage to effect automatic specimen profiling, probe tip conditioning, and calibration.

Abstract: An apparatus for the measurement of electrical properties of a semiconductor wafer is disclosed. A top contact mercury probe for contacting the upper surface of a wafer body is provided. The mercury probe is held by a kinematically stable probe arm which provides for very controlled movement of the mercury probe. A semiconductor wafer body horizontal and rotational movement system is provided for moving the wafer body to provide mapping capability. A top side return contact for doing measurements on wafer bodies with insulating substrates is disclosed. The top side return contact is also provided with a self-levelling and raising function, which ensures the bottom surface of the contact member to intimately contact the upper surface of the wafer body when desired, and also to raise the contact member off the wafer body when the bottom contact underneath the wafer is utilized.

Abstract: An apparatus for abrading workpieces, particularly a semiconductor wafer, includes a spinner plate having acentral support and a finger pocket at one end to rotate the plate about a collar that is affixed to the central part of an abrading plate. The spinner plate carries at its end opposite the finger pocket, a fixture used to support the workpiece for movement along a circular track on the abrading plate. The abrading plate is supported within a tray.

Abstract: Apparatus for abrading workpieces, particularly semiconductor wafers, characterized in that the workpiece is disposed on an abrading material in a lapping and polishing tray carried on a generally horizontal support plate. The plate is caused to oscillate or eccentrically rotate by a single, centrally located eccentric arm, the plate being restrained against rotary movement about the eccentric arm by resilient means which extend between stationary pins arranged around the support plate and points on the support plate intermediate the pins.