Abstract: A ruggedized, snap-together, module securely retains a pair of mutually abutting fiber optic interconnect MT ferrules, that have been joined together by a ferrule aligning pin clamp structure. The module includes a generally rectangular base member having a ferrule retention cavity that is configured to retain a pair of MT ferrules and an associated pin clamp assembly therefor. A cover is configured to engage the base in such a manner that the two MT ferrules are firmly held in their intended face-to-face abutting condition as captured between the base and the cover. A bias compression spring is captured between the cover and the base in a manner that facilitates removal of the cover when it is desired to open the module and gain access to the two MT ferrules.

Abstract: A circuit card module to be received in a card chassis includes a host card assembly and a mezzanine card assembly carried in spaced relation by the host card assembly. The host card assembly includes a host card heat sink having an end to connect to the card chassis to conduct heat thereto, and a host circuit card mounted on the host card heat sink. The mezzanine card assembly includes a mezzanine card heat sink, and a mezzanine circuit card mounted on the mezzanine card heat sink. The mezzanine card heat sink has an end to connect to the card chassis to conduct heat thereto in parallel with heat conducted from the host card heat sink to the card chassis. The mezzanine card heat sink may comprise a body adjacent the mezzanine circuit card, and a flexible strap extending outwardly therefrom to connect to the card chassis.

Abstract: A circuit card module to be received in a card chassis includes a host card assembly and a mezzanine card assembly carried in spaced relation by the host card assembly. The host card assembly includes a host card heat sink having an end to connect to the card chassis to conduct heat thereto, and a host circuit card mounted on the host card heat sink. The mezzanine card assembly includes a mezzanine card heat sink, and a mezzanine circuit card mounted on the mezzanine card heat sink. The mezzanine card heat sink has an end to connect to the card chassis to conduct heat thereto in parallel with heat conducted from the host card heat sink to the card chassis. The mezzanine card heat sink may comprise a body adjacent the mezzanine circuit card, and a flexible strap extending outwardly therefrom to connect to the card chassis.