Patents by Inventor Robert Hertlein

Robert Hertlein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11936038
    Abstract: An anode active material for lithium ion batteries includes one or more unaggregated silicon particles having a mass-based chlorine content of from 5 to 200 ppm and a volume-weighted particle size distribution having diameter percentiles d50 of from 0.5 ?m to 10.0 ?m.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: March 19, 2024
    Assignee: Wacker Chemie AG
    Inventors: Jürgen Pfeiffer, Eckhard Hanelt, Harald Hertlein, Karl Hesse, Robert Maurer
  • Patent number: 8600374
    Abstract: The present invention is a wireless communication device which includes a circuit board with a coating, a top housing, a bottom housing and a gasket. The wireless communication device is preferably a water-tight enclosure. A method for forming a water-proof wireless communication device is also disclosed.
    Type: Grant
    Filed: February 11, 2012
    Date of Patent: December 3, 2013
    Assignee: Awarepoint Corporation
    Inventors: Robert Hertlein, Gary Jorgensen, Patrick O'Bright, Matthew R. Perkins
  • Patent number: 8433366
    Abstract: A system for wireless communication comprises a first communication device having a first interface for interfacing with a host device and a second interface; and a second communication device configured to be coupled to the second interface of the first communication device. The first communication device and the second communication device, when coupled, form a substantially integrated device.
    Type: Grant
    Filed: January 7, 2009
    Date of Patent: April 30, 2013
    Assignee: Novatel Wireless, Inc.
    Inventors: Robert Hertlein, Slim Souissi, Rahul Chaturvedi, Clint Wilber
  • Publication number: 20120224349
    Abstract: An electronic component cover comprises a plate having a first region adapted to substantially cover at least one side of a first electronic component. The plate is adapted to accommodate a second electronic component thereon, such as a SIM card or a SIM card reader. The plate may include a second region to accommodate the second electronic component therein. The electronic component cover may comprise one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component. The one or more leads are electrically isolated from the plate. The cover may further comprise a nonconductive mount adapted to accommodate the second electronic component thereon. The nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.
    Type: Application
    Filed: August 30, 2011
    Publication date: September 6, 2012
    Applicant: NOVATEL WIRELESS, INC.
    Inventors: Kevin Clancy, Ken Frayn, Robert Hertlein
  • Patent number: 8018734
    Abstract: An electronic device includes a first printed circuit board including electronic components, a second printed circuit board including electronic components, and a shielding midframe. The shielding midframe is adapted to provide electromagnetic isolation between the first printed circuit board and the second printed circuit board. The shielding midframe is further adapted to provide electromagnetic isolation of electronic components on at least one of the first printed circuit or the second printed circuit.
    Type: Grant
    Filed: August 24, 2007
    Date of Patent: September 13, 2011
    Assignee: Novatel Wireless, Inc.
    Inventors: Alberto Brewer, Clint Wilber, Todd Conklin, Robert Hertlein
  • Patent number: 8009441
    Abstract: An electronic component cover comprises a plate having a first region adapted to substantially cover at least one side of a first electronic component. The plate is adapted to accommodate a second electronic component thereon, such as a SIM card or a SIM card reader. The plate may include a second region to accommodate the second electronic component therein. The electronic component cover may comprise one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component. The one or more leads are electrically isolated from the plate. The cover may further comprise a nonconductive mount adapted to accommodate the second electronic component thereon. The nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: August 30, 2011
    Assignee: Novatel Wireless, Inc.
    Inventors: Kevin Clancy, Ken Frayn, Robert Hertlein
  • Patent number: 7751204
    Abstract: An electronic shielding component includes a shielding body, at least one cavity on a first side of the shielding body, the at least one cavity adapted to accommodate an electronic component therein, and at least two cavities on a second side of the shielding body, each of the at least two cavities adapted to accommodate an electronic component therein. Each cavity is adapted to electromagnetically isolate an electronic component therein from cavities on an opposite side of the shielding body and from cavities on the same side of the shielding body.
    Type: Grant
    Filed: August 24, 2007
    Date of Patent: July 6, 2010
    Inventors: Clint Wilber, Robert Hertlein
  • Publication number: 20100097774
    Abstract: An electronic component cover comprises a plate having a first region adapted to substantially cover at least one side of a first electronic component. The plate is adapted to accommodate a second electronic component thereon, such as a SIM card or a SIM card reader. The plate may include a second region to accommodate the second electronic component therein. The electronic component cover may comprise one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component. The one or more leads are electrically isolated from the plate. The cover may further comprise a nonconductive mount adapted to accommodate the second electronic component thereon. The nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.
    Type: Application
    Filed: December 21, 2009
    Publication date: April 22, 2010
    Inventors: Kevin Clancy, Ken Frayn, Robert Hertlein
  • Publication number: 20100029330
    Abstract: A system for wireless communication comprises a first communication device having a first interface for interfacing with a host device and a second interface; and a second communication device configured to be coupled to the second interface of the first communication device. The first communication device and the second communication device, when coupled, form a substantially integrated device.
    Type: Application
    Filed: January 7, 2009
    Publication date: February 4, 2010
    Inventors: Robert Hertlein, Slim Souissi, Rahul Chaturvedi, Clint Wilber
  • Patent number: 7636245
    Abstract: An electronic component cover comprises a plate having a first region adapted to substantially cover at least one side of a first electronic component. The plate is adapted to accommodate a second electronic component thereon, such as a SIM card or a SIM card reader. The plate may include a second region to accommodate the second electronic component therein. The electronic component cover may comprise one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component. The one or more leads are electrically isolated from the plate. The cover may further comprise a nonconductive mount adapted to accommodate the second electronic component thereon. The nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.
    Type: Grant
    Filed: June 25, 2007
    Date of Patent: December 22, 2009
    Assignee: Novatel Wireless, Inc.
    Inventors: Kevin Clancy, Ken Frayn, Robert Hertlein
  • Publication number: 20090052142
    Abstract: An electronic device includes a first printed circuit board including electronic components, a second printed circuit board including electronic components, and a shielding midframe. The shielding midframe is adapted to provide electromagnetic isolation between the first printed circuit board and the second printed circuit board. The shielding midframe is further adapted to provide electromagnetic isolation of electronic components on at least one of the first printed circuit or the second printed circuit.
    Type: Application
    Filed: August 24, 2007
    Publication date: February 26, 2009
    Inventors: Alberto Brewer, Clint Wilber, Todd Conklin, Robert Hertlein
  • Publication number: 20090052154
    Abstract: An electronic shielding component includes a shielding body, at least one cavity on a first side of the shielding body, the at least one cavity adapted to accommodate an electronic component therein, and at least two cavities on a second side of the shielding body, each of the at least two cavities adapted to accommodate an electronic component therein. Each cavity is adapted to electromagnetically isolate an electronic component therein from cavities on an opposite side of the shielding body and from cavities on the same side of the shielding body.
    Type: Application
    Filed: August 24, 2007
    Publication date: February 26, 2009
    Inventors: Clint Wilber, Robert Hertlein
  • Publication number: 20080318446
    Abstract: An electronic component cover comprises a plate having a first region adapted to substantially cover at least one side of a first electronic component. The plate is adapted to accommodate a second electronic component thereon, such as a SIM card or a SIM card reader. The plate may include a second region to accommodate the second electronic component therein. The electronic component cover may comprise one or more leads adapted to provide electrical communication between the first electronic component and the second electronic component. The one or more leads are electrically isolated from the plate. The cover may further comprise a nonconductive mount adapted to accommodate the second electronic component thereon. The nonconductive mount secures the one or more leads to the plate while electrically isolating the one or more leads from the plate.
    Type: Application
    Filed: June 25, 2007
    Publication date: December 25, 2008
    Inventors: Kevin Clancy, Ken Krayn, Robert Hertlein
  • Patent number: 6049192
    Abstract: A battery charger includes a main housing (103). A well (108) in the main housing is for receipt of an electronic device (102) including a battery. A door housing (104) is movably carried on the main housing. At least one contact (422) is carried on the main housing for connection to a battery (200, 300) inserted between the door housing and the main housing, wherein the door housing is movable between an open position for receipt of a battery and a compact closed position. A circuit is positioned in the main housing for electrical connection to the electronic device and the contacts for charging a battery.
    Type: Grant
    Filed: March 18, 1999
    Date of Patent: April 11, 2000
    Assignee: Motorola, Inc.
    Inventors: Tony N. Kfoury, Jon Godston, Robert Hertlein, Andrew A. Powell