Abstract: The present disclosure relates to a contaminant shield system. The contaminant shield system may surround an electronic device, such as a local oscillator (e.g., a crystal oscillator), to prevent contamination of the electronic device via coupling material (e.g., under-fill material) creep or wicking. The contaminant shield system includes multiple walls and at least one wall includes a pick-and-place feature that facilitates positioning of the contaminant shield system during assembly of a circuit board that includes the contaminant shield system.

Abstract: This document describes techniques and apparatuses directed to force distributing spring contacts. The disclosed spring contacts electrically connect a first component to a second component within a computing device. In implementations, the computing device includes a spring contact having a flexure coupled to a contact pin and configured to apply a force to the second component through the contact pin. The contact pin can include a small or precise structure configured to provide a precise electrical connection to the second component. However, the force to the second component through the small or precise structure of the contact pin increases an applied pressure, which can damage the second component. The disclosed techniques and apparatuses describe force distributing spring contacts with a force distributor configured to distribute the force to the second component over a larger surface area, thereby decreasing the applied pressure and preventing damage to the second component.

Abstract: A mobile phone may include an enclosure defining an internal volume, the enclosure including a front cover formed from a transparent material and defining a front exterior surface, a rear cover formed from a glass material and defining a rear exterior surface, and a housing component defining a side exterior surface. The mobile phone may include a circuit board assembly within the internal volume. The circuit board assembly may include a circuit board, a circuit component coupled to an exterior surface of the circuit board, and a cowling coupled to the circuit board and covering the circuit component, the cowling having a thickness less than about 0.5 mm and including a base structure formed from an aluminum alloy having a thickness less than about 0.4 mm and a thermally conductive structure positioned over the base structure and configured to dissipate heat.