Abstract: A device may comprise a substrate formed of a first semiconductor material and a trench formed in the substrate. A second semiconductor material may be formed in the trench. The second semiconductor material may have first and second portions that are isolated with respect to one another and that are isolated with respect to the first semiconductor material.

Abstract: A device may comprise a substrate formed of a first semiconductor material and a trench formed in the substrate. A second semiconductor material may be formed in the trench. The second semiconductor material may have first and second portions that are isolated with respect to one another and that are isolated with respect to the first semiconductor material.

Abstract: A device can have an outer frame and an actuator. The actuator can have a movable frame and a fixed frame. At least one torsional flexure and at least one hinge flexure can cooperate to provide comparatively high lateral stiffness between the outer frame and the movable frame and can cooperate to provide comparatively low rotational stiffness between the outer frame and the movable frame.

Abstract: A method for focusing a miniature camera includes providing a current through a coil, moving a lens of a camera based on the current to adjust a focus of the camera, and limiting movement of the lens along an optical path of the camera.

Abstract: In one aspect, the present invention provides a wafer level optical assembly comprising a first wafer level optical element, the first wafer level optical element comprising a first alignment structure and a second wafer level optical element, the second wafer level optical element comprising a second alignment structure, wherein the first alignment structure contacts the second alignment structure.

Abstract: In one embodiment, an electrostatic actuator includes a generally planar fixed frame, a generally planar moving frame coupled to the fixed frame by a flexure for substantially coplanar, perpendicular movement relative to the fixed frame, a plurality of interdigitated teeth, a fixed portion of which is attached to the fixed frame and a moving portion of which is attached to the moving frame, and an elongated output shaft having opposite input and output ends, the input end being coupled to the moving frame.

Abstract: A device may comprise a substrate formed of a first semiconductor material and a trench formed in the substrate. A second semiconductor material may be formed in the trench. The second semiconductor material may have first and second portions that are isolated with respect to one another and that are isolated with respect to the first semiconductor material.

Abstract: A microelectromechanical systems (MEMS) device may be provided with one or more sintered electrical contacts. The MEMS device may be a MEMS actuator or a MEMS sensor. The sintered electrical contacts may be silver-paste metalized electrical contacts. The sintered electrical contacts may be formed by depositing a sintering material such as a metal paste, a metal preform, a metal ink, or a metal powder on a wafer of released MEMS devices and heating the wafer so that the deposited sintering material diffuses into a substrate of the device, thereby making electrical contact with the device. The deposited sintering material may break through an insulating layer on the substrate during the sintering process. The MEMS device may be a multiple degree of freedom actuator having first and second MEMS actuators that facilitate autofocus, zoom, and optical image stabilization for a camera.

Abstract: A method for focusing a miniature camera includes providing a current through a coil, moving a lens of a camera based on the current to adjust a focus of the camera, and limiting movement of the lens along an optical path of the camera.

Abstract: A microelectromechanical systems (MEMS) device may be provided with one or more sintered electrical contacts. The MEMS device may be a MEMS actuator or a MEMS sensor. The sintered electrical contacts may be silver-paste metalized electrical contacts. The sintered electrical contacts may be formed by depositing a sintering material such as a metal paste, a metal preform, a metal ink, or a metal powder on a wafer of released MEMS devices and heating the wafer so that the deposited sintering material diffuses into a substrate of the device, thereby making electrical contact with the device. The deposited sintering material may break through an insulating layer on the substrate during the sintering process. The MEMS device may be a multiple degree of freedom actuator having first and second MEMS actuators that facilitate autofocus, zoom, and optical image stabilization for a camera.

Abstract: A device may comprise a substrate formed of a first semiconductor material and a trench formed in the substrate. A second semiconductor material may be formed in the trench. The second semiconductor material may have first and second portions that are isolated with respect to one another and that are isolated with respect to the first semiconductor material.

Abstract: A device can have an outer frame and an actuator. The actuator can have a movable frame and a fixed frame. At least one torsional flexure and at least one hinge flexure can cooperate to provide comparatively high lateral stiffness between the outer frame and the movable frame and can cooperate to provide comparatively low rotational stiffness between the outer frame and the movable frame.

Abstract: A method for focusing a miniature camera includes providing a current through a coil, moving a lens of a camera based on the current to adjust a focus of the camera, and limiting movement of the lens along an optical path of the camera.

Abstract: A device can have an outer frame and an actuator. The actuator can have a movable frame and a fixed frame. At least one torsional flexure and at least one hinge flexure can cooperate to provide comparatively high lateral stiffness between the outer frame and the movable frame and can cooperate to provide comparatively low rotational stiffness between the outer frame and the movable frame.

Abstract: A microelectromechanical systems (MEMS) device may be provided with one or more sintered electrical contacts. The MEMS device may be a MEMS actuator or a MEMS sensor. The sintered electrical contacts may be silver-paste metalized electrical contacts. The sintered electrical contacts may be formed by depositing a sintering material such as a metal paste, a metal preform, a metal ink, or a metal powder on a wafer of released MEMS devices and heating the wafer so that the deposited sintering material diffuses into a substrate of the device, thereby making electrical contact with the device. The deposited sintering material may break through an insulating layer on the substrate during the sintering process. The MEMS device may be a multiple degree of freedom actuator having first and second MEMS actuators that facilitate autofocus, zoom, and optical image stabilization for a camera.

Abstract: Techniques are disclosed for systems and methods to provide thermal despace compensation for optics assemblies, such as devices including one or more lenses and/or optical devices. A thermal despace compensation system may include one or more interfaces substantially situated between optical devices that expand and contract with changing temperature according to their coefficients of thermal expansion (CTEs). Each interface may be implemented with one or more shapes and/or interfaces adapted to provide a compensation despace to compensate for thermal expansion and contraction and/or reduce optical defects caused by changes in temperature of the various optical devices.

Abstract: A device may comprise a substrate formed of a first semiconductor material and a trench formed in the substrate. A second semiconductor material may be formed in the trench. The second semiconductor material may have first and second portions that are isolated with respect to one another and that are isolated with respect to the first semiconductor material.

Abstract: Techniques are disclosed for systems and methods to provide shock impact mitigation for MEMS structures. A MEMS structure may include one or more actuators. An actuator may include a first frame having a spine, where the spine includes a body and a tip. The actuator may include a second frame connected to the first frame and including a shock stop, where the shock stop includes a surface in proximity to the spine tip. An actuator may include a shock cushion spring fixed relative to the spine tip and situated substantially between the spine tip and the shock stop surface, where the shock cushion spring is adapted to protect the spine tip from contact with the shock stop surface.

Abstract: A method for focusing a miniature camera includes providing a current through a coil, moving a lens of a camera based on the current to adjust a focus of the camera, and limiting movement of the lens along an optical path of the camera.

Abstract: A device may comprise a substrate formed of a first semiconductor material and a trench formed in the substrate. A second semiconductor material may be formed in the trench. The second semiconductor material may have first and second portions that are isolated with respect to one another and that are isolated with respect to the first semiconductor material.