Abstract: The present invention teaches a simplified process for fabricating high density printed wiring boards using a semi-additive process. Steps required to achieve this objective include adhering an electroless plated copper commoning layer to a surface roughened dielectric substrate. Subsequently, the commoning layer is photolithographically personalized by covering the commoning layer with a resist and then uncovering predetermined areas of the aforementioned commoning layer. Consequently, the semi-additive method involves electroplating copper onto the uncovered areas of the commoning layer, thereby generating copper features and circuitry. Finally, the semi-additive process requires the stripping of the remaining photoresist, and the unplated electroless copper layer is etched in order to electronically isolate the copper features and circuitry lines.

Abstract: The present invention teaches a simplified process for fabricating high density printed wiring boards using a semi-additive process. A roughened copper foil is laminated to a dielectric substrate. The foil is subsequently removed from the dielectric to create a roughened, irregular surface on the dielectric substrate. Vertical angle through holes and blind holes are formed in the substrate. A uniform copper commoning layer is electrolessly plated to the roughened dielectric substrate and through holes. A photoresist is applied on the surface of the electroless plated layer and irradiated through a mask having printed circuit features. After developing the photoresist the uncovered electroless layer is electrolytically plated to create the final features and circuitry. After stripping the remaining photoresist the unplated electroless copper layer is etched to electronically isolate the copper features and circuitry lines.

Abstract: A singlet-delta oxygen generator 10 comprises a chamber 14 in which a gas stream 22 of singlet-delta oxygen, O.sub.2 (.sup.1 .DELTA.), is generated; a water vapor trap 40 to remove water vapor from the gas stream, and a liquid separator 60 downstream of the water vapor trap to separate liquid from the gas stream subsequent to removal of the water vapor. The water vapor trap comprises a liquid droplet dispersing device 42 which forms a droplet field 44 of cold liquid droplets in the chamber. The cold liquid droplets interact with and condense water vapor in the gas stream. The cold liquid is preferably hydrogen peroxide. The liquid separator comprises a baffle 62 arrangement which forms a tortuous flow path for the gas stream. Liquid in the gas stream is unable to traverse the baffles and is separated from the liquid, to produce an essentially dry gas stream for introduction into a gain generator 34 downstream of the singlet-delta oxygen generator.

Abstract: A high energy chemical laser capable of being operated in an aircraft to interdict and destroy theater ballistic missiles is provided. A key to the chemical laser of the invention is the use of individual chemical lasers whose individual photon energy outputs can be combined into a single high-energy laser beam.

Abstract: Disclosed is a method of drilling, desmearing, and additively circuitizing a printed circuit board. The printed circuit board is drilled under conditions which produce glass and polymer smeared vias and through holes. The particulate debris is removed by vapor blasting the drilled printed circuit board. Next the printed circuit board is soaked in a solvent to swell the drill smear on the circuit interplanes of the printed circuit board. This solvent is then removed by entrainment in a gas, and a stream of an aqueous, acidic, oxidizing solution is passed through the printed circuit board holes to remove swollen smear in the thru holes and produce an etchback of conductors. After a water rinse an aqueous reducing solution is passed through the printed circuit board to reduce and remove aqueous acidic oxidizing solution, e.g., residual aqueous acid oxidizing solution. The printed circuit board is rinsed to remove the aqueous reducing solution.

Abstract: A cell is fabricated using a solid alkali metal anode and a fluid cathode which are separated by a modified aluminate solid barrier which permits the flow of only the alkali metal ions. The fluid cathode can contain a solid, gaseous, or liquid oxidizer in a liquid electrolyte. Operating temperatures for these cells range from less than -40.degree. C to approximately 95.degree. C. At ambient temperatures, energy densities of the cells range from approximately 0.7 to 1.8 watt-hour per cubic centimeter. These cells are electrically rechargeable by raising their temperature above the melting point of sodium.