Abstract: A method of forming a nanodiamond article includes forming a continuous film on a substrate using electrophoretic deposition. The continuous film includes greater than 50% nanodiamond concentration by volume. A nanodiamond article includes a continuous film on a substrate having greater than 50% nanodiamond concentration by volume.

Abstract: A method for making a nanodiamond article includes applying an adhesion promoting layer to a substrate, and electrophoretically depositing a nanodiamond film on the substrate with the adhesion promoting layer thereon in a solution to make the nanodiamond article. The nanodiamond article may include a substrate, a nanodiamond film over the substrate, and the adhesion promoting layer between the substrate and the nanodiamond film.

Abstract: A method for making a nanodiamond article includes applying an adhesion promoting layer to a substrate, and electrophoretically depositing a nanodiamond film on the substrate with the adhesion promoting layer thereon in a solution to make the nanodiamond article. The nanodiamond article may include a substrate, a nanodiamond film over the substrate, and the adhesion promoting layer between the substrate and the nanodiamond film.

Abstract: A method for making a nanodiamond article includes applying an adhesion promoting layer to a substrate, and electrophoretically depositing a nanodiamond film on the substrate with the adhesion promoting layer thereon in a solution to make the nanodiamond article. The nanodiamond article may include a substrate, a nanodiamond film over the substrate, and the adhesion promoting layer between the substrate and the nanodiamond film.

Abstract: A method of forming a nanodiamond article includes forming a continuous film on a substrate using electrophoretic deposition. The continuous film includes greater than 50% nanodiamond concentration by volume. A nanodiamond article includes a continuous film on a substrate having greater than 50% nanodiamond concentration by volume.

Abstract: A high reliability battery contact assembly (100) for use in an electronic device includes a battery contact block (103) comprised of a plurality of cantilevered contacts (105, 107, 109). A redundant ground contact (111) is connected to the metallic housing of the electronic device (101) and positioned adjacent to the battery contact block (103). The cantilevered contacts include a primary power contact (105), a sensing contact (107) and a ground contact (109). The battery contact assembly (100) is advantageous in that it requires a very limited amount of surface area while still working to prevent a reset condition of an electronic device that might occur due to a loss in electrical continuity during adverse conditions.

Abstract: A membrane electrode assembly consists of a polymer electrolyte membrane (100) with an electrode on each side. The polymer electrolyte membrane has an integral sensor (115) disposed on the surface. The sensor monitors the physical, thermal, chemical or electrical state of the membrane electrode assembly. Information obtained from the sensor is used to identify a defective membrane electrode assembly, and the operation of the fuel cell is altered based on the identified defective membrane electrode assembly.

Abstract: A high density electrical interconnect is achieved by incorporating a flexible circuit (140) that is removably connected to a low insertion force, ball grid array connector (100). The flexible circuit has a plurality of conductive runners (142), and each of the runners has a termination (144). The terminations are arranged in an array on the end of the flexible circuit. The low insertion force connector consists of a substrate (120) that has a pattern of pads (122) corresponding to the array on one side. The other side of the substrate has a corresponding array (124) that is electrically connected to the pads by conductive vias. An alignment feature (470) aligns the array on the flexible circuit to the pattern of pads on the substrate. Contact between the flexible circuit and the substrate is maintained by a compression means (150) that provides sufficient compressive force (310) to establish electrical connection between the array and the pads.

Abstract: A high density electrical interconnect is achieved by incorporating a flexible circuit (140) that is removably connected to a low insertion force, ball grid array connector (100). The flexible circuit has a plurality of conductive runners (142), and each of the runners has a termination (144). The terminations are arranged in an array on the end of the flexible circuit. The low insertion force connector consists of a substrate (120) that has a pattern of pads (122) corresponding to the array on one side. The other side of the substrate has a corresponding array (124) that is electrically connected to the pads by conductive vias. An alignment feature (470) aligns the array on the flexible circuit to the pattern of pads on the substrate. Contact between the flexible circuit and the substrate is maintained by a compression means (150) that provides sufficient compressive force (310) to establish electrical connection between the array and the pads.

Abstract: A communication device is designed to contain the lowest possible level of toxic or hazardous materials, so that when it is eventually disposed of, it will not harm the environment and can be safely recycled. Each component A.sub.1, A.sub.2, . . . , A.sub.n in the communication device has a calculated Component Toxicity Index value. A Product Toxicity Index for the entire communication device is calculated by summing the individual Component Toxicity Index values. The desired outcome is a communication device having a Product Toxicity Index less than or equal to 100. The resulting communication device is referred to as "environmentally friendly". The communication device may be a two-way radio (10), and some of the components are a radio transmitter (12), a radio receiver (14), an antenna (16), an amplifier (18), a battery (20) and a housing (22).

Abstract: A process for manufacturing a substrate (12) used in a device (10) for containing a liquid crystal fluid (30) between two spaced electrodes. A plurality of spacers (35) is distributed on a first surface of a substrate by coating the first surface with an admixture of spacers dispersed in a liquid (36). The admixture is agitated during the applications step in order to maintain a uniform dispersion of the spacers in the liquid. The liquid is then evaporated from the substrate surface, leaving a plurality of spacers distributed on the substrate. Preferably, an ester alcohol dispersant is employed in the admixture in order to facilitate dispersion of the spacers in the liquid. Ultrasonics are preferred as the means of agitating the admixture during application. Ultrasonic energy can also be applied to the substrate during application of the admixture to the substrate. Ultrasonic energy can also be applied to the admixture at the point of application (44) of the admixture onto the substrate.

Abstract: Solder pastes having vehicles including formic acid-soluble organic acids as fluxing agents are described. Fluxing agents may be compounds of the formula: ##STR1## where R is an electron withdrawing group. In one embodiment, R is selected from the group consisting of fluorine, chlorine, bromine, iodine, sulfur, hydroxyl, nitrile, and benzyl. Other suitable formic-acid fluxing agents include, but are not limited to, adipic acid, acrylic acid, polyacrylic acid, methacrylic acid and polymethacrylic acid. The compounds clean oxides from the printed circuit boards (PCBs) under assembly and then volatilize leaving a residue to be cleaned away. The cleaning step involves rinsing with formic acid. No undesired residue remains indicating that the organic acids of the invention are effective in cleaning boards.

Abstract: Solder pastes having vehicles including blends of low boiling point alcohols and relatively high boiling point alcohols are described which leave residues which may be cleaned using only water are described. The low boiling point alcohols have a boiling point range of between about 65.degree. and about 150.degree. C. whereas the high boiling point alcohols have a boiling point in rhe range of about 150.degree. to about 270.degree. C. The solder pastes also use water-soluble organic acids as fluxing agents such as compounds of the formula: ##STR1## where R is an electron withdrawing group such as fluorine, chlorine, bromine, iodine, sulfur, hydroxyl, nitrile, and benzyl. Other suitable formic-acid fluxing agents include, but are not limited to, adipic acid, polyacrylic acid, methacrylic acid and polymethacrylic acid. The compounds clean oxides from the printed circuit boards (PCBs) under assembly and then volatilze leaving a residue to be cleaned away. The cleaning step involves rinsing with water.

Abstract: A first conductive layer 12 is deposited on the substrate 14. Next, a second conductive layer 16 with a circuit pattern is deposited on the first layer 12. Finally, the first conductive layer 12 not residing under the second conductive layer 16 is etched off, leaving the second layer 16 above the first layer 12.

Abstract: A foldable cap attachment for a pick-up truck equipped with a fifth wheel hitch is disclosed which may be employed to convert the truck box into a rigid, weather-resistant camper body, the attachment being rugged in construction, easy to set up for use, and being readily foldable to a substantially flat rigid, weather-resistant cover for the truck box, said cover allowing attachment of a trailer to the fifth wheel hitch of the pick-up truck.

Abstract: A hinged box which has two hinges protruding from the back of the box, each hinge member composed of five ball elements which are interlocked. Two balls of each group of the five elements have grooves extending across opposite faces of the ball members, at least halfway but not entirely across, which provide pockets for the three other ball members whereby the five ball members are locked securely in a rotatable position to form a hinge. Each of the two parts of the box has at the back two ball elements on one side of the box and three at the other side of the back. A further improvement in the hinged box comprises longitudinal cylindrical bar-like members protruding from the back of each section of the box and resting in grooves on the other section of the box. This construction adds strength and stiffness to the hinge without impairing the smooth action of the hinge when opening and closing the lid on the box.