Patents by Inventor Robert J. Redmond

Robert J. Redmond has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Single lead automatic clamping and bonding system
    Patent number: 4821945
    Abstract: A system of single lead clamping and bonding in the assembly of integrated circuit devices. A capillary bonder has a clamp member rotatably mounted around the capillary for movement with the bond head. The clamp is moveable vertically to contact and clamp a terminal to be bonded. The clamp is rotatable to orient itself with respect to the terminal and the fine wire. The capillary and clamp move under computer control to make a series of bonds, typically between lead frame fingers and terminals on a semiconductor device.
    Type: Grant
    Filed: July 1, 1987
    Date of Patent: April 18, 1989
    Assignee: International Business Machines
    Inventors: Judith A. Chase, Douglas W. Phelps, Jr., Robert J. Redmond, Stephen G. Starr
  • Peripheral/area wire bonding technique
    Patent number: 4796078
    Abstract: An electronic assembly having a semiconductor device back bonded to a first lead frame. An adhesive insulative tape is placed on the first lead frame and the device. A second lead frame is mounted on the adhesive tape. Electrical contacts by wire bonds are established between the device and the first and second lead frames.
    Type: Grant
    Filed: June 15, 1987
    Date of Patent: January 3, 1989
    Assignee: International Business Machines Corporation
    Inventors: Douglas W. Phelps, Jr., Robert J. Redmond, William C. Ward