Abstract: A surface mount ceramic package, e.g. for a microwave or millimeter wave integrated circuit device, has outer conductive pads that are available for direct connection with traces on the printed circuit board. A metal core or base has spaces at one or more sides, e.g., voids or cutouts, where the outer pads are located. There is a first ceramic layer disposed on the core, with a central cavity for the die, and an upper or second ceramic layer. Printed traces are buried between the two layers, and vias connect the traces with the outer pads. Inner pads are located on a ledge of the first layer adjacent the cavity for connection with electrodes of the die. Each of the first and second ceramic layers may be stacked ceramic tape. The package may be LTCC or HTCC. This construction avoids inductive losses, especially at higher frequencies.

Abstract: A surface mount ceramic package, e.g. for a microwave or millimeter wave integrated circuit device, has outer conductive pads that are available for direct connection with traces on the printed circuit board. A metal core or base has spaces at one or more sides, e.g., voids or cutouts, where the outer pads are located. There is a first ceramic layer disposed on the core, with a central cavity for the die, and an upper or second ceramic layer. Printed traces are buried between the two layers, and vias connect the traces with the outer pads. Inner pads are located on a ledge of the first layer adjacent the cavity for connection with electrodes of the die. Each of the first and second ceramic layers may be stacked ceramic tape. The package may be LTCC or HTCC. This construction avoids inductive losses, especially at higher frequencies.