Patents by Inventor Robert John Kanda

Robert John Kanda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10830364
    Abstract: A valve body comprises an inner compartment extending along a longitudinal axis from a second end portion towards a first end portion. First, second, and third fluid ports in to the valve body are perpendicular to the longitudinal axis. The second fluid port is between the third and the first fluid port. A fourth fluid port is parallel to the longitudinal axis. A spool is configured to selectively reciprocate in the inner compartment. The spool comprises a first fluid receptacle configured to block fluid flow to the third fluid port and to fluidly communicate with the second fluid port when the spool adjoins the first end portion. The first fluid receptacle is configured to fluidly communicate with the second fluid port and with the third fluid port when the spool adjoins the second end portion. A second fluid receptacle is configured to receive fluid pressure from the fourth fluid port.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: November 10, 2020
    Assignee: Eaton Intelligent Power Limited
    Inventors: Robert John Kanda, Todd K. Coulter, Daniel William Bamber
  • Publication number: 20180156345
    Abstract: A valve body comprises an inner compartment extending along a longitudinal axis from a second end portion towards a first end portion. First, second, and third fluid ports in to the valve body are perpendicular to the longitudinal axis. The second fluid port is between the third and the first fluid port. A fourth fluid port is parallel to the longitudinal axis. A spool is configured to selectively reciprocate in the inner compartment. The spool comprises a first fluid receptacle configured to block fluid flow to the third fluid port and to fluidly communicate with the second fluid port when the spool adjoins the first end portion. The first fluid receptacle is configured to fluidly communicate with the second fluid port and with the third fluid port when the spool adjoins the second end portion. A second fluid receptacle is configured to receive fluid pressure from the fourth fluid port.
    Type: Application
    Filed: April 28, 2016
    Publication date: June 7, 2018
    Applicant: EATON CORPORATION
    Inventors: Robert John Kanda, Todd K. Coulter, Daniel William Bamber
  • Patent number: 8474824
    Abstract: A method of assembling a pressure sensing module includes affixing a pressure sensor unit to an alignment tool and indexing the alignment tool to a circuit board. After the pressure sensor unit is attached to the circuit board, a seal plate is indexed thereto. A locator feature indexes receptacle elements on the circuit board, alignment tool, and seal plate. An integrated seal module includes a mounting plate having first and second opposing faces, and at least one locator hole and one or more pressure passages extending therethrough. A unitary seal member effects a fluid seal between the pressure ports and the first face and the pressure sources and the second face. A seal member and locator bushings may be formed as a single, continuous liquid injection molded framework, including portions encased by the mounting plate. Pressure passages provide fluid to pressure sensors, which may be overmolded in the mounting plate.
    Type: Grant
    Filed: November 10, 2008
    Date of Patent: July 2, 2013
    Assignee: Eaton Corporation
    Inventors: Mark Louis Dell'Eva, Robert John Kanda, Eugene Francis Moody
  • Publication number: 20110079085
    Abstract: An integrated fluid pressure sensor system includes a printed circuit board, a pressure manifold having a pressure source, and a sensor. The printed circuit board may be coupled to a pressure manifold. The printed circuit board and the pressure manifold may define a pressure cavity. The pressure source can be operatively configured to release fluid into the pressure cavity. The sensor may be affixed to the printed circuit board within the pressure cavity. The sealing member may be disposed between the printed circuit board and the pressure manifold. The gasket may be operatively configured to seal the pressure cavity.
    Type: Application
    Filed: October 6, 2009
    Publication date: April 7, 2011
    Inventors: Robert John Kanda, Mark Louis Dell'Eva, Steven Lee Ambrose
  • Publication number: 20100117308
    Abstract: A method of assembling a pressure sensing module includes affixing a pressure sensor unit to an alignment tool and indexing the alignment tool to a circuit board. After the pressure sensor unit is attached to the circuit board, a seal plate is indexed thereto. A locator feature indexes receptacle elements on the circuit board, alignment tool, and seal plate. An integrated seal module includes a mounting plate having first and second opposing faces, and at least one locator hole and one or more pressure passages extending therethrough. A unitary seal member effects a fluid seal between the pressure ports and the first face and the pressure sources and the second face. A seal member and locator bushings may be formed as a single, continuous liquid injection molded framework, including portions encased by the mounting plate. Pressure passages provide fluid to pressure sensors, which may be overmolded in the mounting plate.
    Type: Application
    Filed: November 10, 2008
    Publication date: May 13, 2010
    Applicant: EATON CORPORATION
    Inventors: Mark Louis Dell'Eva, Robert John Kanda, Eugene Francis Moody