Patents by Inventor Robert John Sykes
Robert John Sykes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11904556Abstract: A bond tester apparatus arranged for determining a strength of a bond and/or a material present on a base, said bond tester apparatus comprising a force measurement module for applying a shear force to said bond and/or said material, and a displacement module and a controller arranged for controlling the distance between the force measurement module and the displacement module such that the shear height of a shear tool can be set.Type: GrantFiled: June 4, 2019Date of Patent: February 20, 2024Assignee: XYZTEC B.V.Inventors: Arjen Hoeflaak, Cornelis Bartholomeus Maria Van Mil, Robert John Sykes
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Patent number: 11112350Abstract: A method for testing a bond using a bond tester apparatus, the method comprising the steps of applying a mechanical force to the bond, determining, by a sensor component comprised by the bond tester apparatus, the applied force to the bond by measuring, by the sensor component, a displacement of the sensor component caused by the applied force and calculating, by the sensor component, the applied force on the basis of a first component which comprises a direct relationship with the measured displacement and on the basis of at least one of a second component, a third component and a fourth component.Type: GrantFiled: December 6, 2016Date of Patent: September 7, 2021Assignee: XYZTEC B.V. [NL/NL]Inventor: Robert John Sykes
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Publication number: 20210229371Abstract: A bond tester apparatus arranged for determining a strength of a bond and/or a material present on a base, said bond tester apparatus comprising a force measurement module for applying a shear force to said bond and/or said material, and a displacement module and a controller arranged for controlling the distance between the force measurement module and the displacement module such that the shear height of a shear tool can be set.Type: ApplicationFiled: June 4, 2019Publication date: July 29, 2021Applicant: XYZTEC B.V.Inventors: Arjen Hoeflaak, Cornelis Bartholomeus Maria Van Mil, Robert John Sykes
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Publication number: 20190072441Abstract: Sensor apparatus for determining a deformation due to creep in an output of a sensor, said sensor apparatus comprising force means arranged for applying a mechanical force to said sensor, said sensor arranged for measuring, in a current measurement, a displacement of said sensor caused by said applied force and a processor component arranged for determining said deformation due to creep for a next measurement by said sensor.Type: ApplicationFiled: February 10, 2017Publication date: March 7, 2019Inventor: Robert John SYKES
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Publication number: 20180364151Abstract: A method for determining a strength of a bond and/or a material using a bond tester apparatus, said method comprising the steps of applying a mechanical force to said bond, determining, by a sensor component comprised by said bond tester apparatus, said applied force to said bond by measuring, by said sensor component, a displacement of said sensor component caused by said applied force and calculating, by said sensor component, said applied force on the basis of a first component which comprises a direct relationship with said measured displacement and on the basis of at least one of a second component, a third component and a fourth component.Type: ApplicationFiled: December 6, 2016Publication date: December 20, 2018Inventor: Robert John SYKES
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Patent number: 9170189Abstract: A testing apparatus for testing the strength of a material connection to a substrate. A drive mechanism couples a test tool mount to a main body and allows for relative movement between the test tool mount and the main body in an axial direction. A biasing element is coupled between the main body and the test tool mount, that, in operation, biases the test tool mount relative to the main body in an axial direction. The biasing element is switchable between a first state in which the test tool mount is biased either toward or away from the substrate and another state in which the biasing element provides one of: no biasing force to the test tool mount toward or away from the substrate, or a biasing force in a direction opposite to the direction of bias applied in the first state.Type: GrantFiled: March 25, 2014Date of Patent: October 27, 2015Assignee: Nordson CorporationInventors: David Lilley, Martin Bugg, Robert John Sykes
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Publication number: 20140190269Abstract: A testing apparatus for testing the strength of a material connection to a substrate. A drive mechanism couples a test tool mount to a main body and allows for relative movement between the test tool mount and the main body in an axial direction. A biasing element is coupled between the main body and the test tool mount, that, in operation, biases the test tool mount relative to the main body in an axial direction. The biasing element is switchable between a first state in which the test tool mount is biased either toward or away from the substrate and another state in which the biasing element provides one of: no biasing force to the test tool mount toward or away from the substrate, or a biasing force in a direction opposite to the direction of bias applied in the first state.Type: ApplicationFiled: March 25, 2014Publication date: July 10, 2014Applicant: NORDSON CORPORATIONInventors: David Lilley, Martin Bugg, Robert John Sykes
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Patent number: 8714025Abstract: A bond strength testing apparatus comprising a main body, a test tool mount for holding a test tool, and an axial drive mechanism including a screw and nut assembly. The drive mechanism couples the test tool mount to the main body and allows for relative movement between the test tool mount and the main body in an axial direction. A backlash control element is coupled to the main body and the test tool mount, and, in operation, biases the test tool mount relative to the main body in an axial direction. The backlash control element is switchable between a first state in which the test tool mount is biased in a first axial direction by the backlash control element, and a second state in which either the test tool mount is biased in a second axial direction by backlash control element, or the backlash control element applies no biasing force to test tool mount. The apparatus can be automated to apply the appropriate backlash control for a particular, selected test type.Type: GrantFiled: February 24, 2011Date of Patent: May 6, 2014Assignee: Nordson CorporationInventors: David Lilley, Martin Bugg, Robert John Sykes
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Patent number: 8646337Abstract: A tensile testing machine has a jaw which includes a unitary ‘H’ section member having a cross piece and two uprights. The cross piece is mounted to a cantilever beam which is supported on the test machine and has force measuring elements. A pneumatic actuator applies tensile forces to the first ends of the uprights via strands to urge the first ends apart. When first ends of the uprights are urged apart, their oppositely disposed second ends are urged together to grip a sample deposit to be pulled off a substrate in a tensile test. In use, the jaws can be moved at speed, in the order of 500 mm/s to pull the deposit off of the substrate. The force required to pull the deposit off the substrate in this tensile test is measured by the force measuring elements on the beam.Type: GrantFiled: December 15, 2011Date of Patent: February 11, 2014Assignee: Nordson CorporationInventor: Robert John Sykes
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Patent number: 8607641Abstract: A shear test device for testing the strength of attachment between a bond and an electronic substrate. The device incorporates a clamping mechanism and a shear test tool that are mounted on a baseplate. During a set-up procedure, the shear test tool is movable relative to the baseplate. During a test procedure, the shear test tool is clamped by the clamping mechanism in a fixed position relative to the baseplate. At least one abutment is provided that is fixed in position relative to the baseplate. During the test procedure, a drive mechanism provides relative movement between the shear test tool and the bond to cause the shear test tool to shear the bond off the substrate. The at least one abutment provides an additional clamping force on the test tool while the test tool is shearing the bond off of the substrate.Type: GrantFiled: March 26, 2013Date of Patent: December 17, 2013Assignee: Nordson CorporationInventors: David Lilley, Martin Bugg, Robert John Sykes
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Patent number: 8424390Abstract: A shear test device for testing the strength of attachment between a bond and an electronic substrate. The device incorporates a clamping mechanism and a shear test tool that are mounted on a baseplate. During a set-up procedure, the shear test tool is movable relative to the baseplate. During a test procedure, the shear test tool is clamped by the clamping mechanism in a fixed position relative to the baseplate. At least one abutment is provided that is fixed in position relative to the baseplate. During the test procedure, a drive mechanism provides relative movement between the shear test tool and the bond to cause the shear test tool to shear the bond off the substrate. The at least one abutment provides an additional clamping force on the test tool while the test tool is shearing the bond off of the substrate. Strain gauges associated with the shear test tool provide signals to an electric circuit indicating the strength of attachment between the bond and the substrate.Type: GrantFiled: February 25, 2011Date of Patent: April 23, 2013Assignee: Nordson CorporationInventors: David Lilley, Martin Bugg, Robert John Sykes
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Patent number: 8312777Abstract: Shear test apparatus for gold and solder balls of a semiconductor substrate comprises a support element (21) on which is provided a piezo-electric crystal (24) in the direct shear load path. The crystal (24) may have a shield (25). The interface between shield and crystal, and crystal and support element may include an epoxy resin layer to distribute force and retain the components as a unit.Type: GrantFiled: June 30, 2011Date of Patent: November 20, 2012Assignee: Nordson CorporationInventor: Robert John Sykes
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Publication number: 20120204654Abstract: A tensile testing machine has a jaw which includes a unitary ‘H’ section member having a cross piece and two uprights. The cross piece is mounted to a cantilever beam which is supported on the test machine and has force measuring elements. A pneumatic actuator applies tensile forces to the first ends of the uprights via strands to urge the first ends apart. When first ends of the uprights are urged apart, their oppositely disposed second ends are urged together to grip a sample deposit to be pulled off a substrate in a tensile test. In use, the jaws can be moved at speed, in the order of 500 mm/s to pull the deposit off of the substrate. The force required to pull the deposit off the substrate in this tensile test is measured by the force measuring elements on the beam.Type: ApplicationFiled: December 15, 2011Publication date: August 16, 2012Applicant: NORDSON CORPORATIONInventor: Robert John Sykes
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Patent number: 8100021Abstract: A tensile testing machine has a jaw which includes a unitary ‘H’ section member having a cross piece and two uprights. The cross piece is mounted to a cantilever beam which is supported on said test machine and has force measuring elements. A pneumatic actuator applies tensile forces to the first ends of the jaw via strands to urge the first ends apart. When first ends of the uprights are urged apart, their oppositely disposed second ends are urged together to grip a sample deposit to be pulled off a substrate in a tensile test. In use, the jaws can be moved at speed, in the order of 500 mm/s to pull the deposit off of the substrate. The force required to pull the deposit off the substrate in this tensile test is measured by the force measuring elements on the beam.Type: GrantFiled: July 3, 2007Date of Patent: January 24, 2012Assignee: Nordson CorporationInventor: Robert John Sykes
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Publication number: 20110271767Abstract: Shear test apparatus for gold and solder balls of a semiconductor substrate comprises a support element (21) on which is provided a piezo-electric crystal (24) in the direct shear load path. The crystal (24) may have a shield (25). The interface between shield and crystal, and crystal and support element may include an epoxy resin layer to distribute force and retain the components as a unit.Type: ApplicationFiled: June 30, 2011Publication date: November 10, 2011Applicant: NORDSON CORPORATIONInventor: Robert John Sykes
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Patent number: 8015883Abstract: A device and method for tensile testing of the bond strength of an electrically conductive ball adhered to a substrate. A ball is gripped and moved at a speed in a direction substantially orthogonal to the plane of adherence. The substrate is abruptly halted by an abutment to impose a sudden load on the ball/substrate interface. During the test the substrate is lightly urged toward the ball to eliminate unwanted tensile forces.Type: GrantFiled: December 7, 2010Date of Patent: September 13, 2011Assignee: Dage Precision Industries Ltd.Inventors: Benjamin Kingsley Stuart Peecock, Robert John Sykes, Alan Norman Wiltshire
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Publication number: 20110214510Abstract: A shear test device for testing the strength of attachment between a bond and an electronic substrate. The device incorporates a clamping mechanism and a shear test tool that are mounted on a baseplate. During a set-up procedure, the shear test tool is movable relative to the baseplate. During a test procedure, the shear test tool is clamped by the clamping mechanism in a fixed position relative to the baseplate. At least one abutment is provided that is fixed in position relative to the baseplate. During the test procedure, a drive mechanism provides relative movement between the shear test tool and the bond to cause the shear test tool to shear the bond off the substrate. The at least one abutment provides an additional clamping force on the test tool while the test tool is shearing the bond off of the substrate. Strain gauges associated with the shear test tool provide signals to an electric circuit indicating the strength of attachment between the bond and the substrate.Type: ApplicationFiled: February 25, 2011Publication date: September 8, 2011Applicant: NORDSON CORPORATIONInventors: David Lilley, Martin Bugg, Robert John Sykes
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Publication number: 20110214507Abstract: A bond strength testing apparatus comprising a main body, a test tool mount for holding a test tool, and an axial drive mechanism including a screw and nut assembly. The drive mechanism couples the test tool mount to the main body and allows for relative movement between the test tool mount and the main body in an axial direction. A backlash control element is coupled to the main body and the test tool mount, and, in operation, biases the test tool mount relative to the main body in an axial direction. The backlash control element is switchable between a first state in which the test tool mount is biased in a first axial direction by the backlash control element, and a second state in which either the test tool mount is biased in a second axial direction by backlash control element, or the backlash control element applies no biasing force to test tool mount. The apparatus can be automated to apply the appropriate backlash control for a particular, selected test type.Type: ApplicationFiled: February 24, 2011Publication date: September 8, 2011Applicant: NORDSON CORPORATIONInventors: David Lilley, Martin Bugg, Robert John Sykes
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Patent number: 7997147Abstract: Shear test apparatus for gold and solder balls of a semiconductor substrate comprises a support element (21) on which is provided a piezo-electric crystal (24) in the direct shear load path. The crystal (24) may have a shield (25). The interface between shield and crystal, and crystal and support element may include an epoxy resin layer to distribute force and retain the components as a unit.Type: GrantFiled: April 21, 2010Date of Patent: August 16, 2011Assignee: Nordson CorporationInventor: Robert John Sykes
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Patent number: 7950290Abstract: A method and apparatus for determining a mode of failure of a bond between an electrically conductive ball deposit and a substrate when breaking the ball deposit off of the substrate. The method and apparatus utilize tool force and displacement values to plot a force/displacement curve. The force/displacement curve is used to calculate the energy necessary to break the ball deposit off of the substrate. The energy value of a portion of a force/displacement curve is selected by reference to a peak force. In one preferred embodiment, this energy value is compared with a predetermined reference energy value to indicate a mode of failure. The peak force is preferably the maximum peak force, in the preferred embodiment, the method and apparatus distinguish between a ductile failure mode and a brittle failure mode.Type: GrantFiled: May 12, 2010Date of Patent: May 31, 2011Assignee: Nordson CorporationInventor: Robert John Sykes