Abstract: Embodiments described herein provide for a sensing device including a sensor die attached to a header. The header has a first working surface composed of a first one or more electrically conductive pads and a bulk of the header. The sensor die has a second working surface and a third surface reverse of the second working surface. The sensor die includes a sensing element on the second working surface, and the third surface of the sensor die is composed of a second one or more electrically conductive pads and a dielectric layer. The first one or more electrically conductive pads of the header contact the second one or more electrically conductive pads of the sensor die, and the bulk of the header at the first working surface of the header contacts the dielectric layer of the third surface of the sensor die.

Abstract: A sensor is provided. The sensor includes a conductive substrate having side-walls; a dielectric layer overlaying a first surface of the conductive substrate, the dielectric layer including a gate dielectric having a first thickness and a field dielectric having a second thickness; a sensing layer overlaying a first surface of the gate dielectric; a non-conductive carrier wherein a second surface of the conductive substrate overlays a portion of the non-conductive carrier; and an insulating layer conformally coating at least the side-walls of the conductive substrate, wherein a first surface of the sensing layer is uncoated by the insulating layer.

Abstract: The invention is directed to a patterned aerogel-based layer that serves as a mold for at least part of a microelectromechanical feature. The density of an aerogel is less than that of typical materials used in MEMS fabrication, such as poly-silicon, silicon oxide, single-crystal silicon, metals, metal alloys, and the like. Therefore, one may form structural features in an aerogel-based layer at rates significantly higher than the rates at which structural features can be formed in denser materials. The invention further includes a method of patterning an aerogel-based layer to produce such an aerogel-based mold. The invention further includes a method of fabricating a microelectromechanical feature using an aerogel-based mold. This method includes depositing a dense material layer directly onto the outline of at least part of a microelectromechanical feature that has been formed in the aerogel-based layer.

Abstract: Embodiments described herein provide for a sensing device including a sensor die attached to a header. The header has a first working surface composed of a first one or more electrically conductive pads and a bulk of the header. The sensor die has a second working surface and a third surface reverse of the second working surface. The sensor die includes a sensing element on the second working surface, and the third surface of the sensor die is composed of a second one or more electrically conductive pads and a dielectric layer. The first one or more electrically conductive pads of the header contact the second one or more electrically conductive pads of the sensor die, and the bulk of the header at the first working surface of the header contacts the dielectric layer of the third surface of the sensor die.

Abstract: The invention is directed to a patterned aerogel-based layer that serves as a mold for at least part of a microelectromechanical feature. The density of an aerogel is less than that of typical materials used in MEMS fabrication, such as poly-silicon, silicon oxide, single-crystal silicon, metals, metal alloys, and the like. Therefore, one may form structural features in an aerogel-based layer at rates significantly higher than the rates at which structural features can be formed in denser materials. The invention further includes a method of patterning an aerogel-based layer to produce such an aerogel-based mold. The invention further includes a method of fabricating a microelectromechanical feature using an aerogel-based mold. This method includes depositing a dense material layer directly onto the outline of at least part of a microelectromechanical feature that has been formed in the aerogel-based layer.