Patents by Inventor Robert KNELLER

Robert KNELLER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11806392
    Abstract: The present embodiments provide compositions and methods related to novel recombinant protein immunogens, comprising specific portions of alpha helical domains (aHD) and proline rich regions (PRD) of pneumococcal surface protein A (PspA), which portions are linked to provide aHD-PRD constructs. The aHD and PRD proteins constituting the aHD-PRD constructs are selected to maximize cross-reactivity and provide protection against a broad spectrum of pneumococcal serotypes. Immunogenic compositions, including vaccines, comprising at least one aHD PRD construct may also include a non-linked aHD portion. Also provided are recombinant nucleic acid molecules that encode aHD-PRD constructs, vectors and recombinant host cells containing such molecules, aHD-PRD expression products, use of such nucleic acid molecules to express aHD-PRD constructs by recombinant techniques, and use of the expression products to elicit an immune or protective response against pneumococcal disease in a suitable host.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: November 7, 2023
    Assignees: The UAB Research Foundation, The University of Tokyo
    Inventors: David E. Briles, Hiroshi Kiyono, Robert Kneller, Reshmi Mukerji, Kristopher Genschmer, Yoshikazu Yuki
  • Patent number: 10878990
    Abstract: An embedded magnetic component device includes a magnetic core located in a cavity in an insulating substrate. An electrical winding includes inner and outer conductive connectors. An inner solid bonded joint boundary is located between first and second portions of the insulating substrate and extends between the cavity and the inner conductive connectors. An outer solid bonded joint boundary is located between the first and the second portions of the insulating substrate extends between the cavity and the outer conductive connectors. The minimum distance of the inner solid bonded joint boundary between any of the inner conductive connectors and the inner interior wall of the cavity is defined as D1, and the minimum distance of the outer solid bonded joint boundary between any of the outer conductive connectors and the outer interior wall of the cavity is defined as D2. D1 and D2 are about 0.4 mm or more.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: December 29, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Quinn Robert Kneller, Scott Andrew Parish, Justin Morgan
  • Publication number: 20190351043
    Abstract: The present embodiments provide compositions and methods related to novel recombinant protein immunogens, comprising specific portions of alpha helical domains (aHD) and proline rich regions (PRD) of pneumococcal surface protein A (PspA), which portions are linked to provide aHD-PRD constructs. The aHD and PRD proteins constituting the aHD-PRD constructs are selected to maximize cross-reactivity and provide protection against a broad spectrum of pneumococcal serotypes. Immunogenic compositions, including vaccines, comprising at least one aHD PRD construct may also include a non-linked aHD portion. Also provided are recombinant nucleic acid molecules that encode aHD-PRD constructs, vectors and recombinant host cells containing such molecules, aHD-PRD expression products, use of such nucleic acid molecules to express aHD-PRD constructs by recombinant techniques, and use of the expression products to elicit an immune or protective response against pneumococcal disease in a suitable host.
    Type: Application
    Filed: December 1, 2017
    Publication date: November 21, 2019
    Applicants: The UAB Research Foundation, The University of Tokyo
    Inventors: David E. BRILES, Hiroshi KIYONO, Robert KNELLER, Reshmi MUKERJI, Kristopher GENSCHMER, Yoshikazu YUKI
  • Publication number: 20190267180
    Abstract: An embedded magnetic component device includes a magnetic core located in a cavity in an insulating substrate. An electrical winding includes inner and outer conductive connectors. An inner solid bonded joint boundary is located between first and second portions of the insulating substrate and extends between the cavity and the inner conductive connectors. An outer solid bonded joint boundary is located between the first and the second portions of the insulating substrate extends between the cavity and the outer conductive connectors. The minimum distance of the inner solid bonded joint boundary between any of the inner conductive connectors and the inner interior wall of the cavity is defined as D1, and the minimum distance of the outer solid bonded joint boundary between any of the outer conductive connectors and the outer interior wall of the cavity is defined as D2. D1 and D2 are about 0.4 mm or more.
    Type: Application
    Filed: May 15, 2019
    Publication date: August 29, 2019
    Inventors: Quinn Robert KNELLER, Scott Andrew PARISH, Justin MORGAN
  • Patent number: 10319509
    Abstract: An embedded magnetic component device includes a magnetic core located in a cavity in an insulating substrate. An electrical winding includes inner and outer conductive connectors. An inner solid bonded joint boundary is located between first and second portions of the insulating substrate and extends between the cavity and the inner conductive connectors. An outer solid bonded joint boundary is located between the first and the second portions of the insulating substrate extends between the cavity and the outer conductive connectors. The minimum distance of the inner solid bonded joint boundary between any of the inner conductive connectors and the inner interior wall of the cavity is defined as D1, and the minimum distance of the outer solid bonded joint boundary between any of the outer conductive connectors and the outer interior wall of the cavity is defined as D2. D1 and D2 are about 0.4 mm or more.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: June 11, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Quinn Robert Kneller, Scott Andrew Parish, Justin Morgan
  • Publication number: 20190088404
    Abstract: An embedded magnetic component device includes a magnetic core located in a cavity in an insulating substrate. An electrical winding includes inner and outer conductive connectors. An inner solid bonded joint boundary is located between first and second portions of the insulating substrate and extends between the cavity and the inner conductive connectors. An outer solid bonded joint boundary is located between the first and the second portions of the insulating substrate extends between the cavity and the outer conductive connectors. The minimum distance of the inner solid bonded joint boundary between any of the inner conductive connectors and the inner interior wall of the cavity is defined as D1, and the minimum distance of the outer solid bonded joint boundary between any of the outer conductive connectors and the outer interior wall of the cavity is defined as D2. D1 and D2 are about 0.4 mm or more.
    Type: Application
    Filed: November 20, 2018
    Publication date: March 21, 2019
    Inventors: Quinn Robert KNELLER, Scott Andrew Parish, Justin Morgan
  • Patent number: 10224143
    Abstract: An embedded magnetic component device includes a magnetic core located in a cavity in an insulating substrate. An electrical winding includes inner and outer conductive connectors. An inner solid bonded joint boundary is located between first and second portions of the insulating substrate and extends between the cavity and the inner conductive connectors. An outer solid bonded joint boundary is located between the first and the second portions of the insulating substrate extends between the cavity and the outer conductive connectors. The minimum distance of the inner solid bonded joint boundary between any of the inner conductive connectors and the inner interior wall of the cavity is defined as D1, and the minimum distance of the outer solid bonded joint boundary between any of the outer conductive connectors and the outer interior wall of the cavity is defined as D2. D1 and D2 are about 0.4 mm or more.
    Type: Grant
    Filed: August 13, 2015
    Date of Patent: March 5, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Quinn Robert Kneller, Scott Andrew Parish, Justin Morgan
  • Publication number: 20160049236
    Abstract: An embedded magnetic component device includes a magnetic core located in a cavity in an insulating substrate. An electrical winding includes inner and outer conductive connectors. An inner solid bonded joint boundary is located between first and second portions of the insulating substrate and extends between the cavity and the inner conductive connectors. An outer solid bonded joint boundary is located between the first and the second portions of the insulating substrate extends between the cavity and the outer conductive connectors. The minimum distance of the inner solid bonded joint boundary between any of the inner conductive connectors and the inner interior wall of the cavity is defined as D1, and the minimum distance of the outer solid bonded joint boundary between any of the outer conductive connectors and the outer interior wall of the cavity is defined as D2. D1 and D2 are about 0.4 mm or more.
    Type: Application
    Filed: August 13, 2015
    Publication date: February 18, 2016
    Inventors: Quinn Robert KNELLER, Scott Andrew PARISH, Justin MORGAN