Patents by Inventor Robert KNELLER
Robert KNELLER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11806392Abstract: The present embodiments provide compositions and methods related to novel recombinant protein immunogens, comprising specific portions of alpha helical domains (aHD) and proline rich regions (PRD) of pneumococcal surface protein A (PspA), which portions are linked to provide aHD-PRD constructs. The aHD and PRD proteins constituting the aHD-PRD constructs are selected to maximize cross-reactivity and provide protection against a broad spectrum of pneumococcal serotypes. Immunogenic compositions, including vaccines, comprising at least one aHD PRD construct may also include a non-linked aHD portion. Also provided are recombinant nucleic acid molecules that encode aHD-PRD constructs, vectors and recombinant host cells containing such molecules, aHD-PRD expression products, use of such nucleic acid molecules to express aHD-PRD constructs by recombinant techniques, and use of the expression products to elicit an immune or protective response against pneumococcal disease in a suitable host.Type: GrantFiled: December 1, 2017Date of Patent: November 7, 2023Assignees: The UAB Research Foundation, The University of TokyoInventors: David E. Briles, Hiroshi Kiyono, Robert Kneller, Reshmi Mukerji, Kristopher Genschmer, Yoshikazu Yuki
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Patent number: 10878990Abstract: An embedded magnetic component device includes a magnetic core located in a cavity in an insulating substrate. An electrical winding includes inner and outer conductive connectors. An inner solid bonded joint boundary is located between first and second portions of the insulating substrate and extends between the cavity and the inner conductive connectors. An outer solid bonded joint boundary is located between the first and the second portions of the insulating substrate extends between the cavity and the outer conductive connectors. The minimum distance of the inner solid bonded joint boundary between any of the inner conductive connectors and the inner interior wall of the cavity is defined as D1, and the minimum distance of the outer solid bonded joint boundary between any of the outer conductive connectors and the outer interior wall of the cavity is defined as D2. D1 and D2 are about 0.4 mm or more.Type: GrantFiled: May 15, 2019Date of Patent: December 29, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Quinn Robert Kneller, Scott Andrew Parish, Justin Morgan
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Publication number: 20190351043Abstract: The present embodiments provide compositions and methods related to novel recombinant protein immunogens, comprising specific portions of alpha helical domains (aHD) and proline rich regions (PRD) of pneumococcal surface protein A (PspA), which portions are linked to provide aHD-PRD constructs. The aHD and PRD proteins constituting the aHD-PRD constructs are selected to maximize cross-reactivity and provide protection against a broad spectrum of pneumococcal serotypes. Immunogenic compositions, including vaccines, comprising at least one aHD PRD construct may also include a non-linked aHD portion. Also provided are recombinant nucleic acid molecules that encode aHD-PRD constructs, vectors and recombinant host cells containing such molecules, aHD-PRD expression products, use of such nucleic acid molecules to express aHD-PRD constructs by recombinant techniques, and use of the expression products to elicit an immune or protective response against pneumococcal disease in a suitable host.Type: ApplicationFiled: December 1, 2017Publication date: November 21, 2019Applicants: The UAB Research Foundation, The University of TokyoInventors: David E. BRILES, Hiroshi KIYONO, Robert KNELLER, Reshmi MUKERJI, Kristopher GENSCHMER, Yoshikazu YUKI
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Publication number: 20190267180Abstract: An embedded magnetic component device includes a magnetic core located in a cavity in an insulating substrate. An electrical winding includes inner and outer conductive connectors. An inner solid bonded joint boundary is located between first and second portions of the insulating substrate and extends between the cavity and the inner conductive connectors. An outer solid bonded joint boundary is located between the first and the second portions of the insulating substrate extends between the cavity and the outer conductive connectors. The minimum distance of the inner solid bonded joint boundary between any of the inner conductive connectors and the inner interior wall of the cavity is defined as D1, and the minimum distance of the outer solid bonded joint boundary between any of the outer conductive connectors and the outer interior wall of the cavity is defined as D2. D1 and D2 are about 0.4 mm or more.Type: ApplicationFiled: May 15, 2019Publication date: August 29, 2019Inventors: Quinn Robert KNELLER, Scott Andrew PARISH, Justin MORGAN
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Patent number: 10319509Abstract: An embedded magnetic component device includes a magnetic core located in a cavity in an insulating substrate. An electrical winding includes inner and outer conductive connectors. An inner solid bonded joint boundary is located between first and second portions of the insulating substrate and extends between the cavity and the inner conductive connectors. An outer solid bonded joint boundary is located between the first and the second portions of the insulating substrate extends between the cavity and the outer conductive connectors. The minimum distance of the inner solid bonded joint boundary between any of the inner conductive connectors and the inner interior wall of the cavity is defined as D1, and the minimum distance of the outer solid bonded joint boundary between any of the outer conductive connectors and the outer interior wall of the cavity is defined as D2. D1 and D2 are about 0.4 mm or more.Type: GrantFiled: November 20, 2018Date of Patent: June 11, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Quinn Robert Kneller, Scott Andrew Parish, Justin Morgan
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Publication number: 20190088404Abstract: An embedded magnetic component device includes a magnetic core located in a cavity in an insulating substrate. An electrical winding includes inner and outer conductive connectors. An inner solid bonded joint boundary is located between first and second portions of the insulating substrate and extends between the cavity and the inner conductive connectors. An outer solid bonded joint boundary is located between the first and the second portions of the insulating substrate extends between the cavity and the outer conductive connectors. The minimum distance of the inner solid bonded joint boundary between any of the inner conductive connectors and the inner interior wall of the cavity is defined as D1, and the minimum distance of the outer solid bonded joint boundary between any of the outer conductive connectors and the outer interior wall of the cavity is defined as D2. D1 and D2 are about 0.4 mm or more.Type: ApplicationFiled: November 20, 2018Publication date: March 21, 2019Inventors: Quinn Robert KNELLER, Scott Andrew Parish, Justin Morgan
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Patent number: 10224143Abstract: An embedded magnetic component device includes a magnetic core located in a cavity in an insulating substrate. An electrical winding includes inner and outer conductive connectors. An inner solid bonded joint boundary is located between first and second portions of the insulating substrate and extends between the cavity and the inner conductive connectors. An outer solid bonded joint boundary is located between the first and the second portions of the insulating substrate extends between the cavity and the outer conductive connectors. The minimum distance of the inner solid bonded joint boundary between any of the inner conductive connectors and the inner interior wall of the cavity is defined as D1, and the minimum distance of the outer solid bonded joint boundary between any of the outer conductive connectors and the outer interior wall of the cavity is defined as D2. D1 and D2 are about 0.4 mm or more.Type: GrantFiled: August 13, 2015Date of Patent: March 5, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Quinn Robert Kneller, Scott Andrew Parish, Justin Morgan
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Publication number: 20160049236Abstract: An embedded magnetic component device includes a magnetic core located in a cavity in an insulating substrate. An electrical winding includes inner and outer conductive connectors. An inner solid bonded joint boundary is located between first and second portions of the insulating substrate and extends between the cavity and the inner conductive connectors. An outer solid bonded joint boundary is located between the first and the second portions of the insulating substrate extends between the cavity and the outer conductive connectors. The minimum distance of the inner solid bonded joint boundary between any of the inner conductive connectors and the inner interior wall of the cavity is defined as D1, and the minimum distance of the outer solid bonded joint boundary between any of the outer conductive connectors and the outer interior wall of the cavity is defined as D2. D1 and D2 are about 0.4 mm or more.Type: ApplicationFiled: August 13, 2015Publication date: February 18, 2016Inventors: Quinn Robert KNELLER, Scott Andrew PARISH, Justin MORGAN