Abstract: A structure includes a substrate including a wafer or a portion thereof; and a piezoelectric bulk material layer comprising a first portion deposited onto the substrate and a second portion deposited onto the first portion, the second portion comprising an outer surface having a surface roughness (Ra) of 4.5 nm or less. Methods for depositing a piezoelectric bulk material layer include depositing a first portion of bulk layer material at a first incidence angle to achieve a predetermined c-axis tilt, and depositing a second portion of the bulk material layer onto the first portion at a second incidence angle that is smaller than the first incidence angle. The second portion has a second c-axis tilt that substantially aligns with the first c-axis tilt.

Abstract: A method is provided for detecting interference in a radar system. The method includes transmitting, by a transmitter of the radar system, a sequence of radar pulses at a regular interval with a rest period following each radar pulse of the sequence of radar pulses. The transmitter is disabled during each rest period. A receiver is enabled to receive reflected radar pulses from a target during the rest period following each radar pulse of the sequence of radar pulses. Some of the radar pulses are selected to be omitted and not transmitted. The receiver is still enabled during the rest periods following the omitted transmission pulses. Any reflected pulses received during the rest periods following the omitted transmission pulses may be an indication of a targeted interference of the radar system. In another embodiment, a radar system is provided.

Abstract: A handheld work apparatus includes a motor, a transmission shaft, a tool, a guide tube, a housing, and a first anti-vibration element. The motor via the transmission shaft drives the tool. The transmission shaft is received in the guide tube. The motor is disposed in the housing. The tool is disposed on a front longitudinal end of the guide tube. The housing is disposed on the rear longitudinal end of the guide tube. The housing at least partially encompasses the guide tube, wherein the guide tube projects from the housing. The first anti-vibration element is disposed such that it acts in a vibration-decoupling manner between the housing and the guide tube. The first anti-vibration element is disposed on that side of the motor facing the tool. The handheld work apparatus includes a second anti-vibration element connecting the motor to the housing in an at least indirectly vibration-decoupled manner.

Abstract: A pole sander is provided including an elongate body including a passageway for passage of air, an electric motor, and a sanding head attached via a pivot mechanism to a first end of the elongate body. The sanding head includes a hood including a plate and a sidewall to form a chamber, an output spindle projecting from the hood and rotatably driven by the electric motor, and a tubular passage including a first end forming an opening and a second end coupled to an aperture formed through the plate. A flexible pipe is disposed between the passageway at the first end of the elongate body and the opening of the tubular passage to fluidly connect the passageway to the chamber. The tubular passage is oriented at least partially around a portion of the output spindle in a turning direction of the output spindle and extending angularly from the plate.

Abstract: A structure includes a substrate including a wafer or a portion thereof; and a piezoelectric bulk material layer comprising a first portion deposited onto the substrate and a second portion deposited onto the first portion, the second portion comprising an outer surface having a surface roughness (Ra) of 4.5 nm or less. Methods for depositing a piezoelectric bulk material layer include depositing a first portion of bulk layer material at a first incidence angle to achieve a predetermined c-axis tilt, and depositing a second portion of the bulk material layer onto the first portion at a second incidence angle that is smaller than the first incidence angle. The second portion has a second c-axis tilt that substantially aligns with the first c-axis tilt.

Abstract: Methods for depositing bulk layer crystalline material having a predetermined c-axis tilt on a substrate include a first step of depositing a first portion of bulk layer material at a first incidence angle to achieve a predetermined c-axis tilt, and a second step of depositing a second portion of the bulk material layer onto the first portion at a second incidence angle that is smaller than the first incidence angle. The second portion has a second c-axis tilt that substantially aligns with the first c-axis tilt.

Abstract: The present disclosure provides an automated pathfinding system and method designed or adapted to minimize or eliminate exposure to detection, firepower, radiation or use of cover and concealment when mapping in a digital twin environment.

Abstract: A structure includes a substrate including a wafer or a portion thereof; and a piezoelectric bulk material layer comprising a first portion deposited onto the substrate and a second portion deposited onto the first portion, the second portion comprising an outer surface having a surface roughness (Ra) of 4.5 nm or less. Methods for depositing a piezoelectric bulk material layer include depositing a first portion of bulk layer material at a first incidence angle to achieve a predetermined c-axis tilt, and depositing a second portion of the bulk material layer onto the first portion at a second incidence angle that is smaller than the first incidence angle. The second portion has a second c-axis tilt that substantially aligns with the first c-axis tilt.

Abstract: Bulk acoustic wave resonator structures include a bulk layer with inclined c-axis hexagonal crystal structure piezoelectric material supported by a substrate. The bulk layer may be prepared without first depositing a seed layer on the substrate. The bulk material layer has a c-axis tilt of about 32 degrees or greater. The bulk material layer may exhibit a ratio of shear coupling to longitudinal coupling of 1.25 or greater during excitation. A method for preparing a crystalline bulk layer having a c-axis tilt includes depositing a bulk material layer directly onto a substrate at an off-normal incidence. The deposition conditions may include a pressure of less than 5 mTorr and a deposition angle of about 35 degrees to about 85 degrees.

Abstract: A structure includes a substrate including a wafer or a portion thereof; and a piezoelectric bulk material layer comprising a first portion deposited onto the substrate and a second portion deposited onto the first portion, the second portion comprising an outer surface having a surface roughness (Ra) of 4.5 nm or less. Methods for depositing a piezoelectric bulk material layer include depositing a first portion of bulk layer material at a first incidence angle to achieve a predetermined c-axis tilt, and depositing a second portion of the bulk material layer onto the first portion at a second incidence angle that is smaller than the first incidence angle. The second portion has a second c-axis tilt that substantially aligns with the first c-axis tilt.

Abstract: Bulk acoustic wave resonator structures include a bulk layer with inclined c-axis hexagonal crystal structure piezoelectric material supported by a substrate. The bulk layer may be prepared without first depositing a seed layer on the substrate. The bulk material layer has a c-axis tilt of about 32 degrees or greater. The bulk material layer may exhibit a ratio of shear coupling to longitudinal coupling of 1.25 or greater during excitation. A method for preparing a crystalline bulk layer having a c-axis tilt includes depositing a bulk material layer directly onto a substrate at an off-normal incidence. The deposition conditions may include a pressure of less than 5 mTorr and a deposition angle of about 35 degrees to about 85 degrees.

Abstract: A structure includes a substrate including a wafer or a portion thereof; and a piezoelectric bulk material layer comprising a first portion deposited onto the substrate and a second portion deposited onto the first portion, the second portion comprising an outer surface having a surface roughness (Ra) of 4.5 nm or less. Methods for depositing a piezoelectric bulk material layer include depositing a first portion of bulk layer material at a first incidence angle to achieve a predetermined c-axis tilt, and depositing a second portion of the bulk material layer onto the first portion at a second incidence angle that is smaller than the first incidence angle. The second portion has a second c-axis tilt that substantially aligns with the first c-axis tilt.

Abstract: Bulk acoustic wave resonator structures include a bulk layer with inclined c-axis hexagonal crystal structure piezoelectric material supported by a substrate. The bulk layer may be prepared without first depositing a seed layer on the substrate. The bulk material layer has a c-axis tilt of about 32 degrees or greater. The bulk material layer may exhibit a ratio of shear coupling to longitudinal coupling of 1.25 or greater during excitation. A method for preparing a crystalline bulk layer having a c-axis tilt includes depositing a bulk material layer directly onto a substrate at an off-normal incidence. The deposition conditions may include a pressure of less than 5 mTorr and a deposition angle of about 35 degrees to about 85 degrees.

Abstract: Methods for depositing bulk layer crystalline material having a predetermined c-axis tilt on a substrate include a first step of depositing a first portion of bulk layer material at a first incidence angle to achieve a predetermined c-axis tilt, and a second step of depositing a second portion of the bulk material layer onto the first portion at a second incidence angle that is smaller than the first incidence angle. The second portion has a second c-axis tilt that substantially aligns with the first c-axis tilt.

Abstract: The present disclosure relates to a Wafer-Level-Packaged (WLP) Bulk Acoustic Wave (BAW) device that includes a BAW resonator, a WLP enclosure, and a surface mount connection structure. The BAW resonator includes a piezoelectric layer with an opening and a bottom electrode lead underneath the piezoelectric layer, such that a portion of the bottom electrode lead is exposed through the opening of the piezoelectric layer. The WLP enclosure includes a cap and an outer wall that extends from the cap toward the piezoelectric layer to form a cavity. The opening of the piezoelectric layer is outside the cavity. The surface mount connection structure covers a portion of a top surface of the cap and extends continuously over a side portion of the WLP enclosure and to the exposed portion of the bottom electrode lead through the opening of the piezoelectric layer.

Abstract: A method for producing an anchoring rail with a rail body and an anchoring body includes arranging a fastening body, which has an opening, in the interior of the rail body. The anchoring body is passed through a passage opening in the rail body and the anchoring body is connected in a cohesive manner to the fastening body and to the rail body at the same time in one joining process.

Abstract: The present disclosure relates to a Wafer-Level-Packaged (WLP) Bulk Acoustic Wave (BAW) device that includes a BAW resonator, a WLP enclosure, and a surface mount connection structure. The BAW resonator includes a piezoelectric layer with an opening and a bottom electrode lead underneath the piezoelectric layer, such that a portion of the bottom electrode lead is exposed through the opening of the piezoelectric layer. The WLP enclosure includes a cap and an outer wall that extends from the cap toward the piezoelectric layer to form a cavity. The opening of the piezoelectric layer is outside the cavity. The surface mount connection structure covers a portion of a top surface of the cap and extends continuously over a side portion of the WLP enclosure and to the exposed portion of the bottom electrode lead through the opening of the piezoelectric layer.

Abstract: The present invention relates to methods and systems for producing, previewing and publishing a video press release (“VPR”) over an electronic network. A video press release comprises multimedia information. A software transcoder that performs the function of removing incompatibilities between video file formats and text document file formats for producing, previewing and publishing a VPR is implemented. The present invention assures multimedia compatibility of a VPR across video file formats, web browser formats, computer operating systems, and text file formats by transcoding a video file, as well as compressing, resizing and juxtaposing/transposing the transcoded video file along with a text presentation received from a text file, and presenting the so-produced VPR to Internet audience.

Abstract: The present invention relates to methods and systems for producing, previewing and publishing a video press release (“VPR”) over an electronic network. A video press release comprises multimedia information. A software transcoder that performs the function of removing incompatibilities between video file formats and text document file formats for producing, previewing and publishing a VPR is implemented. The present invention assures multimedia compatibility of a VPR across video file formats, web browser formats, computer operating systems, and text file formats by transcoding a video file, as well as compressing, resizing and juxtaposing/transposing the transcoded video file along with a text presentation received from a text file, and presenting the so-produced VPR to Internet audience.