Abstract: Embodiments disclosed herein are directed to a rapidly deploying transportable power system for generating power. The rapidly deploying transportable power system embodiment disclosed herein can have a plurality of frame members containing a plurality of solar panels. Any embodiments of the rapidly deploying transportable power system can also have a transport enclosure configured to support the plurality of frame members and a rail system coupleable with the transport enclosure, the rail system being configured to support the plurality of frame members outside of the transport enclosure. In any embodiments, the plurality of frame members can be positionable within the transport enclosure with one frame member positionable above another frame member. Furthermore, the plurality of frame members can be movable along the rail system to positions outside of the transport enclosure along the track system.

Abstract: Embodiments disclosed herein are directed to a rapidly deploying transportable power system for generating power. The rapidly deploying transportable power system embodiment disclosed herein can have a plurality of frame members containing a plurality of solar panels. Any embodiments of the rapidly deploying transportable power system can also have a transport enclosure configured to support the plurality of frame members and a rail system coupleable with the transport enclosure, the rail system being configured to support the plurality of frame members outside of the transport enclosure. In any embodiments, the plurality of frame members can be positionable within the transport enclosure with one frame member positionable above another frame member. Furthermore, the plurality of frame members can be movable along the rail system to positions outside of the transport enclosure along the track system.

Abstract: Embodiments disclosed herein are directed to a rapidly deploying transportable power system for generating power. The rapidly deploying transportable power system embodiment disclosed herein can have a plurality of frame members containing a plurality of solar panels. Any embodiments of the rapidly deploying transportable power system can also have a transport enclosure configured to support the plurality of frame members and a rail system coupleable with the transport enclosure, the rail system being configured to support the plurality of frame members outside of the transport enclosure. In any embodiments, the plurality of frame members can be positionable within the transport enclosure with one frame member positionable above another frame member. Furthermore, the plurality of frame members can be movable along the rail system to positions outside of the transport enclosure along the track system.

Abstract: Embodiments disclosed herein are directed to a rapidly deploying transportable power system for generating power. The rapidly deploying transportable power system embodiment disclosed herein can have a plurality of frame members containing a plurality of solar panels. Any embodiments of the rapidly deploying transportable power system can also have a transport enclosure configured to support the plurality of frame members and a rail system coupleable with the transport enclosure, the rail system being configured to support the plurality of frame members outside of the transport enclosure. In any embodiments, the plurality of frame members can be positionable within the transport enclosure with one frame member positionable above another frame member. Furthermore, the plurality of frame members can be movable along the rail system to positions outside of the transport enclosure along the track system.

Abstract: A method for preparing a bonding pad on an integrated circuit wafer by the steps of depositing a conductive seed layer (104) on the bonding pad; depositing a metal layer (301, 302, and 303) over a portion of the conductive seed layer; and immersing the wafer in an etchant solution (501) to remove the portion of the seed layer not covered by the metal layer. The etchant solution contains a chelating agent that bonds ions from the seed layer. When the seed layer is copper or a refractory metal, and the metal layer is gold or palladium, the preferred chelating agent is selected from, but is not limited to, but is not limited to, the families of ethylenediaminetetraacetic acids (EDTA), 8-hydroxy-quinolines, including 8-hydroxy-quinoline-5-sulfonic acid, porphyrins, and phthalocyanines.