Patents by Inventor Robert L. Bontz

Robert L. Bontz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5689608
    Abstract: A method of increasing the attachment bond strength between a first and second object comprising respective first and second materials is disclosed. Each of the first and second materials has a respective first coefficient of thermal expansion at an assembly temperature, and a second coefficient of thermal expansion at an operational temperature. The method has various steps (FIG. 4). An attachment surface of the first material is configured to be nonplanar (FIGS. 3a, 36, 37). The second material is brought to a contact point with the attachment surface of the first material (FIGS. 3b, 46). The first and second materials are heated at the contact point to the assembly temperature whereby at least one of the materials is caused to flow in response to the heat.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: November 18, 1997
    Assignee: Alcatel Network Systems, Inc.
    Inventors: Andrew J. Moore, David L. Ma, Robert L. Bontz, Harry B. Bonham, Jr.
  • Patent number: 5509952
    Abstract: In one embodiment, the present invention includes a method of increasing the attachment bond strength between a first and second object comprising respective first and second materials. Each of the first and second materials has a respective first coefficient of thermal expansion at an assembly temperature, and a second coefficient of thermal expansion at an operational temperature. The method has various steps (FIG. 4). An attachment surface of the first material is configured to be nonplanar (FIG. 3a, 36, 37). The second material is brought to a contact point with the attachment surface of the first material (FIG. 3b, 46). The first and second materials are heated at the contact point to the assembly temperature whereby at least one of the materials is caused to flow in response to the heat.
    Type: Grant
    Filed: June 6, 1994
    Date of Patent: April 23, 1996
    Assignee: Alcatel Network Systems, Inc.
    Inventors: Andrew J. Moore, David L. Ma, Robert L. Bontz, Harry B. Bonham, Jr.
  • Patent number: 5351329
    Abstract: In one embodiment, the present invention includes a method of installing an optic fiber in an optics package, wherein the tip of the fiber extends from a sleeve. In one step, a point of the fiber proximate its tip is affixed in a retaining member adjacent a device for communicating signals through the fiber. In a second step, a flexible member is disposed between the retaining member and the sleeve and in axial alignment with the fiber. In a third step, the optic fiber is positioned in the optics package after the step of affixing the fiber in place with the respect to the communicating device. In another embodiment, the present invention includes an optics assembly including an optic fiber having a tip extending from a sleeve and a device for communicating signals through the fiber. The assembly further includes a retaining member for affixing the fiber tip proximate the device for communicating signals through the fiber.
    Type: Grant
    Filed: December 22, 1992
    Date of Patent: September 27, 1994
    Assignee: Alcatel Network Systems, Inc.
    Inventors: Andrew J. Moore, David L. Ma, Robert L. Bontz, Charles C. Burns
  • Patent number: 5301251
    Abstract: The invention disclosed includes both a method and apparatus for affixing an optic fiber tip in position with respect to a fiber communications circuit. In one embodiment of the method, a glass positioning member is located proximate the tip of the optic fiber. In another step, the glass positioning member is affixed to the fiber at a first position with respect to the fiber tip. The glass positioning member is also affixed in a second position with respect to the carrier. In a more detailed embodiment, the method of the present invention includes positioning the optic fiber through a channel of the glass positioning member. Heat is applied to the glass positioning member causing it to soften such that its channel collapses around and fuses to the fiber. In still further detail, the fused positioning member/fiber are affixed to a block, and the block is fused to a carrier.
    Type: Grant
    Filed: December 15, 1992
    Date of Patent: April 5, 1994
    Assignee: Alcatel Network Systems, Inc.
    Inventors: Andrew J. Moore, David L. S. Ma, Robert L. Bontz, Harry B. Bonham, Jr.