Abstract: A method and apparatus for separating particles preferentially accelerates particles to a rotating collector, which then reliably conveys collected particles to a discharge with minimal re-entrainment of the particles in the fluid stream. The collector minimizes energy transfer to the fluid and maximizes separation under conditions of high particle loading, fine particle content, or both. The separator may be operated in any vertical, horizontal or oblique orientation, or within devices whose orientation varies over time.

Abstract: A system for treating carbon-containing or silicon-containing end-of-life material includes a reactor 10 for simultaneously supporting oxidation of the waste material and conversion of CO2 within the reactor. A metal oxide or metal is input to the reactor to convert the CO2 to a mineralized CO2 product. A cold trap 44 is provided for capturing exhaust gases from the reactor and returning condensate to the reactor, and a pump 50 maintains a desired vacuum or pressure within the reactor and the cold trap.

Abstract: A system for combusting carbon-containing fuel includes a reactor 10 for simultaneously supporting oxidation of the fuel and conversion of CO2 within the reactor. A metal oxide or metal is input to the reactor to convert the CO2 to a mineralized CO2 product. A cold trap 44 is provided for capturing exhaust gases from the reactor and returning condensate to the reactor, and a gas pump 50 maintains a desired vacuum or pressure within the reactor and the cold trap. Combustion products may be recycled to increase their energy value.

Abstract: A method and apparatus for separating particles preferentially accelerates particles to a rotating collector, which then reliably conveys collected particles to a discharge with minimal re-entrainment of the particles in the fluid stream. The collector minimizes energy transfer to the fluid and maximizes separation under conditions of high particle loading, fine particle content, or both. The separator may be operated in any vertical, horizontal or oblique orientation, or within devices whose orientation varies over time.

Abstract: A method and apparatus for separating particles preferentially accelerates particles to a rotating collector, which then reliably conveys collected particles to a discharge with minimal re-entrainment of the particles in the fluid stream. The collector minimizes energy transfer to the fluid and maximizes separation under conditions of high particle loading, fine particle content, or both. The separator may be operated in any vertical, horizontal or oblique orientation, or within devices whose orientation varies over time.

Abstract: A method and apparatus for separating particles preferentially accelerates particles to a rotating collector, which then reliably conveys collected particles to a discharge with minimal re-entrainment of the particles in the fluid stream. The collector minimizes energy transfer to the fluid and maximizes separation under conditions of high particle loading, fine particle content, or both. The separator may be operated in any vertical, horizontal or oblique orientation, or within devices whose orientation varies over time.

Abstract: In accordance with a specific embodiment of the present invention, a method of forming a gate dielectric is disclosed. A semiconductor wafer is placed in a deposition chamber. The semiconductor wafer is heated and a precursor gas is flowed into the chamber. In one embodiment, the precursor comprises a moiety of silicon, oxygen, and a transition metal. In another embodiment, the moiety includes a group 2 metal.

Abstract: A method and apparatus for detecting copper (Cu) contamination on the backside of a wafer (120) begins by providing the wafer (120). The wafer (120) is rotated about a rotational axis via a motor/computer controlled wafer stage (118). In addition to rotation of the wafer (120), motor/computer control of a monochromator (116) is used to raster scan an X-ray beam (114b) across a surface of the rotating wafer (120). A plurality of X-ray detectors (122) are arrayed in one or more rows in close proximity to the scanned surface of the semiconductor wafer (120). The detectors (122), detect X-ray fluorescence emission from the surface of the wafer (120) whereby copper contamination of the wafer (120) can be determined in an accurate and time efficient manner which enables contamination detection in-line with normal wafer processing.