Patents by Inventor Robert L. Opila, Jr.

Robert L. Opila, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical interconnection by a composite medium
    Patent number: 5045249
    Abstract: Electrical interconnections are made by means of a layer or sheet medium comprising chains of magnetically aligned, electrically conducting particles in a nonconducting matrix material. End particles of chains protrude from a surface of the medium, thereby enhancing electrical contact properties of the medium. The medium can be used for temporary as well as permanent connections; in the latter case the use of a nonconductive adhesive material is convenient for physical attachment to contacts on both sides of the medium.
    Type: Grant
    Filed: February 9, 1988
    Date of Patent: September 3, 1991
    Assignee: AT&T Bell Laboratories
    Inventors: Sungho Jin, John J. Mottine, Jr., Robert L. Opila, Jr., Richard C. Sherwood, Thomas H. Tiefel, William C. Vesperman