Abstract: In example implementations, an apparatus is provided. The apparatus includes an interface, a graphics card connected to the interface, and a controller communicatively coupled to the interface. The graphics card includes an air moving device. The controller is to send a logic control to the graphics card to activate the air moving device in response to a performance parameter.

Abstract: In an example implementation according to aspects of the present disclosure, an electronic assembly comprises a chassis including a wall and a component section. The electronic assembly comprises a printed circuit board (PCB) having an inset that forms a gap between the PCB and the wall of the chassis to enable fluid to flow along the wall of the chassis from a first region of the electronic assembly located adjacent to a first side of the PCB to a second region of the electronic assembly located adjacent to a second side of the PCB. The electronic assembly also includes a fluid mover to move fluid, via the inset, from the first region of the electronic assembly to the component section located in the second region of the electronic assembly.

Abstract: A processor cooling system may include a processor, a shell having an interior thermally coupled to the processor to receive heat from the processor and a mass of solid to liquid (STL) phase change material filling the shell.

Abstract: An example heat transfer apparatus includes a first heatsink, having a first thermal resistance, to remove heat from a first component, a second heatsink, having a second thermal resistance different from the first thermal resistance, to remove heat from a second component, and a mounting structure supporting the first heatsink to couple the first heatsink to the first component. The second heatsink is supported by the first heatsink to couple the second heatsink to the second component.

Abstract: A voltage regulator assembly can include a voltage regulator to provide power to a processor. The voltage regulator can occupy a volumetric space and includes a voltage regulator component grouping within the volumetric space. The voltage regulator assembly can include a heat dissipater with a heat absorption end portion thermally coupled to the voltage regulator. The heat dissipater can be routed along the voltage regulator and into an enlarged spacing between the voltage regulator component groupings. The heat absorption end portion of the heat dissipater can be positioned within the volumetric space of the voltage regulator. The heat dissipater can include a heat rejection end portion that is routed outside of the volumetric space of the voltage regulator.

Abstract: A method of regulating power consumption per core within a multi-core package may include estimating power draw for each core within the multi-core processing system. Estimating the power draw for each core within the multi-core processing system may include dividing a total power draw of the multi-core processing system by a number of active cores operating within the multi-core processing system multiplied by a percent utilization of the multi-core processing system. The method may include determining a thermal margin for the multi-core processing system, and instigating a lower power limit for the multi-core processing system in response to a determination that the thermal margin reduces to a predetermined level.

Abstract: An air duct is described herein. The air duct includes a duct housing having a first end and a second end and at least one vent disposed between the first end and the second end. The air duct also includes a plurality of dividers disposed between the first end and the second end and a plurality of channels. The plurality of channels are disposed between the first end and the second end and are derived from the plurality of dividers. The plurality of channels are to cool a first component and a second component of a computing device, wherein the duct housing is to encompass the first component and the second component. The duct housing is positioned with the first component located upstream of an air flow and the second component disposed downstream of the air flow.

Abstract: An air duct is described herein. The air duct includes a duct housing having a first end and a second end and at least one vent disposed between the first end and the second end. The air duct also includes a plurality of dividers disposed between the first end and the second end and a plurality of channels. The plurality of channels are disposed between the first end and the second end and are derived from the plurality of dividers. The plurality of channels are to cool a first component and a second component of a computing device, wherein the duct housing is to encompass the first component and the second component. The duct housing is positioned with the first component located upstream of an air flow and the second component disposed downstream of the air flow.

Abstract: Examples disclosed herein relate to conversion of an object for a hardware device into health control information. Examples include acquiring, from an object-oriented database, an object for a hardware device including an operational parameter value determined by the hardware device. Examples further include converting the object into health control information useable by a health controller.

Abstract: Examples disclosed herein relate to conversion of an object for a hardware device into health control information. Examples include acquiring, from an object-oriented database, an object for a hardware device including an operational parameter value determined by the hardware device. Examples further include converting the object into health control information useable by a health controller.

Abstract: A daughterboard can include an airflow path or opening.

Abstract: Examples disclose a removable air guide assembly with a processor air cooler to direct air over a processor on a circuit board, the processor air cooler is not directly aligned over the processor. Further, the examples provide the removable airflow guide assembly with memory bank coolers to direct air over memory banks also positioned on the circuit board. Additionally, the examples also disclose the removable airflow guide assembly with a connector socket to align with the circuit board and provide power to the processor air cooler and the memory bank coolers.

Abstract: Example embodiments disclosed herein relate to identifying a target fan connected to a computing device. In example embodiments, the target fan may be identified based on a fan speed profile of the target fan.

Abstract: A daughterboard can include an airflow path or opening.

Abstract: Examples disclose a removable air guide assembly with a processor air cooler to direct air over a processor on a circuit board, the processor air cooler is not directly aligned over the processor. Further, the examples provide the removable airflow guide assembly with memory bank coolers to direct air over memory banks also positioned on the circuit board. Additionally, the examples also disclose the removable airflow guide assembly with a connector socket to align with the circuit board and provide power to the processor air cooler and the memory bank coolers.

Abstract: Example embodiments disclosed herein relate to identifying a target fan connected to a computing device. In example embodiments, the target fan may be identified based on a fan speed profile of the target fan.

Abstract: A heat transfer system is provided. The system includes a heat sink disposed proximate a first circuit. An air mover is adapted to provide airflow, and at least a portion of the airflow can flow through the heat sink along a flow path having a path length. A first portion of the airflow flows along the entire path length through the heat sink. A remaining portion of the airflow exits the heat sink prior to flowing the entire path length.

Abstract: A heat transfer system is provided. The system includes a heat sink disposed proximate a first circuit. An air mover is adapted to provide airflow, and at least a portion of the airflow can flow through the heat sink along a flow path having a path length. A first portion of the airflow flows along the entire path length through the heat sink. A remaining portion of the airflow exits the heat sink prior to flowing the entire path length.