Abstract: A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an edge emitting optical diode, a reflecting mirror, a monitor diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has three through-holes formed through a thickness of the non-electrically conductive substrate. The three through-holes are filled with an electrically conductive material so as to form three electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into three regions. The first and third regions have the electrically conductive plating material applied thereto.

Abstract: A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an edge emitting optical diode, a reflecting mirror, a monitor diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has three through-holes formed through a thickness of the non-electrically conductive substrate. The three through-holes are filled with an electrically conductive material so as to form three electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into three regions. The first and third regions have the electrically conductive plating material applied thereto.

Abstract: A device which is surface mountable to a printed circuit board. The device includes a housing, an optical sub-assembly, and an electrical connector. The housing includes a fiber optic connector receptacle and a bottom side. The housing is made of an electrically conductive material. The optical sub-assembly is associated with the fiber optic connector receptacle. The electrical connector has contacts, where some portions of the contacts extend into the housing and some portions of the contacts extend from the housing. A portion of the contacts being in a same plane with the bottom side of the housing.

Abstract: The transceiver includes a housing, a transmitting optical sub-assembly mounted in the housing, a receiving optical sub-assembly mounted in the housing, a first electrical connector associated with the transmitting optical sub-assembly, a second electrical connector associated with the receiving optical sub-assembly, and an electromagnetic shield mounted on the housing. The housing includes a first fiber optic connector receptacle, a second fiber optic connector receptacle, and a first side, and the housing is made of an electrically conductive material.

Abstract: The transceiver includes a housing, a transmitting optical sub-assembly mounted in the housing, a receiving optical sub-assembly mounted in the housing, a first electrical connector associated with the transmitting optical sub-assembly, a second electrical connector associated with the receiving optical sub-assembly, and an electro-magnetic shield mounted on the housing. The housing includes a first fiber optic connector receptacle, a second fiber optic connector receptacle, and a first side, and the housing is made of an electrically conductive material.

Abstract: An analog phase modulator is provided for linearly phase modulating a high carrier frequency input signal in proportion to an applied bias signal. A first variable reactance network, including at least a pair of variable reactance devices separated by an approximately 1/4 wave length transmission line segment, is capacitively coupled to an in-phase port of a power divider network, and a second identical variable reactance network is capacitively coupled to a quadrature phase shifted port of the power divider network. A bias source signal is applied to each of the first and second variable reactance networks through identical bias filters, each including a high impedance transmission line segment serially connected between the bias source and the variable reactance network, and a low impedance transmission line segment shunt segment at the juncture of the high impedance transmission line segment and the bias source input port.