Abstract: A very small electronic device adapted for inverted mounting to a circuit board includes a multiplicity of capacitors and resistors built on a substrate. The capacitors and resistors are interconnected so as to provide multiple RC circuits in various circuit arrangements. The multiple layers of the device are covered by an encapsulate having openings to expose terminal pads of the RC circuits. The openings are filled with solder to produce the individual terminations of the device in a ball grid array (BGA). The device saves cost and/or board space in the manufacture of larger electronic equipment through the elimination of multiple discrete components. In addition, very low inductance is achieved due to the close proximity of the device to a circuit board on which it is mounted.

Abstract: A chemical vapor transport reactor gas dispersion disk (20) for counteracting vapor pressure gradients to provide a uniform deposition of material films on a semiconductor slice (37). The disk (20) has a number of apertures (22) arranged so as to increase in aperture area per unit of disk area when extending from the center of the disk (20) to its outer peripheral edge.