Abstract: The invention relates to a polyamide composition for the production of electrical and electronic components that are suitable for the conditions of the surface mounting technology. In particular, the composition exhibits a high resistance to blistering during the reflow soldering process. The composition according to the invention comprises (a) a polyamide having a melting point higher than 280° C., (b) a polymer having a melting point lower than 230° C., (c) a halogen-containing compound, (d) optionally a synergist for the flame-retardant properties (e) reinforcing material (f) optionally other additives. A particularly good resistance to blistering is achieved if (f) contains at least a compound with acid imide groups.

Abstract: The invention relates to electrical and electronic components made of a polyamide composition and possessing an improved resistance under soldering conditions, particularly when the surface mounting technique is used. This is achieved by using a polyamide composition whose main chain essentially consists of units derived from aliphatic dicarboxylic acids and diamines or .alpha.,.omega.-amino acids, and in which 1-40% of the chain units are derived from 1,6-cyclohexanedicarboxylic acid and an aliphatic diamine, or from 1,4-cyclohexanediamine and an aliphatic dicarboxylic acid.As a result, the temperature at which blisters are formed during soldering by the infrared method is 20-30.degree. C. higher than in the case of the homo-polyamide.

Abstract: A flame retardant polyamide composition including flame retardant effective amounts of (a) an iron compound and (b) a char forming thermoplastic polymer having aromatic groups in the backbone. A char stabilizing compound (c) may also be present. In a preferred embodiment (b) is a polyphenylene ether. In a preferred embodiment, (c) is anhydrous zinc borate or a wollastonite.