Abstract: A micro-electro-mechanical system (MEMS) device and a manufacturing method are provided. The device includes top and bottom cap wafers and a MEMS wafer disposed between the top cap wafer and the bottom cap wafer. The top, bottom and MEMS wafers define sidewalls of a cavity. A MEMS structure is housed within the cavity and is movable relative to the top and bottom caps. At least one electrode is provided in one of the wafers, the electrode being operatively coupled to the MEMS structure to detect or induce a movement thereof. A support structure extends through the cavity from the top cap wafer to the bottom cap wafer to prevent bowing in the top cap and bottom cap wafers.

Abstract: A MEMS and a method of manufacturing MEMS components are provided. The method includes providing a MEMS wafer stack including a top cap wafer, a MEMS wafer and optionally a bottom cap wafer. The MEMS wafer has MEMS structures patterned therein. The MEMS wafer and the cap wafers include insulated conducting channels forming insulated conducting pathways extending within the wafer stack. The wafer stack is bonded to an integrated circuit wafer having electrical contacts on its top side, such that the insulated conducting pathways extend from the integrated circuit wafer to the outer side of the top cap wafer. Electrical contacts on the outer side of the top cap wafer are formed and are electrically connected to the respective insulated conducting channels of the top cap wafer. The MEMS wafer stack and the integrated circuit wafer are then diced into components having respective sealed chambers and MEMS structures housed therein.

Abstract: A MEMS device is provided. The device includes a MEMS wafer, a top cap wafer and a bottom cap wafer. The top and bottom cap wafers are respectively bonded to first and second sides of the MEMS wafer, the MEMS and cap wafers being electrically conductive. The outer side of the top cap wafer is provided with electrical contacts. The MEMS wafer, the top cap wafer and the bottom cap wafer define a cavity for housing a MEMS structure. The device includes insulated conducting pathways extending from within the bottom cap wafer, through the MEMS wafer and through the top cap wafer. The pathways are connected to the respective electrical contacts on the top cap wafer, for routing electrical signals from the bottom cap wafer to the electrical contacts on the top cap wafer. A method of manufacturing the MEMS device is also provided.

Abstract: A MEMS motion sensor and its manufacturing method are provided. The sensor includes a MEMS wafer including a proof mass and flexible springs suspending the proof mass and enabling the proof mass to move relative to an outer frame along mutually orthogonal x, y and z axes. The sensor includes top and bottom cap wafers including top and bottom cap electrodes forming capacitors with the proof mass, the electrodes being configured to detect a motion of the proof mass. Electrical contacts are provided on the top cap wafer, some of which are connected to the respective top cap electrodes, while others are connected to the respective bottom cap electrodes by way of insulated conducting pathways, extending along the z axis from one of the respective bottom cap electrodes and upward successively through the bottom cap wafer, the outer frame of the MEMS wafer and the top cap wafer.

Abstract: A MEMS device is provided. The device includes a MEMS wafer, a top cap wafer and a bottom cap wafer. The top and bottom cap wafers are respectively bonded to first and second sides of the MEMS wafer, the MEMS and cap wafers being electrically conductive. The outer side of the top cap wafer is provided with electrical contacts. The MEMS wafer, the top cap wafer and the bottom cap wafer define a cavity for housing a MEMS structure. The device includes insulated conducting pathways extending from within the bottom cap wafer, through the MEMS wafer and through the top cap wafer. The pathways are connected to the respective electrical contacts on the top cap wafer, for routing electrical signals from the bottom cap wafer to the electrical contacts on the top cap wafer. A method of manufacturing the MEMS device is also provided.

Abstract: The present invention relates generally to a High Efficiency MEMS Micro-Vibrational Energy Harvester (?VEH) having a thick beam bimorph architecture. The disclosed architecture is capable of producing a voltage of sufficient magnitude such that the requirement to connect a plurality of harvesters in series to produce an adequate voltage magnitude is eliminated.

Abstract: The present invention relates generally to a High Efficiency MEMS Micro-Vibrational Energy Harvester (?VEH) having a thick beam bimorph architecture. The disclosed architecture is capable of producing a voltage of sufficient magnitude such that the requirement to connect a plurality of harvesters in series to produce an adequate voltage magnitude is eliminated.

Abstract: A compact, high resolution, bright and long life modulator for projection displays, mates a field emission array (FEA) with a deformable light valve modulator (DLVM) of reflective operation in a thin vacuum package. The DLVM includes a continuous film mirror layer formed on or between one or more deformable layers on a transparent substrate. The field emitters (at least one per pixel) are driven to deliver primary electrons that strike and deposit a charge that produces electrostatic forces that locally deform the continuous film mirror layer. Because the mirror layer is a continuous film, i.e. not pixelated, the modulator resolution is limited only by the addressing resolution of the FEA. Mating the FEA and DLVM technologies also reduces the drive voltage requirements associated with typical FEA driven phosphor displays and scanned beam DLVMs thus improving their performance and extending the lifetime of each.

Abstract: A method for printing or exposing photosensitive media is disclosed herein. The method uses standard spatial light modulators with standard addressing circuitry. The data is written to the device for the first row, the photosensitive media is exposed to the light reflected from the device, and the device is turned off. The data from the first row is then written to the second line of the device, and new data is loaded into the first line of the device. The media is again exposed. This is repeated until the entire region of the drum is completely exposed. The device can be repositioned to cover a different region of the drum and the process would be repeated.

Abstract: A spatial light modulator (40,70,80,90,130) operable in the analog mode for light beam steering or scanning applications. A deflectable mirror (42, 72) and which may be hexagonal (92, 132) is supported by a torsion hinge (44,86,94) ends along a torsion axis. A plurality of flexure hinges (48,82,106) are provided to support the ends of the mirror (42,72,92,132) and provide a restoration force. The combination of the torsion hinges and the flexure hinges realizes a deflectable pixel that is operable in the linear range for a large range of address voltages. The flexure hinges also maintain a flat undeflected state when no address voltage is applied, and prevent the pixel from collapsing. The pixel may be reinforced, such as about its perimeter (74) to ensure mirror flatness and prevent warping, even during extreme deflections of the mirror. The pixel is electrostatically deflected by applying an address voltage to an underlying address electrode (60,96,98).