Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: An extremely versatile laser diode assembly is provided, the assembly comprised of a plurality of laser diode subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual laser diode subassembly output beams do not interfere with one another.

Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: An extremely versatile diode laser assembly is provided, the assembly comprised of a plurality of diode laser subassemblies mounted to a stepped cooling block. The stepped cooling block allows the fabrication of a close packed and compact assembly in which individual diode laser subassembly output beams do not interfere with one another.

Abstract: A heat sink for cooling a diode-laser bar on a gallium arsenide (GaAs) substrate includes a water-cooled copper body. A layer of a metal having a coefficient of expansion (CTE) about equal to or greater than that of gallium arsenide but less than that of copper is bonded to each of two opposite surfaces of the body. A layer of copper is bonded each of the lower-CTE layers. The copper layers each have a thickness less than that of the lower-CTE layers and are under tensile strain. This provides that when a GaAs diode-laser bar is soldered to the heat sink the copper layers do not expand any more than the lower-CTE layers differential expansion between the copper and the lower CTE material merely reduces the tensile strain in the layers.

Abstract: A device for bringing a fishing hook attached to a line out to the side of a boat during trolling, comprising an elongated hull (5), a keel (6) and a line (7) with a release device (8), where the release device is arranged to hold the line during trolling and release the line when a fish bites on the hook.