Abstract: A forest fire retardant composition contains a retardant compound that includes a halide salt, a non-halide salt, a metal oxide, a metal hydroxide, or combinations thereof. The forest fire retardant composition may include at least one anhydrous salt and at least one hydrate salt. The halide salt may be magnesium chloride, calcium chloride, or both. The magnesium chloride hydrate has a formula MgCl2(H2O)x, wherein x is at least one of x=1, 2, 4, 6, 8, or 12. The calcium chloride hydrate has a formula CaCl2(H2O)x, wherein x is at least one of 1, 2, 4, or 6. The composition may be in the form of a dry concentrate, a liquid concentrate, or a final diluted product. The final diluted product is effective in suppressing, retarding, and controlling forest fires while exhibiting corrosion resistance and low toxicity.

Abstract: A forest fire retardant composition contains a retardant compound that includes a phosphate salt. The phosphate salt may include diammonium phosphate, diammonium orthophosphate, monoammonium phosphate, monoammonium orthophosphate, monosodium phosphate, disodium phosphate, disodium phosphate hydrate, sodium ammonium phosphate, sodium ammonium phosphate hydrate, sodium tripolyphosphate, trisodium phosphate, or dipotassium phosphate, and combinations thereof. The forest fire retardant composition may include an ammonium source. The composition may be in the form of a dry concentrate, a liquid concentrate, or a final diluted product. The final diluted product is effective in suppressing, retarding, and controlling forest fires while exhibiting corrosion resistance and low toxicity.

Abstract: A forest fire retardant composition contains a retardant compound that includes a potassium salt. The potassium salt may include a potassium salt of an organic acid, a potassium salt of an inorganic acid, or mixtures thereof. The organic acid may include formic acid, acetic acid, propanoic acid, butanoic acid, lactic acid, oxalic acid, malic acid, gluconic acid, tartaric acid, uric acid, malic acid, or citric acid. The inorganic acid may include sulfuric acid, phosphoric acid, carbonic acid, or hydrochloric acid. The composition may be in the form of a dry concentrate, a liquid concentrate, or a final diluted product. The final diluted product is effective in suppressing, retarding, and controlling forest fires while exhibiting corrosion resistance and low toxicity.

Abstract: A forest fire retardant composition contains a retardant compound that includes a phosphate salt. The phosphate salt may include diammonium phosphate, diammonium orthophosphate, monoammonium phosphate, monoammonium orthophosphate, monosodium phosphate, disodium phosphate, disodium phosphate hydrate, sodium ammonium phosphate, sodium ammonium phosphate hydrate, sodium tripolyphosphate, trisodium phosphate, or dipotassium phosphate, and combinations thereof. The forest fire retardant composition may include an ammonium source. The composition may be in the form of a dry concentrate, a liquid concentrate, or a final diluted product. The final diluted product is effective in suppressing, retarding, and controlling forest fires while exhibiting corrosion resistance and low toxicity.

Abstract: Coronavirus S ectodomain trimers stabilized in a prefusion conformation, nucleic acid molecules and vectors encoding these proteins, and methods of their use and production are disclosed. In several embodiments, the coronavirus S ectodomain trimers and/or nucleic acid molecules can be used to generate an immune response to coronavirus in a subject. In additional embodiments, the therapeutically effective amount of the coronavirus S ectodomain trimers and/or nucleic acid molecules can be administered to a subject in a method of treating or preventing coronavirus infection.

Abstract: A forest fire retardant composition contains water and a retardant compound that includes a halide salt, a non-halide salt, a metal oxide, a metal hydroxide, or combinations thereof. The halide salt may be magnesium chloride, calcium chloride, or both. The magnesium chloride hydrate has a formula MgCl2(H2O)x, wherein x is at least one of x=1, 2, 4, 6, 8, or 12. The calcium chloride hydrate has a formula CaCl2)(H2O)x, wherein x is at least one of 1, 2, 4, or 6. The composition may be in the form of a liquid concentrate or a final diluted product. The final diluted product is effective in suppressing, retarding, and controlling forest fires while exhibiting corrosion resistance and low toxicity.

Abstract: A preportioning bag used in food operations where a bulk food supply is divided into portions of smaller size, individual portions are located in a bag, and the bag is stored for use at a later date. The bag includes a front wall and a back wall that are joined so that a main body having closed side and bottom edges is defined. Multiple vents in the form of semi-circular slits are formed in the front and back walls of the bag. The front and back walls are constructed of a material that will withstand freezing and heating by microwave or steam. The bag features a day of the week printed thereon and is color-coded accordingly. A set of the bags may be mounted on a saddle structure.

Abstract: A preportioning bag used in food operations where a bulk food supply is divided into portions of smaller size, individual portions are located in a bag, and the bag is stored for use at a later date. The bag includes a front wall and a back wall that are joined so that a main body having closed side and bottom edges is defined. Multiple vents in the form of semi-circular slits are formed in the front and back walls of the bag. The front and back walls are constructed of a material that will withstand freezing and heating by microwave or steam. The bag features a day of the week printed thereon and is color-coded accordingly. A set of the bags may be mounted on a saddle structure.

Abstract: The present invention relates to an integrated circuit package and method of manufacturing an integrated circuit package. In one aspect, the present invention relates to an integrated circuit package including a lead frame having a lead with an inner pad and an outer pad connected by a connection member, wherein a region of the inner pad and a region of the outer pad are separated by a channel extending through a width of the lead. Such an integrated circuit package further includes a semiconductor die electrically coupled with the inner pad of the lead, and an encapsulant material encapsulating at least a portion of said lead frame, wherein a portion of said outer pad is exposed.

Abstract: In one aspect, the present invention features a method of manufacturing an integrated circuit package including providing a substrate having a first surface, a second surface opposite the first surface, a cavity through the substrate between the first and second surfaces and a conductive via extending through the substrate and electrically connecting the first surface of the substrate with the second surface of the substrate, applying a strip to the second surface of the substrate, mounting a semiconductor die on the strip, at least a portion of the semiconductor die being disposed inside the cavity, encapsulating in a molding material at least a portion of the first surface of the substrate, and removing the strip from the substrate.

Abstract: The present invention relates to an integrated circuit packages having a thermally conductive element thermally coupled to a heat sink and semiconductor die, and a method of manufacturing said integrated circuit package.

Abstract: The present invention relates to an integrated circuit package and method of manufacturing an integrated circuit package. In one aspect, the present invention relates to an integrated circuit package including a lead frame having a lead with an inner pad and an outer pad connected by a connection member, wherein a region of the inner pad and a region of the outer pad are separated by a channel extending through a width of the lead. Such an integrated circuit package further includes a semiconductor die electrically coupled with the inner pad of the lead, and an encapsulant material encapsulating at least a portion of said lead frame, wherein a portion of said outer pad is exposed.

Abstract: The present invention relates to an integrated circuit packages having a thermally conductive element thermally coupled to a heat sink and semiconductor die, and a method of manufacturing said integrated circuit package.

Abstract: In one aspect, the present invention features a method of manufacturing an integrated circuit package including providing a substrate having a first surface, a second surface opposite the first surface, a cavity through the substrate between the first and second surfaces and a conductive via extending through the substrate and electrically connecting the first surface of the substrate with the second surface of the substrate, applying a strip to the second surface of the substrate, mounting a semiconductor die on the strip, at least a portion of the semiconductor die being disposed inside the cavity, encapsulating in a molding material at least a portion of the first surface of the substrate, and removing the strip from the substrate.

Abstract: The present invention relates to a method of manufacturing an integrated circuit package, including providing a lead frame without a die attachment pad, the lead frame having a ridge portion protruding from a base portion, the ridge portion having an upper surface and defining an upper portion of a cavity, the base portion having a lead and a lower surface, attaching an adhesive strip to at least the lower surface of the base portion to seal a bottom portion of the cavity, encapsulating the cavity such that at least a portion of the upper surface of the ridge portion of the lead frame and at least a portion of the lower surface of the base portion are exposed, and removing the adhesive strip.