Patents by Inventor Robert N. PERRINE

Robert N. PERRINE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230407647
    Abstract: Interlocking modular tile frames may be used to lay and fix tile patterns without requiring a substrate adhesive (thin-set mortar) or grout. Tile frames may comprise integrated segments joined by mechanical interconnection components or a whole. A tile frame forms a rigid or semi-rigid enclosure to hold at least one hard tile within its interior. Each segment has an upside-down T-shape cross-section comprising a column and base. The columns, which frame the held tile, eliminate the need for grout. The inserted tile rests on the base of each segment while being held in place by a column along each edge. One or more mechanical interconnections are located at the base of each enclosure to couple adjacent frames together. Stain-resistant materials such as but not limited to polyethylene, polycarbonate, polyvinyl chloride (PVC), polypropylene (PP), acrylic, ABS (acrylonitrile butadiene styrene), nylon, rubber, or a combination thereof, can be used for the frames.
    Type: Application
    Filed: June 30, 2023
    Publication date: December 21, 2023
    Inventor: Robert N. PERRINE
  • Patent number: 11840847
    Abstract: Interlocking modular tile frames for joining hard tiles without requiring a substrate adhesive (thin-set mortar) or grout. Each tile frame comprises integrated segments that form a rigid or semi-rigid enclosure to hold a single hard tile within its interior. Each segment has an upside-down T-shape cross-section comprising a column and a base. The columns, which frames a tile, eliminate the need for grout. An inserted tile rests on the base while being held in place by the column along each segment. One or more mechanical interconnections are located at an outer portion of each enclosure corner to couple adjacent frames together. A stain-resistant material such as but not limited to polyethylene, polycarbonate, polyvinyl chloride (PVC), polypropylene (PP), acrylic, ABS (acrylonitrile butadiene styrene), nylon, rubber, or a combination thereof, can be used for the frames.
    Type: Grant
    Filed: May 20, 2022
    Date of Patent: December 12, 2023
    Inventor: Robert N. Perrine
  • Publication number: 20220381041
    Abstract: Interlocking modular tile frames for joining hard tiles without requiring a substrate adhesive (thin-set mortar) or grout. Each tile frame comprises integrated segments that form a rigid or semi-rigid enclosure to hold a single hard tile within its interior. Each segment has an upside-down T-shape cross-section comprising a column and a base. The columns, which frames a tile, eliminate the need for grout. An inserted tile rests on the base while being held in place by the column along each segment. One or more mechanical interconnections are located at an outer portion of each enclosure corner to couple adjacent frames together. A stain-resistant material such as but not limited to polyethylene, polycarbonate, polyvinyl chloride (PVC), polypropylene (PP), acrylic, ABS (acrylonitrile butadiene styrene), nylon, rubber, or a combination thereof, can be used for the frames.
    Type: Application
    Filed: May 20, 2022
    Publication date: December 1, 2022
    Inventor: Robert N. PERRINE