Patents by Inventor Robert Neves

Robert Neves has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10379153
    Abstract: A printed circuit board (PCB) test coupon for thermal exposure and electrical testing includes a double sided or multi-layer substrate with a plurality of vias formed within the substrate of the test coupon (blind, buried, stacked vias) or extending through the entire substrate (through hole/via) from a first surface on the first side of the plated hole/via to a second surface on the second side of the plated hole/via. Each of a first plurality of trace patterns interconnect a subset of the plurality of plated holes/vias on the first side of the plated holes/vias, and each of a second plurality of trace patterns interconnect a different subset of the plurality of plated holes/vias on the second side of the plated holes/vias. The first and second pluralities of trace patterns have different patterns and connect to connection points in a connector pattern defined in the substrate.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: August 13, 2019
    Assignee: Greater Asia Pacific Limited
    Inventor: Robert Neves
  • Patent number: 10334720
    Abstract: A printed circuit board (PCB) test coupon for thermal exposure and electrical testing includes a double sided or multi-layer substrate with a plurality of vias formed within the substrate of the test coupon (blind, buried, stacked vias) or extending through the entire substrate (through hole/via) from a first surface on the first side of the plated hole/via to a second surface on the second side of the plated hole/via. Each of a first plurality of trace patterns interconnect a subset of the plurality of plated holes/vias on the first side of the plated holes/vias, and each of a second plurality of trace patterns interconnect a different subset of the plurality of plated holes/vias on the second side of the plated holes/vias. The first and second pluralities of trace patterns have different patterns and connect to connection points in a connector pattern defined in the substrate.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: June 25, 2019
    Assignee: Greater Asia Pacific Limited
    Inventor: Robert Neves
  • Patent number: 7287903
    Abstract: An apparatus for rapid thermal testing of samples consisting of a single sample chamber in which the samples are preferably arranged circularly around the opening through which a fluid of varying temperature, preferably air, is introduced to provide for rapid, uniform cooling and heating of the samples. The samples are preferably uniformly spaced to allow for uniform air flow. The samples are mounted in slots which are preferably oriented radially outward from the opening. The sample mounts comprise electrical connectors which form a network connected to at least one ohmmeter for measuring the resistance of the samples. The samples preferably comprise test coupons, each with multiple daisy-chained nets of vias or other components to be tested. Also a method for thermal testing of samples consisting of steps to characterize the samples before the test is run.
    Type: Grant
    Filed: February 20, 2004
    Date of Patent: October 30, 2007
    Assignee: Conductor Analysis Technologies, Inc.
    Inventors: Timothy A. Estes, Robert Neves
  • Publication number: 20060260817
    Abstract: A technique is provided to facilitate connection of well equipment assemblies at a downhole location. A first assembly comprises a control line having a connector designed for coupling with a corresponding connector of a next adjacent assembly. Additionally, a mechanism is provided to restrain movement of the next adjacent assembly prior to full engagement with the first assembly to enable performance of a desired preparation procedure.
    Type: Application
    Filed: May 17, 2006
    Publication date: November 23, 2006
    Applicant: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: John Meijer, Raghuram Kamath, Jason Jonas, Robert Neves, David Verzwyvelt
  • Publication number: 20060260803
    Abstract: A technique is provided in which a soft landing system is used for connecting upper and lower assemblies in a wellbore. The soft landing system cushions the engagement of an upper well assembly with a lower well assembly and facilitates the controlled engagement of control line connectors. The controlled engagement limits or avoids damage to the control line connectors in well completion operations performed in two or more stages.
    Type: Application
    Filed: July 28, 2006
    Publication date: November 23, 2006
    Applicant: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: John Meijer, Raghuram Kamath, Jason Jonas, Robert Neves, David Verzwyvelt
  • Publication number: 20060260818
    Abstract: A technique is provided in which a contraction joint is used to facilitate connection of well equipment assemblies at a downhole location. The contraction joint accommodates changes in system length during engagement and use or the well equipment assemblies in a wellbore. Additionally, the contraction joint provides a positive indication of joint position and enables resetting of the joint following initial contraction.
    Type: Application
    Filed: July 28, 2006
    Publication date: November 23, 2006
    Applicant: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: John Meijer, Raghuram Kamath, Jason Jonas, Robert Neves, David Verzwyvelt
  • Publication number: 20060137874
    Abstract: A technique that is usable with a subterranean well that has a first string that lines a borehole includes running a second string into the well and engaging a deflecting face of a deflector to deflect the second string into a window of the first string. The technique includes performing at least one of positioning the second string and orienting the second string using a profile on the deflector downhole of the deflecting face.
    Type: Application
    Filed: December 28, 2004
    Publication date: June 29, 2006
    Applicant: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: Carlos Araque, John Whitsitt, Martin Prado, Robert Neves
  • Publication number: 20040233966
    Abstract: An apparatus for rapid thermal testing of samples consisting of a single sample chamber in which the samples are preferably arranged circularly around the opening through which a fluid of varying temperature, preferably air, is introduced to provide for rapid, uniform cooling and heating of the samples. The samples are preferably uniformly spaced to allow for uniform air flow. The samples are mounted in slots which are preferably oriented radially outward from the opening. The sample mounts comprise electrical connectors which form a network connected to at least one ohmmeter for measuring the resistance of the samples. The samples preferably comprise test coupons, each with multiple daisy-chained nets of vias or other components to be tested. Also a method for thermal testing of samples consisting of steps to characterize the samples before the test is run.
    Type: Application
    Filed: February 20, 2004
    Publication date: November 25, 2004
    Applicant: Conductor Analysis Technologies, Inc.
    Inventors: Timothy A. Estes, Robert Neves