Abstract: Embodiments of the present invention recite a data collector with expanded functionality and a method of enhancing revenue generation using a data collector with expanded functionality. In one embodiment, a central unit of a data collector is configured to receive a replaceable unit such that any one of a variety of replaceable units can be configure to be attached to said central unit.

Abstract: The present invention relates to molecular microscopy or volumetric imaging by proximal unique molecular identifiers (“UID”) reaction (“VIPUR”) microscopy methods to record the cellular co-localization and/or spatial distributions of arbitrary nucleic acid sequences, or other biomolecules tagged with nucleic sequences. The method involves one or both of two DNA sequence-components such as an ?-UID, which may identify the targeted sequences-of-interest themselves and/or spatial beacons relative to which their distances are measured, and a ??-UID, which labels ?-UID association events.

Abstract: The invention provides, inter alia, methods for uniquely labeling populations of agents of interest using random combinations of oligonucleotides. The oligonucleotides may comprise a unique nucleotide sequence and/or one or more non-nucleic acid detectable moieties.

Abstract: The invention provides for methods for uniquely labeling populations of nucleic acids of interest in emulsion droplets using random combinations of oligonucleotides. The labeling methodology of the invention may be used, inter alia, to generate mate pair genomic fragments without the need for circularization. Because the method is independent of circularization, mate pairs can be generated from any length genomic fragment.

Abstract: The present invention relates to systems and methods for manipulating droplets within a high through put microfluidic system.

Abstract: Embodiments of the present invention recite a data collector with expanded functionality and a method of enhancing revenue generation using a data collector with expanded functionality. In one embodiment, a central unit of a data collector is configured to receive a replaceable unit such that any one of a variety of replaceable units can be configure to be attached to said central unit.

Abstract: The present invention is related to genomic nucleotide sequencing. In particular, the invention describes a single reaction method to co-amplify multiple subsequences of a nucleic acid fragment sequence (i.e., for example, at least two read pairs from a single library insert sequence). Nucleic acid fragment sequences may include, but are not limited to, localizing library insert sequences and/or unique read pair sequences in specific orientations on a single emulsion polymerase chain reaction bead. Methods may include, but are not limited to, annealing, melting, digesting, and/or reannealing high throughput sequencing primers to high throughput sequencing primer binding sites. The compositions and methods disclosed herein contemplate sequencing complex genomes, amplified genomic regions, as well as detecting chromosomal structural rearrangements that are compatible with massively parallel high throughput sequencing platforms as well as ion semiconductor matching sequencing platforms (i.e.

Abstract: The present invention is related to genomic nucleotide sequencing. In particular, the invention describes a paired end sequencing method that improves the yield of long-distance genomic read pairs by constructing long-insert clone libraries (i.e., for example, a fosIll library or a fosCN library) and converting the long-insert clone library using inverse polymerase chain reaction amplification or shearing and recircularization of shortened fragments into a library of co-ligated clone-insert ends. The resultant jumping libraries are compatible with massively parallel sequencing techniques. The compositions and methods disclosed herein contemplate sequencing complex genomes as well as detecting chromosomal structural rearrangements.

Abstract: The present invention is related to genomic nucleotide sequencing. In particular, the invention describes a paired end sequencing method that enables the sequencing of unique read pairs by co-localizing both 5? ends on a single emulsion polymerase chain reaction bead. The method may use a customized forked adaptor primer pair that is compatible with massively parallel sequencing techniques. The compositions and methods disclosed herein contemplate sequencing complex genomes, amplified genomic regions, as well as detecting chromosomal structural rearrangements.

Abstract: A wafer level packaged integrated circuit includes an array of contacts, a silicon layer and a glass layer. The silicon and glass layers are bonded together to form a bonding material layer therebetween. The bonding material layer includes gaps between the silicon layer and the glass layer at areas where no bonding material is present. An array of contacts is adjacent the semiconductor layer on a side thereof opposite the bonding layer. The wafer level packaged integrated circuit is provided with additional bonding material layer portions within the gaps and aligned with at least some of the contacts. When the wafer level packaged integrated circuit is configured as an image sensor or display having a pixel array, the additional bonding material layer portions are not used in an area of the pixel array.

Abstract: A method of manufacturing a micromodule including the steps of: producing an integrated circuit on an active face of a chip made of a semi-conductive material, making a via passing through the chip, electrically linked to the integrated circuit, and inserting the chip into a box comprising a cavity and an electrically conductive element, the active face of the chip being disposed towards the bottom of the cavity, forming on at least one part of a lateral face of the chip a conductive lateral layer made of an electrically conductive material, electrically linked to a conductive element of the rear face of the chip, and producing a connection between the conductive lateral layer and the conductive element by depositing an electrically conductive material in the cavity.

Abstract: A wafer level packaged integrated circuit includes an array of contacts, a silicon layer and a glass layer. The silicon and glass layers are bonded together to form a bonding material layer therebetween. The bonding material layer includes gaps between the silicon layer and the glass layer at areas where no bonding material is present. An array of contacts is adjacent the semiconductor layer on a side thereof opposite the bonding layer. The wafer level packaged integrated circuit is provided with additional bonding material layer portions within the gaps and aligned with at least some of the contacts. When the wafer level packaged integrated circuit is configured as an image sensor or display having a pixel array, the additional bonding material layer portions are not used in an area of the pixel array.

Abstract: A method of forming an image sensor having a sensor, a cover, and a filter, that may include applying a filter layer to a cover layer by masking the cover layer with a predetermined pattern and applying the filter layer by a deposition process. The method may also include bonding the cover layer to a sensor layer including a plurality of sensors. The predetermined pattern may result in a filter layer which is aligned with each sensor. There may be gaps in the filter layer around each sensor.

Abstract: A method of manufacturing a micromodule including the steps of: producing an integrated circuit on an active face of a chip made of a semi-conductive material, making a via passing through the chip, electrically linked to the integrated circuit, and inserting the chip into a box comprising a cavity and an electrically conductive element, the active face of the chip being disposed towards the bottom of the cavity, forming on at least one part of a lateral face of the chip a conductive lateral layer made of an electrically conductive material, electrically linked to a conductive element of the rear face of the chip, and producing a connection between the conductive lateral layer and the conductive element by depositing an electrically conductive material in the cavity.

Abstract: Embodiments of the present invention recite a data collector with expanded functionality and a method of enhancing revenue generation using a data collector with expanded functionality. In one embodiment, a central unit of a data collector is configured to receive a replaceable unit such that any one of a variety of replaceable units can be configure to be attached to said central unit.