Patents by Inventor Robert P. Frankenthal

Robert P. Frankenthal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5750071
    Abstract: A method of protecting metals from corrosion by applying an alternating voltage to them, thereby reversing the metal's polarity with respect to its surroundings. Particular applications are for metals which are buried in soil or are exposed to an electrolyte. Amphoteric metals Steels, which are subject to hydrogen embrittlement when made cathodic, are also protected by polarity reversal.
    Type: Grant
    Filed: June 8, 1995
    Date of Patent: May 12, 1998
    Assignee: Lucent Technologies Inc.
    Inventors: Mary E. Fiorino, Robert P. Frankenthal, James D. Sinclair
  • Patent number: 5578101
    Abstract: The disclosed method of making a glass body by a sol/gel process comprises electrochemically assisted release of the gel body from the mold in which the body was formed. More specifically, the method involves gelation of a sol in a mold that comprises a first conductor member, with a second conductor member also being in contact with the sol and/or gel, and causing the flow of a current between the first and second conductor members, with the first member being the cathode. In consequence of the current flow a substantially liquid lubricating layer that facilitates removal of the gel body from the melt exists at the cathode/gel interface.
    Type: Grant
    Filed: September 1, 1995
    Date of Patent: November 26, 1996
    Assignee: Lucent Technologies Inc.
    Inventors: Greg E. Blonder, Robert P. Frankenthal, David W. Johnson, Jr., Eliezer M. Rabinovich
  • Patent number: 5381701
    Abstract: This invention is embodied in an apparatus for assessing the effects of controlled amounts of well-characterized ionic or other particles on the reliability of electronic components. The chamber includes a high efficiency filter that purifies the input air and a recirculating system which ensures substantially laminar, constant velocity air flow, controllable humidity, and steady state conditions throughout at least a portion of the chamber. Particles are introduced into the chamber from a particle generator through a series of output ports that ensure a uniform concentration of particles throughout at least a portion of the chamber. Substantially constant conditions are achieved by constantly introducing new particles into the chamber, withdrawing a continuous flow of particle-laden air from the chamber, removing essentially all the particles from the particle-laden air withdrawn from the chamber and introducing a continuous flow of filtered air into the chamber.
    Type: Grant
    Filed: March 26, 1993
    Date of Patent: January 17, 1995
    Assignee: AT&T Corp.
    Inventors: Robert P. Frankenthal, David J. Siconolfi, James D. Sinclair
  • Patent number: 5356526
    Abstract: A new metallization is described which is a composite of subsequent metal layers beginning with a layer of titanium and having in an ascending order the following composition: Ti--TiPd--Cu--Ni--Au. TiPd is an alloy of titanium and palladium containing from 0.3 to 14 weight percent Pd, by the weight of the alloy. The TiPd alloy is etchable in an aqueous HF solution containing from 0.5 to 2.0 and higher, preferably from 0.5 to 1.2 weight percent HF. The use of the TiPd alloy avoids the occurrence of Pd residues remaining after the etching of Ti layer and lift-off (rejection etching) of Pd layer in a prior art Ti--Pd--Cu--Ni--Au metallization. Ti and TiPd layers are present in a thickness ranging from 100 to 300 nm and from 50 to 300 nm, respectively, and in a total minimum thickness needed to maintain bonding characteristics of the metallization.
    Type: Grant
    Filed: October 20, 1993
    Date of Patent: October 18, 1994
    Assignee: AT&T Bell Laboratories
    Inventors: Robert P. Frankenthal, Ajibola O. Ibidunni, Dennis L. Krause
  • Patent number: 5288951
    Abstract: A new metanization is described which is a composite of subsequent metal layers beginning with a layer of titanium and having in an ascending order the following composition: Ti - TiPd - Cu - Ni - Au. TiPd is an alloy of titanium and palladium containing from 0.3 to 14 weight percent Pd, by the weight of the alloy. The TiPd alloy is etchable in an aqueous BF solution containing from 0.5 to 2.0 and higher, preferably from 0.5 to 1.2 weight percent BF. The use of the TiPd alloy avoids the occurrence of Pd residues remaining after the etching of Ti layer and liftoff (rejection etching) of Pd layer in a prior art Ti-Pd-Cu-Ni-Au metanization. Ti and TiPd layers are present in a thickness ranging from 100 to 300 nm and from 50 to 300 nm, respectively, and in a total minimum thickness needed to maintain bonding characteristics of the metallization.
    Type: Grant
    Filed: October 30, 1992
    Date of Patent: February 22, 1994
    Assignee: AT&T Bell Laboratories
    Inventors: Robert P. Frankenthal, Ajibola O. Ibidunni, Dennis L. Krause
  • Patent number: 4740430
    Abstract: Certain magnetic alloys are useful for a variety of applications including for magneto-optic memory storage media (optical disks). These magnetic alloys are difficult to protect against composition alteration through such processes as corrosion, oxidation, diffusion, etc. The invention is a multiple-layer structure which protects the magnetic alloys against diffusion as well as corrosion and oxidation without affecting performance of the magnetic alloy in the optical disk. Such magnetic memory storage devices exhibit high bit density and long life. They are erasable and inexpensive and highly advantageous for use in high-bit memory storage devices.
    Type: Grant
    Filed: February 18, 1987
    Date of Patent: April 26, 1988
    Assignee: American Telephone and Telegraph Company, AT&T Bell Laboratories
    Inventors: Robert P. Frankenthal, Robert B. vanDover