Patents by Inventor Robert Pfahl

Robert Pfahl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming a solder bump by solder-jetting or the like
    Patent number: 5597110
    Abstract: The present invention provides a method for forming a solder bump (24) on a substrate (20). The substrate (20) includes a bond pad (18) having a faying surface (19) composed of solder-wettable metal. The method includes coating the faying surface (19) with a plate (16) formed of a first metal having a first melting temperature, and projecting a discrete microdroplet (14) onto the plate (16). The microdroplet (14) is formed of a molten second metal and has a second melting temperature greater than the first melting temperature. The microdroplet (14) fuses to the plate (16) to form the solder bump (24).
    Type: Grant
    Filed: August 25, 1995
    Date of Patent: January 28, 1997
    Assignee: Motorola, Inc.
    Inventors: Cynthia M. Melton, Robert Pfahl