Patents by Inventor Robert Phillips, III

Robert Phillips, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for removing known good die using hot shear process
    Patent number: 5961026
    Abstract: Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.
    Type: Grant
    Filed: November 24, 1997
    Date of Patent: October 5, 1999
    Assignee: International Business Machines Corporation
    Inventors: David Charles Olson, Robert Phillips, III
  • Apparatus and method for removing known good die using hot shear process
    Patent number: 5738267
    Abstract: Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.
    Type: Grant
    Filed: October 18, 1996
    Date of Patent: April 14, 1998
    Assignee: International Business Machines Corporation
    Inventors: David Charles Olson, Robert Phillips, III
  • Apparatus and method for removing known good die using hot shear process
    Patent number: 5707000
    Abstract: Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.
    Type: Grant
    Filed: April 23, 1996
    Date of Patent: January 13, 1998
    Assignee: International Business Machines Corporation
    Inventors: David Charles Olson, Robert Phillips, III
  • Apparatus and method for removing known good die using hot shear process
    Patent number: 5636781
    Abstract: Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: June 10, 1997
    Assignee: International Business Machines Corporation
    Inventors: David C. Olson, Robert Phillips, III
  • Apparatus and method for removing known good die using hot shear process
    Patent number: 5556024
    Abstract: Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.
    Type: Grant
    Filed: September 29, 1994
    Date of Patent: September 17, 1996
    Assignee: International Business Machines Corporation
    Inventors: David C. Olson, Robert Phillips, III