Abstract: According to an embodiment of the disclosure, a thermal electric cooler is provided that includes a plurality of segments and a plurality of couplers. The segments are coupled in series to form a ladder-configuration string of P-channel chips and N-channel chips. Each segment comprises at least two substrings coupled in parallel. Each substring comprises at least one of the chips. Each of the couplers is configured to couple one of the P-channel chips to one of the N-channel chips.

Abstract: A circuit for detecting changes in resistance at a solder joint connecting a constant voltage source supplying a first voltage and a pin of an array package during operation of the array package includes: a test circuit for applying a second voltage different from the first voltage at a side of the solder joint opposite the constant voltage source; and a monitoring circuit for monitoring an output of the test circuit, wherein the test circuit is configured to output the first voltage when the resistance at the solder joint is below a threshold value, and to output a voltage other than the first voltage when the resistance at the solder joint is above the threshold value, and wherein the monitoring circuit is configured to indicate a failure of the solder joint connection when the voltage other than the first voltage is output by the test circuit.

Abstract: A circuit for detecting changes in resistance at a solder joint connecting a constant voltage source supplying a first voltage and a pin of an array package during operation of the array package includes: a test circuit for applying a second voltage different from the first voltage at a side of the solder joint opposite the constant voltage source; and a monitoring circuit for monitoring an output of the test circuit, wherein the test circuit is configured to output the first voltage when the resistance at the solder joint is below a threshold value, and to output a voltage other than the first voltage when the resistance at the solder joint is above the threshold value, and wherein the monitoring circuit is configured to indicate a failure of the solder joint connection when the voltage other than the first voltage is output by the test circuit.