Patents by Inventor Robert R. Martinson

Robert R. Martinson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7604486
    Abstract: Apparatus including a body as an intermediary between a device and a printed circuit board, the body including a contact area defined by a plurality of openings each to accommodate a contact therethrough and an alignment feature adjacent the contact area and protruding from a plane defined by the contact area, wherein a surface of the alignment feature includes a friction-reducing material. A method including contacting an alignment feature of a socket with a friction-reducing material. Apparatus and system including a body as an intermediary between a device and a printed circuit board; a plurality of contacts each disposed through a contact area of the body and oriented to deflect a device in a first direction; and a load plate coupled to the body and configured to apply an actuation force on a device in a different second direction. A method including inserting a device into a socket.
    Type: Grant
    Filed: December 21, 2006
    Date of Patent: October 20, 2009
    Assignee: Intel Corporation
    Inventors: Robert R. Martinson, Yupeng Li, Tieyu Zheng, Mandy G. Mistakawi, Thomas G. Ruttan
  • Patent number: 7427210
    Abstract: Embodiments of the invention provide single loading mechanism that both pushes a semiconductor package against a socket and pushes a cooling solution against the semiconductor package. This loading mechanism may take up less motherboard real estate than if two different attachment and loading mechanisms were used.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: September 23, 2008
    Assignee: Intel Corporation
    Inventors: Robert R. Martinson, Alin Ila, Mandy Mistkawi
  • Publication number: 20080151511
    Abstract: Apparatus including a body as an intermediary between a device and a printed circuit board, the body including a contact area defined by a plurality of openings each to accommodate a contact therethrough and an alignment feature adjacent the contact area and protruding from a plane defined by the contact area, wherein a surface of the alignment feature includes a friction-reducing material. A method including contacting an alignment feature of a socket with a friction-reducing material. Apparatus and system including a body as an intermediary between a device and a printed circuit board; a plurality of contacts each disposed through a contact area of the body and oriented to deflect a device in a first direction; and a load plate coupled to the body and configured to apply an actuation force on a device in a different second direction. A method including inserting a device into a socket.
    Type: Application
    Filed: December 21, 2006
    Publication date: June 26, 2008
    Inventors: Robert R. Martinson, Yupeng Li, Tieyu Zheng, Mandy G. Mistakawi, Thomas G. Ruttan
  • Publication number: 20070297143
    Abstract: Embodiments of the invention provide single loading mechanism that both pushes a semiconductor package against a socket and pushes a cooling solution against the semiconductor package. This loading mechanism may take up less motherboard real estate than if two different attachment and loading mechanisms were used.
    Type: Application
    Filed: June 27, 2006
    Publication date: December 27, 2007
    Inventors: Robert R. Martinson, Alin Ila, Mandy Mistkawi