Abstract: An Apparatus for Target Shooting and Projectile Containment, known as a Frag Shield, comprising a first, absorption, layer and a backing layer with an open space between the layers, thereby dissipating energy from projectiles as they pass through the first layer, stopping the projectile with the backing layer, and containing the projectile or particle fragments between the layers.

Abstract: A device for detecting and locating substrates in a cassette including a homogeneous columnar radiation source adjacent to and radiating the edges of the substrates, rod-shaped directional lenses transmitting and replicating the substrate edges in their field of view and directing the transmitted reflected radiation and image of the field of view onto sensing pixels activated to produce indications of the presence and location of the substrates in the cassette.

Abstract: A process for removing at least a portion of a film from a substrate, such as a wafer of silicon or other similar materials, the film on the substrate typically being an oxide film, maintaining the atmosphere embracing the substrate at near room temperature and at near normal atmospheric pressure, flowing dry inert diluent gas over the substrate, introducing a flow of reactive gas, preferably an anhydrous hydrogen halide gas, namely anhydrous hydrogen flouride gas, for typically 5 to 30 seconds over the substrate and film to cause the removal of portions of the film, flowing water vapor laden inert gas, preferably nitrogen, over the substrate and film from a time prior to commencing flow of the reactive gas until flow of the reactive gas is terminated. In the case of non-hygroscopic film on the substrate, the flow of water vapor continues during the flow of the reactive gas and is terminated shortly after the termination of the flow of reactive gas.

Abstract: Applying photoresist to silicon wafers in the manufacture of integrated circuit chips by carrying the wafers upon a rotor in a chamber and spraying from a plurality of nozzles in the chamber toward the rotor for application to the wafers.

Abstract: A positive developer and method spraying developer solution against rotating wafers stacked along rotation axis to remove photoresist and recycling the developer solution in successive cycles and batches of wafers being processed; adding small quantities of fresh developer solution in each cycle of operation to replace the small quantity lost and rinsed down the drain at the end of each cycle, thereby maintaining the strength of the developer solution and equilibrium to establish a predetermined time per cycle needed for completing removal of photoresist; rinsing away the developer solution from the wafers and interior of the spray chamber with deionized water and subsequently applying heated nitrogen to accomplish drying of everything within the chamber.

Abstract: Wafers are cleaned in the manufacture of integrated circuits by revolving the wafers successively through a spray of deionized water and drying nitrogen gas in a closed chamber, and introducing ionized nitrogen gas into the closed chamber to eliminate static electric charge on the wafers. The ionized nitrogen gas is generated by passing nitrogen gas through nozzles having electrodes therein maintained at a high ionizing voltage.

Abstract: A hot plate with a base and a heater plate, both the heater plate and the base being hollow and filled with an expanded and voluminously enlarged foam epoxy encapsulating the lead and power wires and pressing the electric resistance heater ribbon firmly against the ceramic top deck and extruding around the closure plate to seal and secure the entire heating plate and base in single unitary units. The method disclosed includes the pouring of the foaming epoxy system wherein the epoxy expands and creates a pressure within the cavities or chambers of the hot plate and urges the resistance heater firmly against and in intimate engagement with the top deck of the ceramic panel by reason of the growth of the foaming epoxy which seals and insulates against heat migration.

Abstract: A substrate stripping and cleaning apparatus including a closed bowl with an exhaust vent and a liquid drain, a rotating turntable in the bowl carrying baskets of substrates, a spray post with multiple fluid passages, orifices and spray nozzles directing rinsing spray outwardly against the turntable and substrates, rinsing water manifold pipes on the turntable and revolving therewith and having nozzles directing rinsing water to all portions of the inner surfaces of the bowl, the pipes being supplied with water through passages in the drive shaft for the turntable.

Abstract: This invention pertains to a hot plate and more specifically to an industrial hot plate for use in highly corrosive environments where chemicals of high acidity or high alkalinity are employed. An epoxy foam is utilized both to thermally isolate the heated surface from the base structure and to protect the heating element and the associated electrical circuit from damage from the active chemical agents that may be involved upon using the instant hot plate.