Patents by Inventor Robert Scott Clark

Robert Scott Clark has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Self-passivating plasma resistant material for joining chamber components
    Patent number: 7718029
    Abstract: Embodiments of the invention provide a robust bonding material suitable for joining semiconductor processing chamber components. Other embodiments provide semiconductor processing chamber components joined using a bonding material having metal filler disposed in an adhesive layer. Other embodiments include methods for manufacturing a semiconductor processing chamber component having a bonding material that includes metal filled disposed in an adhesive layer. The metal filler is suitable for reacting with halogen containing plasmas such that a halogen based metal layer is formed on the exposed portion of the bonding material upon exposure to the plasma.
    Type: Grant
    Filed: August 1, 2006
    Date of Patent: May 18, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Jennifer Y. Sun, Li Xu, Senh Thach, Kelly A. McDonough, Robert Scott Clark
  • SELF-PASSIVATING PLASMA RESISTANT MATERIAL FOR JOINING CHAMBER COMPONENTS
    Publication number: 20080029211
    Abstract: Embodiments of the invention provide a robust bonding material suitable for joining semiconductor processing chamber components. Other embodiments provide semiconductor processing chamber components joined using a bonding material having metal filler disposed in an adhesive layer. Other embodiments include methods for manufacturing a semiconductor processing chamber component having a bonding material that includes metal filled disposed in an adhesive layer. The metal filler is suitable for reacting with halogen containing plasmas such that a halogen based metal layer is formed on the exposed portion of the bonding material upon exposure to the plasma.
    Type: Application
    Filed: August 1, 2006
    Publication date: February 7, 2008
    Inventors: JENNIFER Y. SUN, Li Xu, Senh Thach, Kelly A. McDonough, Robert Scott Clark