Abstract: A drop-in multi-optics module for a quantum-particle (e.g., rubidium, cesium) cell provides for more convenient and cost-effective manufacture of such cells (including vacuum cells, cold/ultra-cold matter cells, vapor cells, and channel cells). In a 3D printing approach, a model of a frame augmented by buffer material is 3D printed. The buffer material is removed from the augmented frame to achieved desired dimensions with greater precision than could be achieved by 3D printing the frame directly. Optical and, in some cases, other components are attached to the frame to realize the multi-optics drop-in module. Alternatively, the module can be formed by cutting out portions of a metal sheet and then folding the resulting 2D preform.

Abstract: Improved process for the isolation of laidlomycin from a fermentation broth includes increasing the pH of the fermentation broth and centrifuging the pH adjusted fermentation broth, resulting in an aqueous layer and a wet solid layer containing laidlomycin. After the aqueous layer is removed, the wet solid layer containing laidlomycin is dried. The process provides an efficient and high yielding method.

Abstract: Improved process for the isolation of laidlomycin from a fermentation broth includes increasing the pH of the fermentation broth and centrifuging the pH adjusted fermentation broth, resulting in an aqueous layer and a wet solid layer containing laidlomycin. After the aqueous layer is removed, the wet solid layer containing laidlomycin is dried. The process provides an efficient and high yielding method.

Abstract: A process for the preparation of organoalkoxysilanes containing one or more organic functional groups derived from organic acids or hydrogen cyanates, by a continuous or batch process utilizing a solid guanidinium salt as a phase transfer catalyst for the reaction between a liquid phase haloalkylalkoxysilane and a solid phase alkali or alkaline earth metal salt or ammonium salt of an organic acid or a metal cyanate.

Abstract: A basic architecture for managing digital identity information in a network such as the World Wide Web is provided. A user of the architecture can organize his or her information into one or more profiles which reflect the nature of different relationships between the user and other entities, and grant or deny each entity access to a given profile. Various enhancements which may be provided through the architecture are also described, including tools for filtering email, controlling access to user web pages, locating other users and making one's own location known, browsing or mailing anonymously, filling in web forms automatically with information already provided once by hand, logging in automatically, securely logging in to multiple sites with a single password and doing so from any machine on the network, and other enhancements.

Abstract: A semiconductor device (10) includes a solder bump (40) that is formed using a gold-free under-bump metallurgy (UBM) (21). In a preferred embodiment, UBM (21) includes a diffusion barrier layer (22) of chromium and a metallic layer (24) of copper. The bump layer metallurgy (31) is deposited directly on the metallic layer, without an intervening gold layer. To overcome problems associated with a native oxide layer (26) which forms on the metallic layer, especially on copper, the bump metallurgy includes a seed layer (32) of tin that is deposited prior to a bulk lead layer (34). The bump metallurgy includes a final metallic layer (36) having sufficient tin to make a bump having approximately 97% Pb and 3% tin.