Abstract: Embodiments of the disclosure provide bandwidth allocation in wireless telecommunications including communication devices that can operate according to different operating bandwidth. The bandwidth allocation can include allocation of subcarrier blocks having specific sizes. The subcarriers blocks can be contiguous within a channel or can be non-contiguous or distributed.

Abstract: Embodiments of the disclosure provide bandwidth allocation in wireless telecommunications including communication devices that can operate according to different operating bandwidth. The bandwidth allocation can include allocation of subcarrier blocks having specific sizes. The subcarriers blocks can be contiguous within a channel or can be non-contiguous or distributed.

Abstract: A method of cooking in a continuous cooking oven system generally includes transporting food products on a continuous, pervious conveyor through a helical path within a cooking chamber, directing a substantially vertical flow of a heated gaseous cooking medium into either a top end or a bottom end of the helical stack and through the plurality of superimposed tiers, and selectively reversing the substantially vertical flow of heated gaseous cooking medium on a user defined interval.

Abstract: A method of cooking in a continuous cooking oven system generally includes transporting food products on a continuous, pervious conveyor through a helical path within a cooking chamber, directing a substantially vertical flow of a heated gaseous cooking medium into either a top end or a bottom end of the helical stack and through the plurality of superimposed tiers, and selectively reversing the substantially vertical flow of heated gaseous cooking medium on a user defined interval.

Abstract: A breading machine for dispensing a coating material onto a food product includes a breading chamber, a continuous conveyor for transporting food products through the breading chamber, a hopper including at least one downspout and a sloped bottom for dispensing coating material onto the food products, a hopper conveyor positioned within the hopper. At least one of an angular position or a vertical position of the hopper conveyor is adjustable to accommodate a variety of free flowing and non-free flowing coating materials. One or more air knives may be positioned in the downspouts to fluidize the coating material to alleviate bridging and/or build-up of the coating material within the downspout.

Abstract: A continuous cooking oven system including enclosure containing a first cooking chamber in communication with a second cooking chamber to efficiently and effectively cook and brown food products. The continuous cooking oven system includes an first conveyor for transporting food products through a helical path within the first cooking chamber, a fan for circulating a heated gaseous cooking medium throughout the first cooking chamber, a second conveyor for transporting food products through a linear path within the second cooking chamber, at least one impingement air flow distribution chamber disposed above the second conveyor within the second cooking chamber and at least one impingement air flow distribution chamber disposed below the second conveyor within the second cooking chamber, the impingement air flow distribution chambers circulating a heated gaseous cooking medium throughout the second cooking chamber.

Abstract: The low voltage operation of this electro-optic modulator is realized by a unique system configuration in which the input light beam is first separated into two linearly polarized components of equal intensity, the beams are then focused into two crystals where the beams propagate as pure E waves, the crystals are electrically modulated and the output beams from each crystal are then recombined and recollimated. The low voltage operation is rendered possible by the fact that there is no cancellation between the E and O components as in conventional modulation systems of this type since both beams are transmitted as pure E waves during the modulation process.

Abstract: A laser diode is soldered between metal plates for intimate thermal and electrical contact. The plates are prefabricated and are provided with an insulative spacer therebetween. The two metal plates are held together in a preferred orientation by the spacer which is firmly adhered and sealed to the two plates during the diode soldering operation. The metal plates are constructed from material thin enough that they yield under thermal pressure of the diode to eliminate mechanical strain on the diode during thermal cycling. Backup plates are provided in contact with the diode mounting plates to feed electrical energy thereto.