Patents by Inventor Robert Stevenson

Robert Stevenson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10722706
    Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: July 28, 2020
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel
  • Publication number: 20200222691
    Abstract: A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing a ferrule opening of an electrically conductive ferrule with a gold braze. A co-fired and electrically conductive sintered paste is disposed within and hermetically seals at least one via hole extending in the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects a capacitor active metallization and the sintered paste. A ground electrical connection electrically connects the gold braze to a capacitor ground metallization, wherein at least a portion of the ground electrical connection physically contacts the gold braze. The dielectric of the capacitor may be less than 1000 k. The ferrule may include an integrally formed peninsula portion extending into the ferrule opening spatially aligned with a ground passageway and metallization of an internally grounded feedthrough capacitor.
    Type: Application
    Filed: March 23, 2020
    Publication date: July 16, 2020
    Inventors: Robert A. Stevenson, Christine A. Frysz, Thomas Marzano, Keith W. Seitz, Marc Gregory Martino
  • Patent number: 10695344
    Abstract: Compositions for topical administration of a hedgehog inhibitor compound are described. In one embodiment, the hedgehog inhibitor compound is patidegib and the topical composition comprises the compound in a solvent system of a monohydric primary alcohol and a polyol in a w/w ratio of between about 0.9-1.8. In another embodiment, the hedgehog inhibitor is itraconazole and the topical composition comprises the compound in a solvent system comprising a monohydric primary alcohol and an optionally lower alkyl end-capped oligomeric alkylene glycol in a w/w ratio of between about 0.8 and 2.6 and a fused bicyclic ether. Method of using the compositions are also described, where in one embodiment, the compositions are topically applied for treating or preventing basal cell carcinoma.
    Type: Grant
    Filed: January 3, 2019
    Date of Patent: June 30, 2020
    Assignee: PellePharm, Inc.
    Inventors: Marc Barry Brown, Cameron Robert Stevenson, Charles Rodney Greenaway Evans
  • Publication number: 20200203881
    Abstract: A hermetic feedthrough terminal pin connector for an active implantable medical device (AIMD) includes an electrical insulator hermetically sealed to an opening of an electrically conductive ferrule. A feedthrough terminal pin is hermetically sealed to and disposed through the insulator, the feedthrough terminal pin extending outwardly beyond the insulator on the inside of the casing of the AIMD. A circuit board is disposed on the inside of the casing of the AIMD. A terminal pin connector includes: an electrically conductive connector housing disposed on the circuit board, wherein the connector housing is electrically connected to at least one electrical circuit disposed on the circuit board; and at least one electrically conductive prong supported by the connector housing, the at least one prong contacting and compressed against the feedthrough terminal pin, the at least one prong making a removable electrical connection.
    Type: Application
    Filed: March 5, 2020
    Publication date: June 25, 2020
    Inventors: Thomas Marzano, Keith W. Seitz, Christine A. Frysz, Marc Gregory Martino, Robert A. Stevenson
  • Patent number: 10654007
    Abstract: An aeration assembly for aerating liquids including wine and other alcoholic beverages includes an expansion chamber and an aerating device. The expansion chamber is configured to be in fluid communication with an inside of the uncorked and/or opened bottle when engaged by a bottom portion of the expansion chamber. The aerating device comprises a gas conduit having a proximal end in fluid communication with a distal end. The distal end is disposable below the bottom portion of the expansion chamber. A gas source is in fluid communication with the proximal end of the gas conduit. The expansion chamber is configured to temporarily contain an expansion of bubbles during an aeration process. The expansion chamber and aerating device are not permanently connected, wherein the aerating device can be fully removed from the expansion chamber before, during or after the aeration process.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: May 19, 2020
    Inventors: Robert A. Stevenson, Wendy L. Stevenson, Jennifer L. Stevenson, Ryan A. Stevenson, Douglas Frederick Widney
  • Publication number: 20200121935
    Abstract: A method for making a dielectric substrate configured for incorporation into a hermetically sealed feedthrough is described. The method includes forming a via hole through a green-state dielectric substrate. A platinum-containing paste is filled into at least 90% of the volume of the via hole. The green-state dielectric substrate is then subjected to a heating protocol including: a binder bake-out heating portion performed at a temperature ranging from about 400° C. to about 700° C. for a minimum of 4 hours; a sintering heating portion performed at a temperature ranging from about 1,400° C. to about 1,900° C. for up to 6 hours; and a cool down portion at a rate of up to 5°/minute from a maximum sintering temperature down to about 1,000° C., then naturally to room temperature. The thusly manufacture dielectric substrate is then positioned in an opening in a ferrule that is configured to be attached to a metal housing of an active implantable medical device.
    Type: Application
    Filed: December 10, 2019
    Publication date: April 23, 2020
    Inventors: Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Richard L. Brendel, Thomas Marzano, Jason Woods, Dominick J. Frustaci, Steven W. Winn
  • Patent number: 10625084
    Abstract: An RF switchable filter feedthrough housed inside an AIMD is described. The RF switchable filter feedthrough includes an RF switch having a switching pole that is configured to be controlled by an AIMD control signal to switch between first and second throw position. In the first throw position, a conductive leadwire hermetically sealed to and disposed through an insulator is electrically connected to a two-terminal MLCC chip capacitor which in turn is electrically connected to the ferrule. In the first throw position, EMI energy imparted to a body fluid side implanted lead is diverted to the housing of the AIMD by the chip capacitor. In the second throw position, the conductive leadwire is electrically connected to an RF source disposed inside the AIMD housing. In the second throw position, by measuring a reflective return signal from the RF source it can be determined whether the implanted lead has a defective lead conductor.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: April 21, 2020
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Keith W. Seitz
  • Patent number: 10596369
    Abstract: A hermetically sealed filtered feedthrough assembly includes an electrically conductive ferrule sealed by a first gold braze to an insulator disposed at least partially within a ferrule opening. A conductive wire is disposed within a via hole disposed through the insulator extending from a body fluid side to a device side. A second gold braze hermetically seals the conductive leadwire to the via hole. A capacitor is disposed on the device side having a capacitor dielectric body with a dielectric constant k that is greater than 0 and less than 1000. The capacitor is the first filter capacitor electrically connected to the conductive leadwire coming from the body fluid side into the device side. An active electrical connection electrically connects the conductive leadwire to the capacitor active metallization. A ground electrical connection electrically connects the capacitor ground metallization to the ferrule and housing of the active implantable medical device.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: March 24, 2020
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Christine A. Frysz, Thomas Marzano, Keith W. Seitz, Marc Gregory Martino
  • Patent number: 10589107
    Abstract: A feedthrough separates a body fluid side from a device side. A passageway is disposed through the feedthrough. A body fluid side leadwire extends from a first end disposed inside the passageway to a second end on the body fluid side. A device side leadwire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side leadwire is hermetically sealed to the feedthrough body and is not of the same material as the device side leadwire. A circuit board has an active via hole with a second end of the second leadwire residing therein. The circuit board has an active circuit trace that is electrically connectable to electronic circuits housed in an AIMD, and a circuit board ground metallization.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: March 17, 2020
    Assignee: Greatbatch Ltd.
    Inventors: Keith W. Seitz, Thomas Marzano, Robert A. Stevenson, Christine A. Frysz, Jason Woods, Richard L. Brendel, Marc Gregory Martino
  • Patent number: 10570823
    Abstract: A heat recovery unit for generating a heated fluid by a hot exhaust gas includes a housing having an inlet for introducing hot exhaust gas and an outlet for discharging treated exhaust gas, and arranged in the housing at least one heat exchanger for heat exchange between the hot exhaust gas and a fluid, and an auxiliary combustor for combusting fuel with hot exhaust gas. The auxiliary combustor is provided with a fuel supply, which auxiliary combustor is arranged downstream of the at least one heat exchanger in the housing. An exhaust gas bypass for a part of the hot exhaust gas is provided, having an inlet for exhaust gas, and being positioned upstream of the at least one heat exchanger, and having an outlet in direct fluid communication with the auxiliary combustor.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: February 25, 2020
    Assignee: Stork Thermeq B.V.
    Inventors: Eric Robert Stevenson, Stephan Cornelis Gerardus Bergmans
  • Publication number: 20200054881
    Abstract: A hermetically sealed filtered feedthrough for an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first leadwire second end extending outwardly beyond the device side of an insulator hermetically sealed to a ferrule for the feedthrough. A circuit board supporting a chip capacitor is disposed adjacent to a device side of the insulator and has a circuit board passageway. The first leadwire first end resides in the circuit board passageway. A second conductive leadwire on the device side has a second leadwire first end disposed in the circuit board passageway with a second leadwire second end extending outwardly beyond the circuit board to be connectable to AIMD internal electronics. The second leadwire first end is connected to the first leadwire first end and a capacitor internal metallization in the circuit board passageway.
    Type: Application
    Filed: October 18, 2019
    Publication date: February 20, 2020
    Inventors: Dominick J. Frustaci, Keith W. Seitz, Thomas Marzano, Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel, Jason Woods
  • Patent number: 10561837
    Abstract: A filtered feedthrough assembly for an active implantable medical device (AIMD) includes an insulator hermetically sealed to an opening of an electrically conductive ferrule. A ceramic reinforced metal composite of platinum and alumina (CRMC) material is disposed in an insulator via hole surrounding a substantially pure platinum fill. A capacitor disposed on the insulator device side has a capacitor dielectric with a dielectric constant k that is greater than 0 and less than 1000. Coming from the body fluid side to the device side of the AIMD, the capacitor is the first filter capacitor electrically connected to the substantially pure platinum fill. An active electrical connection electrically connects the substantially pure platinum fill to the capacitor active metallization. A ground electrical connection electrically connects the capacitor ground metallization to the ferrule and subsequently to the housing of the AIMD.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: February 18, 2020
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Christine A. Frysz, Thomas Marzano, Keith W. Seitz, Marc Gregory Martino
  • Patent number: 10559409
    Abstract: A method for manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of first forming a ceramic reinforced metal composite (CRMC) paste by mixing platinum with a ceramic material to form a CRMC material, subjecting the CRMC material to a first sintering step to thereby form a sintered CRMC material, ball-milling or grinding the sintered CRMC material to form a powdered CRMC material; and then mixing the powdered CRMC material with a solvent to form the CRMC paste.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: February 11, 2020
    Assignee: Greatbatch Ltd.
    Inventors: Keith W. Seitz, Dallas J. Rensel, Brian P. Hohl, Jonathan Calamel, Xiaohong Tang, Robert A. Stevenson, Christine A. Frysz, Thomas Marzano, Jason Woods, Richard L. Brendel
  • Publication number: 20200038392
    Abstract: The present invention provides topical, e.g., dermal, pharmaceutical compositions comprising an active agent. The present invention further provides methods of preparing such compositions and methods of treating a disease, disorder, or condition, such as a skin disease, using the same.
    Type: Application
    Filed: August 2, 2019
    Publication date: February 6, 2020
    Inventors: Todd Brady, David Clark, Susan Macdonald, Stephen Gitu Machatha, Cameron Robert Stevenson, Charles Rodney Greenaway Evans
  • Publication number: 20200030614
    Abstract: A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing the opening of a ferrule with a gold braze. The ferrule includes a peninsula extending into the ferrule opening and the insulator has a cutout matching the peninsula. A sintered platinum-containing paste hermetically seals at least one via hole extending through the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects the capacitor active metallization to the sintered paste. A ground electrical connection electrically connects the capacitor ground metallization disposed within a capacitor ground passageway to the portion of the gold braze along the ferrule peninsula. The dielectric of the capacitor may be less than 1,000 k.
    Type: Application
    Filed: October 1, 2019
    Publication date: January 30, 2020
    Inventors: Robert A. Stevenson, Christine A. Frysz, Keith W. Seitz, Thomas Marzano, Marc Gregory Martino
  • Publication number: 20200030613
    Abstract: A method for manufacturing a singulated feedthrough insulator for a hermetic seal of an active implantable medical device (AIMD) is described. The method begins with forming a green-state ceramic bar with a via hole filled with a conductive paste. The green-state ceramic bar is dried to convert the paste to an electrically conductive material filling via hole and then subjected to a pressing step. Following pressing, a green-state insulator is singulated from the green-state ceramic bar. The singulated green-state insulator in next sintered to form an insulator that is sized and shaped for hermetically sealing to close a ferrule opening. The thusly produced feedthrough is suitable installation in an opening in the housing of an active implantable medical device.
    Type: Application
    Filed: September 23, 2019
    Publication date: January 30, 2020
    Inventors: Robert A. Stevenson, Thomas Marzano, Keith W. Seitz, Christine A. Frysz, Dallas J. Rensel, Brian P. Hohl
  • Patent number: 10500402
    Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: December 10, 2019
    Assignee: Greatbatch Ltd.
    Inventors: Robert A. Stevenson, Xiaohong Tang, William C. Thiebolt, Christine A. Frysz, Keith W. Seitz, Richard L. Brendel, Thomas Marzano, Jason Woods, Dominick J. Frustaci, Steven W. Winn
  • Publication number: 20190351240
    Abstract: An RF switchable filter feedthrough housed inside an AIMD is described. The RF switchable filter feedthrough includes an RF switch having a switching pole that is configured to be controlled by an AIMD control signal to switch between first and second throw position. In the first throw position, a conductive leadwire hermetically sealed to and disposed through an insulator is electrically connected to a two-terminal MLCC chip capacitor which in turn is electrically connected to the ferrule. In the first throw position, EMI energy imparted to a body fluid side implanted lead is diverted to the housing of the AIMD by the chip capacitor. In the second throw position, the conductive leadwire is electrically connected to an RF source disposed inside the AIMD housing. In the second throw position, by measuring a reflective return signal from the RF source it can be determined whether the implanted lead has a defective lead conductor.
    Type: Application
    Filed: May 17, 2019
    Publication date: November 21, 2019
    Inventors: Robert A. Stevenson, Keith W. Seitz
  • Publication number: 20190321628
    Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active metallization that is electrically connected to the active electrode plates and a ground metallization that is electrically connected to the ground electrode plates of the capacitor. A ground electrical path extends from the ground metallization of the chip capacitor to the ferrule. A conductive ground pin is electrically and mechanically connected to the ferrule. The ground path comprises an internal ground plate disposed within the circuit board substrate.
    Type: Application
    Filed: June 26, 2019
    Publication date: October 24, 2019
    Inventors: Robert A. Stevenson, Christine A. Frysz, Richard L. Brendel
  • Publication number: 20190320735
    Abstract: A frame is sealed in a waterproof manner to a pair of pants and/or waders, where the frame forms a frame aperture separating an outside from an inside of the pair of pants and/or waders. A lid is pivotably connected to the frame where the lid in an open position allows access through the frame aperture and the lid in a closed position does not. A seal is disposed between the frame and the lid forming a waterproof closure of the frame aperture when the lid is in the closed position. A latch is movably connected to the frame, the latch having an engagement surface configured for a user to press against. A protective protrusion is attached to the lid, wherein the engagement surface and the protective protrusion cooperatively form a finger gap configured to allow the user access to press against the engagement surface.
    Type: Application
    Filed: June 19, 2019
    Publication date: October 24, 2019
    Inventors: Robert A. Stevenson, Wendy L. Stevenson