Patents by Inventor Robert W. Erwin

Robert W. Erwin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6384771
    Abstract: An automated simulator for radar and sonar applications. The inventive simulator is implemented in hardware and generates current parameters with respect to a simulated target in response to a plurality of initial values with respect thereto. In the illustrative embodiment, the initial values include range, velocity, and acceleration and are stored in first, second and third register respectively. In the best mode, the invention is implemented in a field-programmable gate array. The inventive target simulator also includes a range delay circuit for generating a simulated return from the simulated target. The range delay circuit includes logic for determining whether a simulated pulse train to be received is ambiguous or unambiguous and adjusting the pulse repetition rate of the pulse train accordingly. The range delay circuit calculates die initial time that a packet needs to make the trip to and from the target.
    Type: Grant
    Filed: April 25, 2000
    Date of Patent: May 7, 2002
    Assignee: Raytheon Company
    Inventors: Warren J. Montague, Garin S. Bircsak, John K. Keigharn, Jorge L. Barboza, Robert W. Erwin
  • Patent number: 5542800
    Abstract: A method of binding a pack of signatures, at least some of said signatures including a plurality of interleaved sheets and each of said signatures having a closed side, comprises the following steps. The pack of signatures is clamped with the closed sides of the signatures lowermost and coplanar with one another along a spine of the pack. The closed lowermost sides of the signatures are sawed to expose the interleaved sheets of the signatures. The sawed lowermost sides of the signatures are slashed with a multiplicity of cuts lateral to the lengths of the sawed lowermost sides. A preparatory adhesive is applied to the sawed lowermost sides of the signatures to create an initial bond of the interleaved sheets of the signatures. The preparatory adhesive is cured until it is substantially free of surface moisture. After applying and curing the preparatory adhesive, a notcher forms a multiplicity of closely spaced, wide open notches in the lowermost sides of the signatures.
    Type: Grant
    Filed: April 3, 1995
    Date of Patent: August 6, 1996
    Assignee: R. R. Donnelley & Sons Company
    Inventors: Don E. Detterman, Robert W. Erwin