Patents by Inventor Robert W. Otey

Robert W. Otey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120060889
    Abstract: A thermoelectric module capable of minimizing thermally and physically induced stress includes a pair of substrates having a plurality of electrically conductive contacts disposed on opposing faces, a plurality of P-type and N-type thermoelectric elements interposed between the pair of substrates forming a thermoelectric element circuit, and one or more of a stress minimizing structural element interposed between the pair of substrates where the stress minimizing structural element has a first surface fixed to one of the pair of substrates and a second surface fixed to the other of the pair of substrates in locations between the pair of substrates that minimize the effects of physical and thermal stresses on the plurality of P-type and N-type thermoelectric elements.
    Type: Application
    Filed: September 13, 2011
    Publication date: March 15, 2012
    Applicant: FERROTEC (USA) CORPORATION
    Inventors: Robert W. Otey, David A. Kaminski
  • Publication number: 20090038317
    Abstract: A Thermoelectric-based container holder has a receptacle with a recess for receiving a container to be heated or cooled, a variable interface surface disposed within the holder and configured to flexibly contact an outside surface of the container to be heated or cooled where the variable surface interface is in thermal contact with the surface of the receptacle, and a thermoelectric assembly thermally connected to at least the variable surface interface.
    Type: Application
    Filed: August 6, 2008
    Publication date: February 12, 2009
    Applicant: FERROTEC (USA) CORPORATION
    Inventor: Robert W. Otey
  • Publication number: 20030110779
    Abstract: A combination of a computer and an external heat transfer module to improve the heat removing capability of a computer's internal heat removal system, the combination includes a computer with a thermal interface port connected to the computer's internal heat removal system and a heat transfer module connected to the thermal interface port. The heat transfer module has a heat dissipation component and at least one heat transfer conduit having one end thermally coupled to the computer's internal heat removal system, and the other end thermally coupled to the heat dissipation component.
    Type: Application
    Filed: December 14, 2001
    Publication date: June 19, 2003
    Inventors: Robert W. Otey, Brian D. Rabe
  • Patent number: 6410971
    Abstract: A flexible thermoelectric module having a pair of flexible substrates, a plurality of electrically conductive contacts on one side of each of the flexible substrates, and a plurality of P-type and N-type thermoelectric elements electrically connected between opposing sides of the pair of flexible substrates having the plurality of conductive contacts where the plurality of conductive contacts connect adjacent P-type and N-type elements to each other in series and where each of the P-type and N-type elements has a first end connected to one of the plurality of conductive contacts of one of the substrates and a second end connected to one of the plurality of electrical contacts of the other of the substrates.
    Type: Grant
    Filed: November 29, 2001
    Date of Patent: June 25, 2002
    Assignee: Ferrotec (USA) Corporation
    Inventor: Robert W. Otey